Ha Dinh Ho

Array ( [id] => 3692480 [patent_doc_number] => 05691569 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-25 [patent_title] => 'Integrated circuit package that has a plurality of staggered pins' [patent_app_type] => 1 [patent_app_number] => 8/575498 [patent_app_country] => US [patent_app_date] => 1995-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 1228 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/691/05691569.pdf [firstpage_image] =>[orig_patent_app_number] => 575498 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3626217 [patent_doc_number] => 05689135 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-18 [patent_title] => 'Multi-chip device and method of fabrication employing leads over and under processes' [patent_app_type] => 1 [patent_app_number] => 8/574994 [patent_app_country] => US [patent_app_date] => 1995-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 3264 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 305 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/689/05689135.pdf [firstpage_image] =>[orig_patent_app_number] => 574994 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3845803 [patent_doc_number] => 05744869 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-04-28 [patent_title] => 'Apparatus for mounting a flip-chip semiconductor device' [patent_app_type] => 1 [patent_app_number] => 8/567518 [patent_app_country] => US [patent_app_date] => 1995-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 1909 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/744/05744869.pdf [firstpage_image] =>[orig_patent_app_number] => 567518 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3652996 [patent_doc_number] => 05684330 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-04 [patent_title] => 'Chip-sized package having metal circuit substrate' [patent_app_type] => 1 [patent_app_number] => 8/563402 [patent_app_country] => US [patent_app_date] => 1995-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 1943 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/684/05684330.pdf [firstpage_image] =>[orig_patent_app_number] => 563402 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3782334 [patent_doc_number] => 05818106 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-10-06 [patent_title] => 'Semiconductor device having a capacitor formed on a surface of a closure' [patent_app_type] => 1 [patent_app_number] => 8/564500 [patent_app_country] => US [patent_app_date] => 1995-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 3351 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/818/05818106.pdf [firstpage_image] =>[orig_patent_app_number] => 564500 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3987587 [patent_doc_number] => 05861654 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-01-19 [patent_title] => 'Image sensor assembly' [patent_app_type] => 1 [patent_app_number] => 8/563832 [patent_app_country] => US [patent_app_date] => 1995-11-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 2453 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/861/05861654.pdf [firstpage_image] =>[orig_patent_app_number] => 563832 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3835971 [patent_doc_number] => 05739582 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-04-14 [patent_title] => 'Method of packaging a high voltage device array in a multi-chip module' [patent_app_type] => 1 [patent_app_number] => 8/562614 [patent_app_country] => US [patent_app_date] => 1995-11-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 1758 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/739/05739582.pdf [firstpage_image] =>[orig_patent_app_number] => 562614 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3835956 [patent_doc_number] => 05739581 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-04-14 [patent_title] => 'High density integrated circuit package assembly with a heatsink between stacked dies' [patent_app_type] => 1 [patent_app_number] => 8/560280 [patent_app_country] => US [patent_app_date] => 1995-11-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 3166 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/739/05739581.pdf [firstpage_image] =>[orig_patent_app_number] => 560280 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3698669 [patent_doc_number] => 05661337 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-08-26 [patent_title] => 'Technique for improving bonding strength of leadframe to substrate in semiconductor IC chip packages' [patent_app_type] => 1 [patent_app_number] => 8/553214 [patent_app_country] => US [patent_app_date] => 1995-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 3562 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/661/05661337.pdf [firstpage_image] =>[orig_patent_app_number] => 553214 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3698735 [patent_doc_number] => 05661342 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-08-26 [patent_title] => 'Semiconductor device with heat sink including positioning pins' [patent_app_type] => 1 [patent_app_number] => 8/552770 [patent_app_country] => US [patent_app_date] => 1995-11-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 2880 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/661/05661342.pdf [firstpage_image] =>[orig_patent_app_number] => 552770 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3710863 [patent_doc_number] => 05654587 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-08-05 [patent_title] => 'Stackable heatsink structure for semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 8/547277 [patent_app_country] => US [patent_app_date] => 1995-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 4355 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/654/05654587.pdf [firstpage_image] =>[orig_patent_app_number] => 547277 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3736322 [patent_doc_number] => 05693981 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-12-02 [patent_title] => 'Electronic system with heat dissipating apparatus and method of dissipating heat in an electronic system' [patent_app_type] => 1 [patent_app_number] => 8/544284 [patent_app_country] => US [patent_app_date] => 1995-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 7031 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/693/05693981.pdf [firstpage_image] =>[orig_patent_app_number] => 544284 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3626245 [patent_doc_number] => 05689137 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-18 [patent_title] => 'Method for transfer molding standard electronic packages and apparatus formed thereby' [patent_app_type] => 1 [patent_app_number] => 8/543762 [patent_app_country] => US [patent_app_date] => 1995-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 18 [patent_no_of_words] => 4754 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/689/05689137.pdf [firstpage_image] =>[orig_patent_app_number] => 543762 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3534387 [patent_doc_number] => 05583373 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-12-10 [patent_title] => 'Apparatus for achieving mechanical and thermal isolation of portions of integrated monolithic circuits' [patent_app_type] => 1 [patent_app_number] => 8/541258 [patent_app_country] => US [patent_app_date] => 1995-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 3842 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 221 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/583/05583373.pdf [firstpage_image] =>[orig_patent_app_number] => 541258 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3666850 [patent_doc_number] => 05625229 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-04-29 [patent_title] => 'Heat sink fin assembly for cooling an LSI package' [patent_app_type] => 1 [patent_app_number] => 8/538232 [patent_app_country] => US [patent_app_date] => 1995-10-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 43 [patent_no_of_words] => 10867 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 12 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/625/05625229.pdf [firstpage_image] =>[orig_patent_app_number] => 538232 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3633361 [patent_doc_number] => 05686759 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-11-11 [patent_title] => 'Integrated circuit package with permanent identification of device characteristics and method for adding the same' [patent_app_type] => 1 [patent_app_number] => 8/536353 [patent_app_country] => US [patent_app_date] => 1995-09-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 1897 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/686/05686759.pdf [firstpage_image] =>[orig_patent_app_number] => 536353 [rel_patent_id] =>[rel_patent_doc_number] =>)