| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 2677085
[patent_doc_number] => 05047831
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-09-10
[patent_title] => 'Reduced resistance contact region for semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 7/444358
[patent_app_country] => US
[patent_app_date] => 1989-12-01
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[pdf_file] => patents/05/047/05047831.pdf
[firstpage_image] =>[orig_patent_app_number] => 444358
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/444358 | Reduced resistance contact region for semiconductor device | Nov 30, 1989 | Issued |
Array
(
[id] => 2717643
[patent_doc_number] => 05018004
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-05-21
[patent_title] => 'Semi-conductor device'
[patent_app_type] => 1
[patent_app_number] => 7/442098
[patent_app_country] => US
[patent_app_date] => 1989-11-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/05/018/05018004.pdf
[firstpage_image] =>[orig_patent_app_number] => 442098
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/442098 | Semi-conductor device | Nov 27, 1989 | Issued |
Array
(
[id] => 2689580
[patent_doc_number] => 05045915
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-09-03
[patent_title] => 'Semiconductor integrated circuit device'
[patent_app_type] => 1
[patent_app_number] => 7/439856
[patent_app_country] => US
[patent_app_date] => 1989-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/05/045/05045915.pdf
[firstpage_image] =>[orig_patent_app_number] => 439856
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/439856 | Semiconductor integrated circuit device | Nov 20, 1989 | Issued |
Array
(
[id] => 2753210
[patent_doc_number] => 05012323
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-04-30
[patent_title] => 'Double-die semiconductor package having a back-bonded die and a face-bonded die interconnected on a single leadframe'
[patent_app_type] => 1
[patent_app_number] => 7/439243
[patent_app_country] => US
[patent_app_date] => 1989-11-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2732
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[patent_words_short_claim] => 451
[patent_maintenance] => 1
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[pdf_file] => patents/05/012/05012323.pdf
[firstpage_image] =>[orig_patent_app_number] => 439243
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/439243 | Double-die semiconductor package having a back-bonded die and a face-bonded die interconnected on a single leadframe | Nov 19, 1989 | Issued |
Array
(
[id] => 2771304
[patent_doc_number] => 04994902
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-02-19
[patent_title] => 'Semiconductor devices and electronic system incorporating them'
[patent_app_type] => 1
[patent_app_number] => 7/437373
[patent_app_country] => US
[patent_app_date] => 1989-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/994/04994902.pdf
[firstpage_image] =>[orig_patent_app_number] => 437373
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/437373 | Semiconductor devices and electronic system incorporating them | Nov 14, 1989 | Issued |
Array
(
[id] => 2634056
[patent_doc_number] => 04967262
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-10-30
[patent_title] => 'Gull-wing zig-zag inline lead package having end-of-package anchoring pins'
[patent_app_type] => 1
[patent_app_number] => 7/432598
[patent_app_country] => US
[patent_app_date] => 1989-11-06
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/04/967/04967262.pdf
[firstpage_image] =>[orig_patent_app_number] => 432598
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/432598 | Gull-wing zig-zag inline lead package having end-of-package anchoring pins | Nov 5, 1989 | Issued |
Array
(
[id] => 2752300
[patent_doc_number] => 04987477
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-01-22
[patent_title] => 'Solid state imaging device'
[patent_app_type] => 1
[patent_app_number] => 7/430419
[patent_app_country] => US
[patent_app_date] => 1989-11-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
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[patent_no_of_words] => 9320
[patent_no_of_claims] => 20
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/987/04987477.pdf
[firstpage_image] =>[orig_patent_app_number] => 430419
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/430419 | Solid state imaging device | Nov 1, 1989 | Issued |
Array
(
[id] => 2715734
[patent_doc_number] => 05055913
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-10-08
[patent_title] => 'Terminal arrangement for integrated circuit device'
[patent_app_type] => 1
[patent_app_number] => 7/426854
[patent_app_country] => US
[patent_app_date] => 1989-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 3499
[patent_no_of_claims] => 2
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[patent_words_short_claim] => 116
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/055/05055913.pdf
[firstpage_image] =>[orig_patent_app_number] => 426854
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/426854 | Terminal arrangement for integrated circuit device | Oct 25, 1989 | Issued |
