Search

Ha Dinh Ho

Examiner (ID: 9897)

Most Active Art Unit
3681
Art Unit(s)
3658, 3655, 3681, 3618
Total Applications
2226
Issued Applications
1927
Pending Applications
80
Abandoned Applications
198

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 3874848 [patent_doc_number] => 05838070 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-17 [patent_title] => 'Apparatus having a substrate and electronic circuit solder-connected with the substrate' [patent_app_type] => 1 [patent_app_number] => 8/770406 [patent_app_country] => US [patent_app_date] => 1996-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 20 [patent_no_of_words] => 8015 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 168 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/838/05838070.pdf [firstpage_image] =>[orig_patent_app_number] => 770406 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/770406
Apparatus having a substrate and electronic circuit solder-connected with the substrate Dec 19, 1996 Issued
Array ( [id] => 3782266 [patent_doc_number] => 05818101 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-06 [patent_title] => 'Arrangement for the protection of electrical and electronic components against electrostatic discharge' [patent_app_type] => 1 [patent_app_number] => 8/767030 [patent_app_country] => US [patent_app_date] => 1996-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1539 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/818/05818101.pdf [firstpage_image] =>[orig_patent_app_number] => 767030 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/767030
Arrangement for the protection of electrical and electronic components against electrostatic discharge Dec 11, 1996 Issued
Array ( [id] => 3766955 [patent_doc_number] => 05844309 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-01 [patent_title] => 'Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition' [patent_app_type] => 1 [patent_app_number] => 8/754061 [patent_app_country] => US [patent_app_date] => 1996-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 10 [patent_no_of_words] => 36128 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 12 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/844/05844309.pdf [firstpage_image] =>[orig_patent_app_number] => 754061 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/754061
Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition Dec 2, 1996 Issued
Array ( [id] => 3812660 [patent_doc_number] => 05831331 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-03 [patent_title] => 'Self-shielding inductor for multi-layer semiconductor integrated circuits' [patent_app_type] => 1 [patent_app_number] => 8/754346 [patent_app_country] => US [patent_app_date] => 1996-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 4431 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/831/05831331.pdf [firstpage_image] =>[orig_patent_app_number] => 754346 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/754346
Self-shielding inductor for multi-layer semiconductor integrated circuits Nov 21, 1996 Issued
Array ( [id] => 3864958 [patent_doc_number] => 05793098 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-08-11 [patent_title] => 'Package including conductive layers having notches formed' [patent_app_type] => 1 [patent_app_number] => 8/755014 [patent_app_country] => US [patent_app_date] => 1996-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 11 [patent_no_of_words] => 2070 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/793/05793098.pdf [firstpage_image] =>[orig_patent_app_number] => 755014 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/755014
Package including conductive layers having notches formed Nov 21, 1996 Issued
Array ( [id] => 3845311 [patent_doc_number] => 05847448 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-08 [patent_title] => 'Method and device for interconnecting integrated circuits in three dimensions' [patent_app_type] => 1 [patent_app_number] => 8/749660 [patent_app_country] => US [patent_app_date] => 1996-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 2568 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/847/05847448.pdf [firstpage_image] =>[orig_patent_app_number] => 749660 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/749660
Method and device for interconnecting integrated circuits in three dimensions Nov 14, 1996 Issued
Array ( [id] => 3732940 [patent_doc_number] => 05703397 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-12-30 [patent_title] => 'Semiconductor package having an aluminum nitride substrate' [patent_app_type] => 1 [patent_app_number] => 8/745367 [patent_app_country] => US [patent_app_date] => 1996-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 18 [patent_no_of_words] => 11266 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/703/05703397.pdf [firstpage_image] =>[orig_patent_app_number] => 745367 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/745367
Semiconductor package having an aluminum nitride substrate Nov 7, 1996 Issued
Array ( [id] => 3933394 [patent_doc_number] => 05877553 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-03-02 [patent_title] => 'Metallic electronic component packaging arrangement' [patent_app_type] => 1 [patent_app_number] => 8/739662 [patent_app_country] => US [patent_app_date] => 1996-10-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3595 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/877/05877553.pdf [firstpage_image] =>[orig_patent_app_number] => 739662 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/739662
Metallic electronic component packaging arrangement Oct 30, 1996 Issued
Array ( [id] => 3750927 [patent_doc_number] => 05717253 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-02-10 [patent_title] => 'Structure for forming an improved quality silicidation layer' [patent_app_type] => 1 [patent_app_number] => 8/736490 [patent_app_country] => US [patent_app_date] => 1996-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 11 [patent_no_of_words] => 1849 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/717/05717253.pdf [firstpage_image] =>[orig_patent_app_number] => 736490 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/736490
