Ha Dinh Ho
Examiner (ID: 9897)
Most Active Art Unit | 3681 |
Art Unit(s) | 3658, 3655, 3681, 3618 |
Total Applications | 2226 |
Issued Applications | 1927 |
Pending Applications | 80 |
Abandoned Applications | 198 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 3750899
[patent_doc_number] => 05717251
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-02-10
[patent_title] => 'Semiconductor integrated circuit device having minature multi-level wiring structure low in parasitic capacitance'
[patent_app_type] => 1
[patent_app_number] => 8/689088
[patent_app_country] => US
[patent_app_date] => 1996-08-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 49
[patent_no_of_words] => 10613
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 167
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/717/05717251.pdf
[firstpage_image] =>[orig_patent_app_number] => 689088
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/689088 | Semiconductor integrated circuit device having minature multi-level wiring structure low in parasitic capacitance | Aug 4, 1996 | Issued |
Array
(
[id] => 3668855
[patent_doc_number] => 05668399
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-16
[patent_title] => 'Semiconductor device with increased on chip decoupling capacitance'
[patent_app_type] => 1
[patent_app_number] => 8/691626
[patent_app_country] => US
[patent_app_date] => 1996-08-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 21
[patent_no_of_words] => 2916
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 123
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/668/05668399.pdf
[firstpage_image] =>[orig_patent_app_number] => 691626
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/691626 | Semiconductor device with increased on chip decoupling capacitance | Aug 1, 1996 | Issued |
Array
(
[id] => 3699464
[patent_doc_number] => 05619070
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-04-08
[patent_title] => 'Semiconductor device which radiates heat and applies substrate potential from rear surface of semiconductor chip'
[patent_app_type] => 1
[patent_app_number] => 8/688823
[patent_app_country] => US
[patent_app_date] => 1996-07-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 2812
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 204
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/619/05619070.pdf
[firstpage_image] =>[orig_patent_app_number] => 688823
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/688823 | Semiconductor device which radiates heat and applies substrate potential from rear surface of semiconductor chip | Jul 30, 1996 | Issued |
Array
(
[id] => 3812784
[patent_doc_number] => 05831338
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-11-03
[patent_title] => 'Power MOSFET and method of preparing the same'
[patent_app_type] => 1
[patent_app_number] => 8/681554
[patent_app_country] => US
[patent_app_date] => 1996-07-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 16
[patent_no_of_words] => 2058
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/831/05831338.pdf
[firstpage_image] =>[orig_patent_app_number] => 681554
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/681554 | Power MOSFET and method of preparing the same | Jul 22, 1996 | Issued |
Array
(
[id] => 3652971
[patent_doc_number] => 05684328
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-11-04
[patent_title] => 'Semiconductor chip package using improved tape mounting'
[patent_app_type] => 1
[patent_app_number] => 8/684989
[patent_app_country] => US
[patent_app_date] => 1996-07-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 12
[patent_no_of_words] => 2177
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 128
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/684/05684328.pdf
[firstpage_image] =>[orig_patent_app_number] => 684989
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/684989 | Semiconductor chip package using improved tape mounting | Jul 21, 1996 | Issued |
Array
(
[id] => 3882886
[patent_doc_number] => 05747876
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-05
[patent_title] => 'Semiconductor device and semiconductor module'
[patent_app_type] => 1
[patent_app_number] => 8/680614
[patent_app_country] => US
[patent_app_date] => 1996-07-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 15
[patent_no_of_words] => 6652
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 167
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/747/05747876.pdf
[firstpage_image] =>[orig_patent_app_number] => 680614
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/680614 | Semiconductor device and semiconductor module | Jul 15, 1996 | Issued |
08/671794 | THERMAL GREASE INSERTION AND RETENTION | Jun 23, 1996 | Abandoned |
Array
(
[id] => 3788756
[patent_doc_number] => 05821612
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-10-13
[patent_title] => 'Heat radiative electronic component'
[patent_app_type] => 1
[patent_app_number] => 8/666892
[patent_app_country] => US
[patent_app_date] => 1996-06-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 10
[patent_no_of_words] => 2130
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/821/05821612.pdf
[firstpage_image] =>[orig_patent_app_number] => 666892
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/666892 | Heat radiative electronic component | Jun 17, 1996 | Issued |
Array
(
[id] => 3837152
[patent_doc_number] => 05814878
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-09-29
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/664498
[patent_app_country] => US
[patent_app_date] => 1996-06-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 14
[patent_no_of_words] => 5831
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 179
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/814/05814878.pdf
[firstpage_image] =>[orig_patent_app_number] => 664498
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/664498 | Semiconductor device | Jun 16, 1996 | Issued |
Array
(
[id] => 3857764
[patent_doc_number] => 05767570
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-16
[patent_title] => 'Semiconductor packages for high I/O semiconductor dies'
[patent_app_type] => 1
[patent_app_number] => 8/662658
[patent_app_country] => US
[patent_app_date] => 1996-06-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 8
[patent_no_of_words] => 5164
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 267
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/767/05767570.pdf