Array
(
[id] => 2773836
[patent_doc_number] => 05006923
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-04-09
[patent_title] => 'Stackable multilayer substrate for mounting integrated circuits'
[patent_app_type] => 1
[patent_app_number] => 7/407045
[patent_app_country] => US
[patent_app_date] => 1989-09-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[pdf_file] => patents/05/006/05006923.pdf
[firstpage_image] =>[orig_patent_app_number] => 407045
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/407045 | Stackable multilayer substrate for mounting integrated circuits | Sep 13, 1989 | Issued |
| 07/405711 | DAM FOR LEAD ENCAPSULATION | Sep 10, 1989 | Abandoned |
Array
(
[id] => 2739914
[patent_doc_number] => 05032896
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-07-16
[patent_title] => '3-D integrated circuit assembly employing discrete chips'
[patent_app_type] => 1
[patent_app_number] => 7/401371
[patent_app_country] => US
[patent_app_date] => 1989-08-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 3989
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[pdf_file] => patents/05/032/05032896.pdf
[firstpage_image] =>[orig_patent_app_number] => 401371
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/401371 | 3-D integrated circuit assembly employing discrete chips | Aug 30, 1989 | Issued |
Array
(
[id] => 2703372
[patent_doc_number] => 04991000
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-02-05
[patent_title] => 'Vertically interconnected integrated circuit chip system'
[patent_app_type] => 1
[patent_app_number] => 7/401255
[patent_app_country] => US
[patent_app_date] => 1989-08-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_words_short_claim] => 143
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/04/991/04991000.pdf
[firstpage_image] =>[orig_patent_app_number] => 401255
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/401255 | Vertically interconnected integrated circuit chip system | Aug 30, 1989 | Issued |
| 07/392581 | ELECTRIC DEVICE UTILIZING ANTI-OXIDATION FILM BETWEEN BASE PAD FOR SEMICONDUCTOR CHIP AND ORGANIC ENCAPSULATING MATERIAL | Aug 10, 1989 | Abandoned |
Array
(
[id] => 2714257
[patent_doc_number] => 05014109
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-05-07
[patent_title] => 'Miniaturization of a contact hole in a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 7/388037
[patent_app_country] => US
[patent_app_date] => 1989-08-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/05/014/05014109.pdf
[firstpage_image] =>[orig_patent_app_number] => 388037
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/388037 | Miniaturization of a contact hole in a semiconductor device | Jul 31, 1989 | Issued |
Array
(
[id] => 2634001
[patent_doc_number] => 04967259
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-10-30
[patent_title] => 'Wafer having a dicing area having a step region covered with a conductive layer and method of manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 7/385879
[patent_app_country] => US
[patent_app_date] => 1989-07-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[pdf_file] => patents/04/967/04967259.pdf
[firstpage_image] =>[orig_patent_app_number] => 385879
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/385879 | Wafer having a dicing area having a step region covered with a conductive layer and method of manufacturing the same | Jul 26, 1989 | Issued |
| 07/385173 | SEMICONDUCTOR DEVICE | Jul 25, 1989 | Abandoned |
Array
(
[id] => 2638507
[patent_doc_number] => 04958215
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1990-09-18
[patent_title] => 'Press-contact flat type semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 7/384801
[patent_app_country] => US
[patent_app_date] => 1989-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3383
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[pdf_file] => patents/04/958/04958215.pdf
[firstpage_image] =>[orig_patent_app_number] => 384801
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/384801 | Press-contact flat type semiconductor device | Jul 24, 1989 | Issued |
| 07/384423 | QUANTUM WELL STRUCTURE AND SEMICONDUCTOR DEVICE USING THE SAME | Jul 20, 1989 | Abandoned |
Array
(
[id] => 2751563
[patent_doc_number] => 05023673
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1991-06-11
[patent_title] => 'Semiconductor mesa structured optical processing devices, with added side-surface recombination centers to improve the speed of operation'
[patent_app_type] => 1
[patent_app_number] => 7/384341
[patent_app_country] => US
[patent_app_date] => 1989-07-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[pdf_file] => patents/05/023/05023673.pdf
[firstpage_image] =>[orig_patent_app_number] => 384341
[rel_patent_id] =>[rel_patent_doc_number] =>) 07/384341 | Semiconductor mesa structured optical processing devices, with added side-surface recombination centers to improve the speed of operation | Jul 20, 1989 | Issued |
| 07/380189 | VAPOR DEPOSITED MICRO HEAT PIPES | Jul 13, 1989 | Abandoned |