Application number | Title of the application | Filing Date | Status |
---|
Array
(
[id] => 2750607
[patent_doc_number] => 05028987
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-07-02
[patent_title] => 'High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip'
[patent_app_type] => 1
[patent_app_number] => 7/375569
[patent_app_country] => US
[patent_app_date] => 1989-07-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 14
[patent_no_of_words] => 3991
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 46
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/028/05028987.pdf
[firstpage_image] =>[orig_patent_app_number] => 375569
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/375569 | High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip | Jul 2, 1989 | Issued |
Array
(
[id] => 2676256
[patent_doc_number] => 04954878
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-09-04
[patent_title] => 'Method of packaging and powering integrated circuit chips and the chip assembly formed thereby'
[patent_app_type] => 1
[patent_app_number] => 7/373960
[patent_app_country] => US
[patent_app_date] => 1989-06-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 7
[patent_no_of_words] => 3091
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 192
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/954/04954878.pdf
[firstpage_image] =>[orig_patent_app_number] => 373960
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/373960 | Method of packaging and powering integrated circuit chips and the chip assembly formed thereby | Jun 28, 1989 | Issued |
Array
(
[id] => 2752094
[patent_doc_number] => 05023700
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-06-11
[patent_title] => 'Minutely patterned structure'
[patent_app_type] => 1
[patent_app_number] => 7/367257
[patent_app_country] => US
[patent_app_date] => 1989-06-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 28
[patent_no_of_words] => 4399
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 138
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/023/05023700.pdf
[firstpage_image] =>[orig_patent_app_number] => 367257
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/367257 | Minutely patterned structure | Jun 15, 1989 | Issued |
Array
(
[id] => 2651392
[patent_doc_number] => 04971676
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-11-20
[patent_title] => 'Support device for a thin substrate of a semiconductor material'
[patent_app_type] => 1
[patent_app_number] => 7/365861
[patent_app_country] => US
[patent_app_date] => 1989-06-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 4
[patent_no_of_words] => 1790
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 164
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/971/04971676.pdf
[firstpage_image] =>[orig_patent_app_number] => 365861
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/365861 | Support device for a thin substrate of a semiconductor material | Jun 13, 1989 | Issued |
Array
(
[id] => 2638641
[patent_doc_number] => 04958222
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-09-18
[patent_title] => 'Semiconductor integrated circuit device'
[patent_app_type] => 1
[patent_app_number] => 7/363759
[patent_app_country] => US
[patent_app_date] => 1989-06-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 12
[patent_no_of_words] => 3748
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 534
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/958/04958222.pdf
[firstpage_image] =>[orig_patent_app_number] => 363759
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/363759 | Semiconductor integrated circuit device | Jun 8, 1989 | Issued |
Array
(
[id] => 2741005
[patent_doc_number] => 04998159
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-03-05
[patent_title] => 'Ceramic laminated circuit substrate'
[patent_app_type] => 1
[patent_app_number] => 7/362924
[patent_app_country] => US
[patent_app_date] => 1989-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 14
[patent_no_of_words] => 11075
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 56
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/998/04998159.pdf
[firstpage_image] =>[orig_patent_app_number] => 362924
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/362924 | Ceramic laminated circuit substrate | Jun 7, 1989 | Issued |
07/360960 | SUPPLY PIN REARRANGEMENT FOR AN I.C. | Jun 1, 1989 | Abandoned |
07/359239 | POST MOLDED CAVITY PACKAGE WITH INTERNAL DAM BAR FOR INTEGRATED CIRCUIT | May 30, 1989 | Abandoned |
Array
(
[id] => 2633697
[patent_doc_number] => 04967244
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-10-30
[patent_title] => 'Power semiconductor component with switch-off facility'
[patent_app_type] => 1
[patent_app_number] => 7/334567
[patent_app_country] => US
[patent_app_date] => 1989-04-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 3
[patent_no_of_words] => 3108
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 28
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/967/04967244.pdf
[firstpage_image] =>[orig_patent_app_number] => 334567
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/334567 | Power semiconductor component with switch-off facility | Apr 6, 1989 | Issued |
Array
(
[id] => 2596433
[patent_doc_number] => 04970572
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-11-13
[patent_title] => 'Semiconductor integrated circuit device of multilayer interconnection structure'
[patent_app_type] => 1
[patent_app_number] => 7/318791
[patent_app_country] => US
[patent_app_date] => 1989-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 8
[patent_no_of_words] => 3302
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 180
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/970/04970572.pdf
[firstpage_image] =>[orig_patent_app_number] => 318791
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/318791 | Semiconductor integrated circuit device of multilayer interconnection structure | Mar 2, 1989 | Issued |
Array
(
[id] => 2700647
