Herbert J Lilling
Examiner (ID: 9186)
Most Active Art Unit | 1651 |
Art Unit(s) | 1651, 2899, 1501, 1713, 1507, 1803, 1711, 1801, 1808, 1505, 1657 |
Total Applications | 3871 |
Issued Applications | 3170 |
Pending Applications | 141 |
Abandoned Applications | 519 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 202520
[patent_doc_number] => 07632728
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-12-15
[patent_title] => 'Method of forming TaC gate electrodes with crystal orientation ratio defining the work function'
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[patent_app_country] => US
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[pdf_file] => patents/07/632/07632728.pdf
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Array
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[patent_doc_number] => 07648917
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[patent_issue_date] => 2010-01-19
[patent_title] => 'Manufacturing method of solid-state imaging device'
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[patent_app_date] => 2007-09-19
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Array
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[id] => 177859
[patent_doc_number] => 07655567
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2010-02-02
[patent_title] => 'Methods for improving uniformity and resistivity of thin tungsten films'
[patent_app_type] => utility
[patent_app_number] => 11/782570
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[patent_app_date] => 2007-07-24
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Array
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[patent_doc_number] => 20080315371
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[patent_kind] => A1
[patent_issue_date] => 2008-12-25
[patent_title] => 'METHODS AND APPARATUS FOR EMI SHIELDING IN MULTI-CHIP MODULES'
[patent_app_type] => utility
[patent_app_number] => 11/765170
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/765170 | Methods and apparatus for EMI shielding in multi-chip modules | Jun 18, 2007 | Issued |
Array
(
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[patent_title] => 'Layout design and fabrication of SDA micro motor for low driving voltage and high lifetime application'
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Array
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[patent_title] => 'CHIP PACKAGE CAPABLE OF MINIMIZING ELECTRO-MAGNETIC INTERFERENCE'
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Array
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[patent_issue_date] => 2008-12-11
[patent_title] => 'VARYING MUGFET WIDTH TO ADJUST DEVICE CHARACTERISTICS'
[patent_app_type] => utility
[patent_app_number] => 11/759710
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/759710 | VARYING MUGFET WIDTH TO ADJUST DEVICE CHARACTERISTICS | Jun 6, 2007 | Abandoned |
Array
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[id] => 4670064
[patent_doc_number] => 20080045124
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[patent_issue_date] => 2008-02-21
[patent_title] => 'Sawing method for a wafer'
[patent_app_type] => utility
[patent_app_number] => 11/785710
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[firstpage_image] =>[orig_patent_app_number] => 11785710
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/785710 | Sawing method for a wafer | Apr 18, 2007 | Abandoned |
Array
(
[id] => 4988716
[patent_doc_number] => 20070155055
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[patent_title] => 'Method of dicing wafer and die'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/635010 | Method of dicing wafer and die | Dec 6, 2006 | Abandoned |
Array
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[id] => 602806
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[patent_issue_date] => 2008-10-07
[patent_title] => 'Semiconductor device and manufacturing method thereof'
[patent_app_type] => utility
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Array
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Array
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Array
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[id] => 5031601
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/546010 | Vertical semiconductor device having semiconductor zones for improved operability under dynamic processes | Oct 10, 2006 | Issued |
Array
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Array
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Array
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