[firstpage_image] =>[orig_patent_app_number] => 662658
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/662658 | Semiconductor packages for high I/O semiconductor dies | Jun 13, 1996 | Issued |
Array
(
[id] => 3837364
[patent_doc_number] => 05814892
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-09-29
[patent_title] => 'Semiconductor die with staggered bond pads'
[patent_app_type] => 1
[patent_app_number] => 8/660490
[patent_app_country] => US
[patent_app_date] => 1996-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 12
[patent_no_of_words] => 3321
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 176
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/814/05814892.pdf
[firstpage_image] =>[orig_patent_app_number] => 660490
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/660490 | Semiconductor die with staggered bond pads | Jun 6, 1996 | Issued |
Array
(
[id] => 3812713
[patent_doc_number] => 05831333
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-11-03
[patent_title] => 'Integrated junction temperature sensor/package design and method of implementing same'
[patent_app_type] => 1
[patent_app_number] => 8/645998
[patent_app_country] => US
[patent_app_date] => 1996-05-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2390
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 133
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/831/05831333.pdf
[firstpage_image] =>[orig_patent_app_number] => 645998
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/645998 | Integrated junction temperature sensor/package design and method of implementing same | May 13, 1996 | Issued |
08/644928 | HEAT SINK | May 12, 1996 | Abandoned |
Array
(
[id] => 3799790
[patent_doc_number] => 05780924
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-07-14
[patent_title] => 'Integrated circuit underfill reservoir'
[patent_app_type] => 1
[patent_app_number] => 8/644000
[patent_app_country] => US
[patent_app_date] => 1996-05-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 6
[patent_no_of_words] => 2051
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 148
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/780/05780924.pdf
[firstpage_image] =>[orig_patent_app_number] => 644000
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/644000 | Integrated circuit underfill reservoir | May 6, 1996 | Issued |
Array
(
[id] => 3857807
[patent_doc_number] => 05767573
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-16
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/633456
[patent_app_country] => US
[patent_app_date] => 1996-04-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 15
[patent_no_of_words] => 8463
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 25
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/767/05767573.pdf
[firstpage_image] =>[orig_patent_app_number] => 633456
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/633456 | Semiconductor device | Apr 16, 1996 | Issued |
Array
(
[id] => 3668978
[patent_doc_number] => 05668408
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1997-09-16
[patent_title] => 'Pin grid array solution for microwave multi-chip modules'
[patent_app_type] => 1
[patent_app_number] => 8/629949
[patent_app_country] => US
[patent_app_date] => 1996-04-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 1187
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 108
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/668/05668408.pdf
[firstpage_image] =>[orig_patent_app_number] => 629949
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/629949 | Pin grid array solution for microwave multi-chip modules | Apr 11, 1996 | Issued |
Array
(
[id] => 3776252
[patent_doc_number] => 05773886
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-06-30
[patent_title] => 'System having stackable heat sink structures'
[patent_app_type] => 1
[patent_app_number] => 8/634336
[patent_app_country] => US
[patent_app_date] => 1996-04-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 19
[patent_no_of_words] => 7903
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 118
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/773/05773886.pdf
[firstpage_image] =>[orig_patent_app_number] => 634336
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/634336 | System having stackable heat sink structures | Apr 11, 1996 | Issued |
Array
(
[id] => 3780551
[patent_doc_number] => 05757075
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-26
[patent_title] => 'Semiconductor heat sink apparatus'
[patent_app_type] => 1
[patent_app_number] => 8/630582
[patent_app_country] => US
[patent_app_date] => 1996-04-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 14
[patent_no_of_words] => 5049
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 217
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/757/05757075.pdf
[firstpage_image] =>[orig_patent_app_number] => 630582
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/630582 | Semiconductor heat sink apparatus | Apr 10, 1996 | Issued |
Array
(
[id] => 3836047
[patent_doc_number] => 05739588
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-04-14
[patent_title] => 'Semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/624496
[patent_app_country] => US
[patent_app_date] => 1996-04-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 3998
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 155
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/739/05739588.pdf
[firstpage_image] =>[orig_patent_app_number] => 624496
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/624496 | Semiconductor device | Apr 4, 1996 | Issued |
Array
(
[id] => 3837391
[patent_doc_number] => 05814894
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-09-29
[patent_title] => 'Semiconductor device, production method thereof, and tape carrier for semiconductor device used for producing the semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/627996
[patent_app_country] => US
[patent_app_date] => 1996-04-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 40
[patent_no_of_words] => 18611
[patent_no_of_claims] => 28
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 207
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/814/05814894.pdf
[firstpage_image] =>[orig_patent_app_number] => 627996
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/627996 | Semiconductor device, production method thereof, and tape carrier for semiconductor device used for producing the semiconductor device | Apr 3, 1996 | Issued |