Application number | Title of the application | Filing Date | Status |
---|
08/536878 | LEADFRAME HAVING SECURED OUTER LEADS, SEMICONDUCTOR DEVICE USING THE LEADFRAME AND METHOD OF MAKING THEM | Sep 28, 1995 | Abandoned |
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08/526254 | LEAD ON CHIP LEADFRAME DESIGN WITHOUT JUMP OVER WIRING | Sep 10, 1995 | Abandoned |
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Array
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Array
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08/514349 | ELECTRICALLY CONDUCTIVE THERMAL INTERFACE | Aug 3, 1995 | Abandoned |
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Array
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Array
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Array
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08/471666 | METHOD AND WORKPIECE FOR CONNECTING A THIN LAYER TO A MONOLITHIC ELECTRONIC MODULE'S SURFACE AND ASSOCIATED MODULE PACKAGING | Jun 5, 1995 | Abandoned |