| Application number | Title of the application | Filing Date | Status |
|---|
| 07/614038 | CHIP CARRIER | Nov 14, 1990 | Abandoned |
Array
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Array
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[patent_issue_date] => 1993-02-02
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Array
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[patent_kind] => NA
[patent_issue_date] => 1993-01-19
[patent_title] => 'Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayer'
[patent_app_type] => 1
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Array
(
[id] => 2834230
[patent_doc_number] => 05117281
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-05-26
[patent_title] => 'Semiconductor device having a heat-sink attached thereto'
[patent_app_type] => 1
[patent_app_number] => 7/601415
[patent_app_country] => US
[patent_app_date] => 1990-10-22
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| 07/600306 | INTEGRAL DAM AND HEAT SINK FOR SEMICONDUCTOR DEVICE ASSEMBLY | Oct 18, 1990 | Abandoned |
| 07/588903 | LEADFRAME AND METHOD FOR MANUFACTURING THE SAME | Sep 26, 1990 | Abandoned |
Array
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[id] => 2915871
[patent_doc_number] => 05227661
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-07-13
[patent_title] => 'Integrated circuit device having an aminopropyltriethoxysilane coating'
[patent_app_type] => 1
[patent_app_number] => 7/586821
[patent_app_country] => US
[patent_app_date] => 1990-09-24
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Array
(
[id] => 2862339
[patent_doc_number] => 05113239
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-05-12
[patent_title] => 'Integrated device with improved connections between the pins and the semiconductor material chip'
[patent_app_type] => 1
[patent_app_number] => 7/583271
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[patent_app_date] => 1990-09-17
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| 07/579661 | MODULE-TYPE SEMICONDUCTOR DEVICE OF HIGH POWER CAPACITY | Sep 9, 1990 | Abandoned |
| 07/578986 | SEMICONDUCTOR DEVICE HAVING MULTI-LAYER FILM STRUCTURE AND METHOD OF FORMING CONTACT HOLE IN THE SAME | Sep 6, 1990 | Abandoned |
| 07/578211 | ELECTRON EMITTING SEMICONDUCTOR DEVICE | Sep 5, 1990 | Abandoned |
| 07/577541 | SEMICONDUCTOR DEVICE WITH PACKAGE AND METHOD OF MANUFACTURING THE SAME | Sep 4, 1990 | Abandoned |
| 07/581165 | P-I-N PHOTODIODE WITH TRANSPARENT CONDUCTOR N+ LAYER | Sep 3, 1990 | Abandoned |
Array
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[id] => 2901954
[patent_doc_number] => 05177593
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[patent_issue_date] => 1993-01-05
[patent_title] => 'Display device with LEDs having a reduction of the thermal expansion coefficients among the associated components'
[patent_app_type] => 1
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[rel_patent_id] =>[rel_patent_doc_number] =>) 07/576653 | Display device with LEDs having a reduction of the thermal expansion coefficients among the associated components | Sep 3, 1990 | Issued |
Array
(
[id] => 2781281
[patent_doc_number] => 05075756
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-12-24
[patent_title] => 'Low resistance contacts to semiconductor materials'
[patent_app_type] => 1
[patent_app_number] => 7/576551
[patent_app_country] => US
[patent_app_date] => 1990-08-31
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[firstpage_image] =>[orig_patent_app_number] => 576551
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/576551 | Low resistance contacts to semiconductor materials | Aug 30, 1990 | Issued |
| 07/574415 | STRUCTURE AND METHOD FOR THE FABRICATION OF LPMCM SEMICONDUCTOR PACKAGES | Aug 27, 1990 | Abandoned |
Array
(
[id] => 2828141
[patent_doc_number] => 05168345
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-12-01
[patent_title] => 'Semiconductor device having a universal die size inner lead layout'
[patent_app_type] => 1
[patent_app_number] => 7/568265
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[patent_app_date] => 1990-08-15
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[firstpage_image] =>[orig_patent_app_number] => 568265
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/568265 | Semiconductor device having a universal die size inner lead layout | Aug 14, 1990 | Issued |
| 07/563709 | A MATERIAL FOR LEAD FRAME IN A RESIN PACKAGE | Aug 6, 1990 | Abandoned |
Array
(
[id] => 2803576
[patent_doc_number] => 05144412
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1992-09-01
[patent_title] => 'Process for manufacturing plastic pin grid arrays and the product produced thereby'
[patent_app_type] => 1
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[patent_app_date] => 1990-08-02
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[firstpage_image] =>[orig_patent_app_number] => 562281
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/562281 | Process for manufacturing plastic pin grid arrays and the product produced thereby | Aug 1, 1990 | Issued |