Search

Hoa B. Trinh

Examiner (ID: 4300, Phone: (571)272-1719 , Office: P/2817 )

Most Active Art Unit
2814
Art Unit(s)
2817, 2813, 2893, 3731, 2814
Total Applications
1769
Issued Applications
1421
Pending Applications
107
Abandoned Applications
243

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 8064771 [patent_doc_number] => 20110244637 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-10-06 [patent_title] => 'MOLD AND SUBSTRATE FOR USE WITH MOLD' [patent_app_type] => utility [patent_app_number] => 13/097066 [patent_app_country] => US [patent_app_date] => 2011-04-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3251 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0244/20110244637.pdf [firstpage_image] =>[orig_patent_app_number] => 13097066 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/097066
Mold and substrate for use with mold Apr 28, 2011 Issued
Array ( [id] => 6106174 [patent_doc_number] => 20110186996 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-08-04 [patent_title] => 'MULTI-CHIP SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/088779 [patent_app_country] => US [patent_app_date] => 2011-04-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 6214 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0186/20110186996.pdf [firstpage_image] =>[orig_patent_app_number] => 13088779 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/088779
Multi-chip semiconductor device Apr 17, 2011 Issued
Array ( [id] => 8428411 [patent_doc_number] => 20120250286 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-10-04 [patent_title] => 'Apparatus and Method for Increasing Bandwidths of Stacked Dies' [patent_app_type] => utility [patent_app_number] => 13/077654 [patent_app_country] => US [patent_app_date] => 2011-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 4302 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13077654 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/077654
Apparatus and method for increasing bandwidths of stacked dies Mar 30, 2011 Issued
Array ( [id] => 6098470 [patent_doc_number] => 20110163223 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-07-07 [patent_title] => 'ACTIVE PIXEL SENSOR HAVING TWO WAFERS' [patent_app_type] => utility [patent_app_number] => 13/051036 [patent_app_country] => US [patent_app_date] => 2011-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6633 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0163/20110163223.pdf [firstpage_image] =>[orig_patent_app_number] => 13051036 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/051036
Active pixel sensor having two wafers Mar 17, 2011 Issued
Array ( [id] => 9889476 [patent_doc_number] => 08975736 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-03-10 [patent_title] => 'Wafer level package, chip size package device and method of manufacturing wafer level package' [patent_app_type] => utility [patent_app_number] => 14/000111 [patent_app_country] => US [patent_app_date] => 2011-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 30 [patent_no_of_words] => 8800 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14000111 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/000111
Wafer level package, chip size package device and method of manufacturing wafer level package Mar 15, 2011 Issued
Array ( [id] => 8305764 [patent_doc_number] => 08227298 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-07-24 [patent_title] => 'Semiconductor package having buss-less substrate' [patent_app_type] => utility [patent_app_number] => 13/047991 [patent_app_country] => US [patent_app_date] => 2011-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 4424 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13047991 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/047991
Semiconductor package having buss-less substrate Mar 14, 2011 Issued
Array ( [id] => 8610175 [patent_doc_number] => 20130015487 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-01-17 [patent_title] => 'SEMICONDUCTOR LIGHT-EMITTING DEVICE' [patent_app_type] => utility [patent_app_number] => 13/637955 [patent_app_country] => US [patent_app_date] => 2011-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 8109 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13637955 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/637955
Semiconductor light-emitting device Mar 14, 2011 Issued
Array ( [id] => 8435438 [patent_doc_number] => 08283207 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-10-09 [patent_title] => 'Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods' [patent_app_type] => utility [patent_app_number] => 13/043094 [patent_app_country] => US [patent_app_date] => 2011-03-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 10 [patent_no_of_words] => 6865 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 174 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13043094 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/043094
Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods Mar 7, 2011 Issued
