Search

Harshad R. Patel

Examiner (ID: 15196, Phone: (571)272-2187 , Office: P/2855 )

Most Active Art Unit
2855
Art Unit(s)
2856, 2616, 2855, 2214
Total Applications
2413
Issued Applications
2077
Pending Applications
97
Abandoned Applications
245

Applications

Application numberTitle of the applicationFiling DateStatus
07/614038 CHIP CARRIER Nov 14, 1990 Abandoned
Array ( [id] => 2797527 [patent_doc_number] => 05136366 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-08-04 [patent_title] => 'Overmolded semiconductor package with anchoring means' [patent_app_type] => 1 [patent_app_number] => 7/609355 [patent_app_country] => US [patent_app_date] => 1990-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 1874 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/136/05136366.pdf [firstpage_image] =>[orig_patent_app_number] => 609355 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/609355
Overmolded semiconductor package with anchoring means Nov 4, 1990 Issued
Array ( [id] => 2902997 [patent_doc_number] => 05184206 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-02-02 [patent_title] => 'Direct thermocompression bonding for thin electronic power chips' [patent_app_type] => 1 [patent_app_number] => 7/603495 [patent_app_country] => US [patent_app_date] => 1990-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 3054 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/184/05184206.pdf [firstpage_image] =>[orig_patent_app_number] => 603495 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/603495
Direct thermocompression bonding for thin electronic power chips Oct 25, 1990 Issued
Array ( [id] => 2954083 [patent_doc_number] => 05181096 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-01-19 [patent_title] => 'Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayer' [patent_app_type] => 1 [patent_app_number] => 7/604779 [patent_app_country] => US [patent_app_date] => 1990-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 3019 [patent_no_of_claims] => 48 [patent_no_of_ind_claims] => 15 [patent_words_short_claim] => 15 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/181/05181096.pdf [firstpage_image] =>[orig_patent_app_number] => 604779 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/604779
Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayer Oct 25, 1990 Issued
Array ( [id] => 2834230 [patent_doc_number] => 05117281 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-05-26 [patent_title] => 'Semiconductor device having a heat-sink attached thereto' [patent_app_type] => 1 [patent_app_number] => 7/601415 [patent_app_country] => US [patent_app_date] => 1990-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 1868 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 272 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/117/05117281.pdf [firstpage_image] =>[orig_patent_app_number] => 601415 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/601415
Semiconductor device having a heat-sink attached thereto Oct 21, 1990 Issued
07/600306 INTEGRAL DAM AND HEAT SINK FOR SEMICONDUCTOR DEVICE ASSEMBLY Oct 18, 1990 Abandoned
07/588903 LEADFRAME AND METHOD FOR MANUFACTURING THE SAME Sep 26, 1990 Abandoned
Array ( [id] => 2915871 [patent_doc_number] => 05227661 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-07-13 [patent_title] => 'Integrated circuit device having an aminopropyltriethoxysilane coating' [patent_app_type] => 1 [patent_app_number] => 7/586821 [patent_app_country] => US [patent_app_date] => 1990-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 2458 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/227/05227661.pdf [firstpage_image] =>[orig_patent_app_number] => 586821 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/586821
Integrated circuit device having an aminopropyltriethoxysilane coating Sep 23, 1990 Issued
Array ( [id] => 2862339 [patent_doc_number] => 05113239 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-05-12 [patent_title] => 'Integrated device with improved connections between the pins and the semiconductor material chip' [patent_app_type] => 1 [patent_app_number] => 7/583271 [patent_app_country] => US [patent_app_date] => 1990-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 2410 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/113/05113239.pdf [firstpage_image] =>[orig_patent_app_number] => 583271 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/583271
Integrated device with improved connections between the pins and the semiconductor material chip Sep 16, 1990 Issued
07/579661 MODULE-TYPE SEMICONDUCTOR DEVICE OF HIGH POWER CAPACITY Sep 9, 1990 Abandoned
07/578986 SEMICONDUCTOR DEVICE HAVING MULTI-LAYER FILM STRUCTURE AND METHOD OF FORMING CONTACT HOLE IN THE SAME Sep 6, 1990 Abandoned
07/578211 ELECTRON EMITTING SEMICONDUCTOR DEVICE Sep 5, 1990 Abandoned
07/577541 SEMICONDUCTOR DEVICE WITH PACKAGE AND METHOD OF MANUFACTURING THE SAME Sep 4, 1990 Abandoned
07/581165 P-I-N PHOTODIODE WITH TRANSPARENT CONDUCTOR N+ LAYER Sep 3, 1990 Abandoned
Array ( [id] => 2901954 [patent_doc_number] => 05177593 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1993-01-05 [patent_title] => 'Display device with LEDs having a reduction of the thermal expansion coefficients among the associated components' [patent_app_type] => 1 [patent_app_number] => 7/576653 [patent_app_country] => US [patent_app_date] => 1990-09-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 26 [patent_no_of_words] => 3931 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/177/05177593.pdf [firstpage_image] =>[orig_patent_app_number] => 576653 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/576653
Display device with LEDs having a reduction of the thermal expansion coefficients among the associated components Sep 3, 1990 Issued
Array ( [id] => 2781281 [patent_doc_number] => 05075756 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1991-12-24 [patent_title] => 'Low resistance contacts to semiconductor materials' [patent_app_type] => 1 [patent_app_number] => 7/576551 [patent_app_country] => US [patent_app_date] => 1990-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 2 [patent_no_of_words] => 2328 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 42 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/075/05075756.pdf [firstpage_image] =>[orig_patent_app_number] => 576551 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/576551
Low resistance contacts to semiconductor materials Aug 30, 1990 Issued
07/574415 STRUCTURE AND METHOD FOR THE FABRICATION OF LPMCM SEMICONDUCTOR PACKAGES Aug 27, 1990 Abandoned
Array ( [id] => 2828141 [patent_doc_number] => 05168345 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-12-01 [patent_title] => 'Semiconductor device having a universal die size inner lead layout' [patent_app_type] => 1 [patent_app_number] => 7/568265 [patent_app_country] => US [patent_app_date] => 1990-08-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 14 [patent_no_of_words] => 4604 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 243 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/168/05168345.pdf [firstpage_image] =>[orig_patent_app_number] => 568265 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/568265
Semiconductor device having a universal die size inner lead layout Aug 14, 1990 Issued
07/563709 A MATERIAL FOR LEAD FRAME IN A RESIN PACKAGE Aug 6, 1990 Abandoned
Array ( [id] => 2803576 [patent_doc_number] => 05144412 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1992-09-01 [patent_title] => 'Process for manufacturing plastic pin grid arrays and the product produced thereby' [patent_app_type] => 1 [patent_app_number] => 7/562281 [patent_app_country] => US [patent_app_date] => 1990-08-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 40 [patent_no_of_words] => 9932 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/144/05144412.pdf [firstpage_image] =>[orig_patent_app_number] => 562281 [rel_patent_id] =>[rel_patent_doc_number] =>)
07/562281
Process for manufacturing plastic pin grid arrays and the product produced thereby Aug 1, 1990 Issued
Menu