Harshad R. Patel

Array ( [id] => 2959573 [patent_doc_number] => 05243223 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-09-07 [patent_title] => 'Semiconductor device having housing with a gelled filler and an internal pressure absorbing chamber' [patent_app_type] => 1 [patent_app_number] => 7/827611 [patent_app_country] => US [patent_app_date] => 1992-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 3783 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 216 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/243/05243223.pdf [firstpage_image] =>[orig_patent_app_number] => 827611 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2981114 [patent_doc_number] => 05256899 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-10-26 [patent_title] => 'Integrated circuit fuse link having an exothermic charge adjacent the fuse portion' [patent_app_type] => 1 [patent_app_number] => 7/813176 [patent_app_country] => US [patent_app_date] => 1991-12-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 1210 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/256/05256899.pdf [firstpage_image] =>[orig_patent_app_number] => 813176 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2905105 [patent_doc_number] => 05218234 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-06-08 [patent_title] => 'Semiconductor device with controlled spread polymeric underfill' [patent_app_type] => 1 [patent_app_number] => 7/811841 [patent_app_country] => US [patent_app_date] => 1991-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 2115 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/218/05218234.pdf [firstpage_image] =>[orig_patent_app_number] => 811841 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3054884 [patent_doc_number] => 05283459 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-02-01 [patent_title] => 'Semiconductor sensor including an aperture having a funnel shaped section intersecting a second section' [patent_app_type] => 1 [patent_app_number] => 7/812848 [patent_app_country] => US [patent_app_date] => 1991-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 13 [patent_no_of_words] => 1922 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/283/05283459.pdf [firstpage_image] =>[orig_patent_app_number] => 812848 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3016698 [patent_doc_number] => 05332913 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1994-07-26 [patent_title] => 'Buried interconnect structure for semiconductor devices' [patent_app_type] => 1 [patent_app_number] => 7/811453 [patent_app_country] => US [patent_app_date] => 1991-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 15 [patent_no_of_words] => 3825 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 188 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/332/05332913.pdf [firstpage_image] =>[orig_patent_app_number] => 811453 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 2838800 [patent_doc_number] => 05175611 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-12-29 [patent_title] => 'Microwave integrated circuit package to eliminate alumina substrate cracking' [patent_app_type] => 1 [patent_app_number] => 7/809699 [patent_app_country] => US [patent_app_date] => 1991-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 12 [patent_no_of_words] => 3695 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/175/05175611.pdf [firstpage_image] =>[orig_patent_app_number] => 809699 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3523941 [patent_doc_number] => 05530270 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-06-25 [patent_title] => 'Substrate for semiconductr device' [patent_app_type] => 1 [patent_app_number] => 7/799247 [patent_app_country] => US [patent_app_date] => 1991-11-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 1844 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/530/05530270.pdf [firstpage_image] =>[orig_patent_app_number] => 799247 [rel_patent_id] =>[rel_patent_doc_number] =>)