[patent_doc_number] => 05019891
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-05-28
[patent_title] => 'Semiconductor device and method of fabricating the same'
[patent_app_type] => 1
[patent_app_number] => 7/296003
[patent_app_country] => US
[patent_app_date] => 1989-01-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 31
[patent_no_of_words] => 7203
[patent_no_of_claims] => 39
[patent_no_of_ind_claims] => 19
[patent_words_short_claim] => 51
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/019/05019891.pdf
[firstpage_image] =>[orig_patent_app_number] => 296003
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/296003 | Semiconductor device and method of fabricating the same | Jan 11, 1989 | Issued |
Array
(
[id] => 2754633
[patent_doc_number] => 05016089
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-05-14
[patent_title] => 'Substrate for hybrid IC, hybrid IC using the substrate and its applications'
[patent_app_type] => 1
[patent_app_number] => 7/293443
[patent_app_country] => US
[patent_app_date] => 1989-01-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 5463
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 72
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/016/05016089.pdf
[firstpage_image] =>[orig_patent_app_number] => 293443
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/293443 | Substrate for hybrid IC, hybrid IC using the substrate and its applications | Jan 3, 1989 | Issued |
Array
(
[id] => 2599903
[patent_doc_number] => 04918512
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-04-17
[patent_title] => 'Semiconductor package having an outwardly arced die cavity'
[patent_app_type] => 1
[patent_app_number] => 7/286676
[patent_app_country] => US
[patent_app_date] => 1988-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 2
[patent_no_of_words] => 999
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 38
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/918/04918512.pdf
[firstpage_image] =>[orig_patent_app_number] => 286676
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/286676 | Semiconductor package having an outwardly arced die cavity | Dec 18, 1988 | Issued |
Array
(
[id] => 2687164
[patent_doc_number] => 05005070
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-04-02
[patent_title] => 'Soldering interconnect method and apparatus for semiconductor packages'
[patent_app_type] => 1
[patent_app_number] => 7/285988
[patent_app_country] => US
[patent_app_date] => 1988-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 6
[patent_no_of_words] => 3979
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 110
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/005/05005070.pdf
[firstpage_image] =>[orig_patent_app_number] => 285988
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/285988 | Soldering interconnect method and apparatus for semiconductor packages | Dec 18, 1988 | Issued |
07/281016 | TAPE AUTOMATED BONDING PROCESS AND LEAD PACKAGE AND REUSABLE TRANSPORT TAPE FOR USE THEREWITH | Dec 6, 1988 | Abandoned |
Array
(
[id] => 2714294
[patent_doc_number] => 05014111
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-05-07
[patent_title] => 'Electrical contact bump and a package provided with the same'
[patent_app_type] => 1
[patent_app_number] => 7/279101
[patent_app_country] => US
[patent_app_date] => 1988-12-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 15
[patent_no_of_words] => 4229
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 98
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/014/05014111.pdf
[firstpage_image] =>[orig_patent_app_number] => 279101
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/279101 | Electrical contact bump and a package provided with the same | Dec 1, 1988 | Issued |
Array
(
[id] => 2653450
[patent_doc_number] => 04980753
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-12-25
[patent_title] => 'Low-cost high-performance semiconductor chip package'
[patent_app_type] => 1
[patent_app_number] => 7/274290
[patent_app_country] => US
[patent_app_date] => 1988-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 27
[patent_no_of_words] => 12391
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 175
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/980/04980753.pdf
[firstpage_image] =>[orig_patent_app_number] => 274290
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/274290 | Low-cost high-performance semiconductor chip package | Nov 20, 1988 | Issued |
Array
(
[id] => 2638850
[patent_doc_number] => 04977444
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-12-11
[patent_title] => 'Semiconductor cooling apparatus'
[patent_app_type] => 1
[patent_app_number] => 7/261639
[patent_app_country] => US
[patent_app_date] => 1988-10-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 33
[patent_no_of_words] => 17438
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 169
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/977/04977444.pdf
[firstpage_image] =>[orig_patent_app_number] => 261639
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/261639 | Semiconductor cooling apparatus | Oct 23, 1988 | Issued |
07/224412 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE IN WHICH INTEGRATED CIRCUIT UNITS HAVING DIFFERENT FUNCTIONS ARE STACKED IN THREE-DIMENSIONAL MANNER | Jul 25, 1988 | Abandoned |
Array
(
[id] => 2649953
[patent_doc_number] => 04939570
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-07-03
[patent_title] => 'High power, pluggable tape automated bonding package'
[patent_app_type] => 1
[patent_app_number] => 7/223580
[patent_app_country] => US
[patent_app_date] => 1988-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 2019
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 187
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/939/04939570.pdf
[firstpage_image] =>[orig_patent_app_number] => 223580
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/223580 | High power, pluggable tape automated bonding package | Jul 24, 1988 | Issued |