Search

Harshad R. Patel

Examiner (ID: 15196, Phone: (571)272-2187 , Office: P/2855 )

Most Active Art Unit
2855
Art Unit(s)
2856, 2616, 2855, 2214
Total Applications
2413
Issued Applications
2077
Pending Applications
97
Abandoned Applications
245

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 2845360 [patent_doc_number] => 05161000 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-11-03 [patent_title] => 'High-frequency thick-film semiconductor circuit' [patent_app_type] => 1 [patent_app_number] => 7/643099 [patent_app_country] => US [patent_app_date] => 1991-01-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 8 [patent_no_of_words] => 1532 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 279 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/161/05161000.pdf [firstpage_image] =>[orig_patent_app_number] => 643099 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/643099
High-frequency thick-film semiconductor circuit Jan 21, 1991 Issued
Array ( [id] => 2782828 [patent_doc_number] => 05132779 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-07-21 [patent_title] => 'Housing for semiconductor device with occlusion gas removed' [patent_app_type] => 1 [patent_app_number] => 7/641499 [patent_app_country] => US [patent_app_date] => 1991-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 18 [patent_no_of_words] => 4114 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/132/05132779.pdf [firstpage_image] =>[orig_patent_app_number] => 641499 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/641499
Housing for semiconductor device with occlusion gas removed Jan 14, 1991 Issued
07/638487 ELECTRONIC PACKAGING SHAPED BEAM LEAD FABRICATION Jan 3, 1991 Abandoned
Array ( [id] => 2756330 [patent_doc_number] => 05031028 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-07-09 [patent_title] => 'Heat sink assembly' [patent_app_type] => 1 [patent_app_number] => 7/633154 [patent_app_country] => US [patent_app_date] => 1990-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3734 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/031/05031028.pdf [firstpage_image] =>[orig_patent_app_number] => 633154 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/633154
Heat sink assembly Dec 20, 1990 Issued
Array ( [id] => 3596129 [patent_doc_number] => 05521425 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-05-28 [patent_title] => 'Tape automated bonded (TAB) circuit' [patent_app_type] => 1 [patent_app_number] => 7/633591 [patent_app_country] => US [patent_app_date] => 1990-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 4 [patent_no_of_words] => 3079 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 258 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/521/05521425.pdf [firstpage_image] =>[orig_patent_app_number] => 633591 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/633591
Tape automated bonded (TAB) circuit Dec 20, 1990 Issued
Array ( [id] => 2904763 [patent_doc_number] => 05218215 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-06-08 [patent_title] => 'Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path' [patent_app_type] => 1 [patent_app_number] => 7/630113 [patent_app_country] => US [patent_app_date] => 1990-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 4297 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 209 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/218/05218215.pdf [firstpage_image] =>[orig_patent_app_number] => 630113 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/630113
Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path Dec 18, 1990 Issued
07/627413 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Dec 13, 1990 Abandoned
Array ( [id] => 2862377 [patent_doc_number] => 05113241 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-05-12 [patent_title] => 'Semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles' [patent_app_type] => 1 [patent_app_number] => 7/627573 [patent_app_country] => US [patent_app_date] => 1990-12-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 3 [patent_no_of_words] => 2179 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/113/05113241.pdf [firstpage_image] =>[orig_patent_app_number] => 627573 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/627573
Semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles Dec 13, 1990 Issued
07/625410 SEMICONDUCTOR LEAD FRAME Dec 10, 1990 Abandoned
Array ( [id] => 2964047 [patent_doc_number] => 05198695 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-03-30 [patent_title] => 'Semiconductor wafer with circuits bonded to a substrate' [patent_app_type] => 1 [patent_app_number] => 7/624783 [patent_app_country] => US [patent_app_date] => 1990-12-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2516 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/198/05198695.pdf [firstpage_image] =>[orig_patent_app_number] => 624783 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/624783
Semiconductor wafer with circuits bonded to a substrate Dec 9, 1990 Issued
07/622284 SEMICONDUCTOR DEVICE HAVING PIN PHOTODIODES Dec 6, 1990 Abandoned
Array ( [id] => 2811849 [patent_doc_number] => 05115300 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-05-19 [patent_title] => 'High-power semiconductor device' [patent_app_type] => 1 [patent_app_number] => 7/622591 [patent_app_country] => US [patent_app_date] => 1990-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 2359 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/115/05115300.pdf [firstpage_image] =>[orig_patent_app_number] => 622591 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/622591
High-power semiconductor device Dec 4, 1990 Issued
07/622059 SEMICONDUCTOR DEVICE HAVING A PAD ARRAY CARRIER PACKAGE Dec 3, 1990 Abandoned
07/620871 SEMICONDUCTOR PACKAGE HAVING ISOLATED HEATSINK BONDING PADS Dec 2, 1990 Abandoned
Array ( [id] => 2741251 [patent_doc_number] => 05051813 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-09-24 [patent_title] => 'Plastic-packaged semiconductor device having lead support and alignment structure' [patent_app_type] => 1 [patent_app_number] => 7/619108 [patent_app_country] => US [patent_app_date] => 1990-11-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 2371 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/051/05051813.pdf [firstpage_image] =>[orig_patent_app_number] => 619108 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/619108
Plastic-packaged semiconductor device having lead support and alignment structure Nov 26, 1990 Issued
Array ( [id] => 2797466 [patent_doc_number] => 05136363 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-08-04 [patent_title] => 'Semiconductor device with bump electrode' [patent_app_type] => 1 [patent_app_number] => 7/617380 [patent_app_country] => US [patent_app_date] => 1990-11-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 11 [patent_no_of_words] => 2055 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 271 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/136/05136363.pdf [firstpage_image] =>[orig_patent_app_number] => 617380 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/617380
Semiconductor device with bump electrode Nov 25, 1990 Issued
Array ( [id] => 2798434 [patent_doc_number] => 05103291 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-04-07 [patent_title] => 'Hermetically sealed package for electronic components' [patent_app_type] => 1 [patent_app_number] => 7/616665 [patent_app_country] => US [patent_app_date] => 1990-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 3012 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/103/05103291.pdf [firstpage_image] =>[orig_patent_app_number] => 616665 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/616665
Hermetically sealed package for electronic components Nov 20, 1990 Issued
Array ( [id] => 2810330 [patent_doc_number] => 05124782 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-06-23 [patent_title] => 'Integrated circuit package with molded cell' [patent_app_type] => 1 [patent_app_number] => 7/617500 [patent_app_country] => US [patent_app_date] => 1990-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 3021 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/124/05124782.pdf [firstpage_image] =>[orig_patent_app_number] => 617500 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/617500
Integrated circuit package with molded cell Nov 20, 1990 Issued
Array ( [id] => 2857032 [patent_doc_number] => 05105258 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-04-14 [patent_title] => 'Metal system for semiconductor die attach' [patent_app_type] => 1 [patent_app_number] => 7/616970 [patent_app_country] => US [patent_app_date] => 1990-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 1162 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/105/05105258.pdf [firstpage_image] =>[orig_patent_app_number] => 616970 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/616970
Metal system for semiconductor die attach Nov 20, 1990 Issued
07/615869 CHIP CARRIER HAVING IMPROVED THROUGH HOLE CONDUCTORS AND A METHOD OF MANUFACTURING SAME Nov 19, 1990 Abandoned
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