Structure for forming an improved quality silicidation layer Oct 23, 1996 Issued
Array ( [id] => 4054555 [patent_doc_number] => 05869901 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-02-09 [patent_title] => 'Semiconductor device having aluminum interconnection and method of manufacturing the same' [patent_app_type] => 1 [patent_app_number] => 8/730598 [patent_app_country] => US [patent_app_date] => 1996-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 37 [patent_no_of_words] => 13004 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/869/05869901.pdf [firstpage_image] =>[orig_patent_app_number] => 730598 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/730598
Semiconductor device having aluminum interconnection and method of manufacturing the same Oct 14, 1996 Issued
Array ( [id] => 3692175 [patent_doc_number] => 05691549 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-25 [patent_title] => 'Sidewall strap' [patent_app_type] => 1 [patent_app_number] => 8/720991 [patent_app_country] => US [patent_app_date] => 1996-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 9 [patent_no_of_words] => 3532 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 101 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/691/05691549.pdf [firstpage_image] =>[orig_patent_app_number] => 720991 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/720991
Sidewall strap Oct 14, 1996 Issued
Array ( [id] => 3880340 [patent_doc_number] => 05825081 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-20 [patent_title] => 'Tape carrier and assembly structure thereof' [patent_app_type] => 1 [patent_app_number] => 8/729420 [patent_app_country] => US [patent_app_date] => 1996-10-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 13 [patent_no_of_words] => 4644 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/825/05825081.pdf [firstpage_image] =>[orig_patent_app_number] => 729420 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/729420
Tape carrier and assembly structure thereof Oct 10, 1996 Issued
Array ( [id] => 3904016 [patent_doc_number] => 05751057 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-12 [patent_title] => 'Lead on chip lead frame design without jumpover wiring' [patent_app_type] => 1 [patent_app_number] => 8/728534 [patent_app_country] => US [patent_app_date] => 1996-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2847 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/751/05751057.pdf [firstpage_image] =>[orig_patent_app_number] => 728534 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/728534
Lead on chip lead frame design without jumpover wiring Oct 8, 1996 Issued
Array ( [id] => 3794626 [patent_doc_number] => 05841178 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-11-24 [patent_title] => 'Optical component package' [patent_app_type] => 1 [patent_app_number] => 8/720888 [patent_app_country] => US [patent_app_date] => 1996-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 1702 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/841/05841178.pdf [firstpage_image] =>[orig_patent_app_number] => 720888 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/720888
Optical component package Oct 3, 1996 Issued
08/720430 SEMICONDUCTOR DEVICE Sep 29, 1996 Abandoned
Array ( [id] => 3880450 [patent_doc_number] => 05825089 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-20 [patent_title] => 'Low thermal resistance spring biased RF semiconductor package mounting structure' [patent_app_type] => 1 [patent_app_number] => 8/722698 [patent_app_country] => US [patent_app_date] => 1996-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 1836 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/825/05825089.pdf [firstpage_image] =>[orig_patent_app_number] => 722698 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/722698
Low thermal resistance spring biased RF semiconductor package mounting structure Sep 29, 1996 Issued
08/720262 ELECTRICALLY CONDUCTIVE THERMAL INTERFACE Sep 25, 1996 Abandoned
Array ( [id] => 3692492 [patent_doc_number] => 05691570 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-25 [patent_title] => 'Integrated circuits having patterns of mirror images and packages incorporating the same' [patent_app_type] => 1 [patent_app_number] => 8/719336 [patent_app_country] => US [patent_app_date] => 1996-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 25 [patent_no_of_words] => 5645 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/691/05691570.pdf [firstpage_image] =>[orig_patent_app_number] => 719336 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/719336
Integrated circuits having patterns of mirror images and packages incorporating the same Sep 24, 1996 Issued
Array ( [id] => 3766749 [patent_doc_number] => 05852327 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-12-22 [patent_title] => 'Semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/709592 [patent_app_country] => US [patent_app_date] => 1996-09-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 58 [patent_no_of_words] => 10813 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/852/05852327.pdf [firstpage_image] =>[orig_patent_app_number] => 709592 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/709592
Semiconductor device Sep 8, 1996 Issued
Array ( [id] => 3818234 [patent_doc_number] => 05710459 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-01-20 [patent_title] => 'Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability' [patent_app_type] => 1 [patent_app_number] => 8/689534 [patent_app_country] => US [patent_app_date] => 1996-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2602 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/710/05710459.pdf [firstpage_image] =>[orig_patent_app_number] => 689534 [rel_patent_id] =>[rel_patent_doc_number] =>)
08/689534
Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability Aug 8, 1996 Issued
Menu