Array ( [id] => 6208400 [patent_doc_number] => 20110133318 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-06-09 [patent_title] => 'SiP SUBSTRATE' [patent_app_type] => utility [patent_app_number] => 13/005618 [patent_app_country] => US [patent_app_date] => 2011-01-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 2384 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0133/20110133318.pdf [firstpage_image] =>[orig_patent_app_number] => 13005618 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/005618
SiP substrate Jan 12, 2011 Issued
Array ( [id] => 6052402 [patent_doc_number] => 20110108984 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-05-12 [patent_title] => 'CIRCUIT BOARD AND CHIP PACKAGE STRUCTURE' [patent_app_type] => utility [patent_app_number] => 13/004242 [patent_app_country] => US [patent_app_date] => 2011-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3745 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0108/20110108984.pdf [firstpage_image] =>[orig_patent_app_number] => 13004242 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/004242
Circuit board and chip package structure Jan 10, 2011 Issued
Array ( [id] => 5985718 [patent_doc_number] => 20110097833 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-04-28 [patent_title] => 'LIGHT SOURCE INCLUDING A WAVELENGHT-CONVERETED SEMICONDUCTOR LIGHT EMITTING DEVICE AND A FILTER' [patent_app_type] => utility [patent_app_number] => 12/985394 [patent_app_country] => US [patent_app_date] => 2011-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4063 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0097/20110097833.pdf [firstpage_image] =>[orig_patent_app_number] => 12985394 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/985394
Light source including a wavelength-converted semiconductor light emitting device and a filter Jan 5, 2011 Issued
Array ( [id] => 6126842 [patent_doc_number] => 20110086493 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-04-14 [patent_title] => 'SEMICONDUCTOR CHIP HAVING ISLAND DISPERSION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/971854 [patent_app_country] => US [patent_app_date] => 2010-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 10446 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0086/20110086493.pdf [firstpage_image] =>[orig_patent_app_number] => 12971854 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/971854
Semiconductor chip having island dispersion structure and method for manufacturing the same Dec 16, 2010 Issued
Array ( [id] => 6126878 [patent_doc_number] => 20110086510 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-04-14 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 12/971814 [patent_app_country] => US [patent_app_date] => 2010-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 6207 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0086/20110086510.pdf [firstpage_image] =>[orig_patent_app_number] => 12971814 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/971814
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF Dec 16, 2010 Abandoned
Array ( [id] => 9216740 [patent_doc_number] => 08629543 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-01-14 [patent_title] => 'Electrically interconnected stacked die assemblies' [patent_app_type] => utility [patent_app_number] => 12/913604 [patent_app_country] => US [patent_app_date] => 2010-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 58 [patent_no_of_words] => 11995 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12913604 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/913604
Electrically interconnected stacked die assemblies Oct 26, 2010 Issued
Array ( [id] => 8189004 [patent_doc_number] => 08183094 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-05-22 [patent_title] => 'Method of manufacturing a semiconductor device having a semiconductor chip and resin sealing portion' [patent_app_type] => utility [patent_app_number] => 12/907733 [patent_app_country] => US [patent_app_date] => 2010-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 4139 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/183/08183094.pdf [firstpage_image] =>[orig_patent_app_number] => 12907733 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/907733
Method of manufacturing a semiconductor device having a semiconductor chip and resin sealing portion Oct 18, 2010 Issued
Array ( [id] => 6193128 [patent_doc_number] => 20110024882 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-02-03 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/901002 [patent_app_country] => US [patent_app_date] => 2010-10-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 13659 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0024/20110024882.pdf [firstpage_image] =>[orig_patent_app_number] => 12901002 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/901002
SEMICONDUCTOR DEVICE Oct 7, 2010 Abandoned
Array ( [id] => 5925472 [patent_doc_number] => 20110037170 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-02-17 [patent_title] => 'ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR' [patent_app_type] => utility [patent_app_number] => 12/851618 [patent_app_country] => US [patent_app_date] => 2010-08-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 37 [patent_figures_cnt] => 37 [patent_no_of_words] => 23760 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0037/20110037170.pdf [firstpage_image] =>[orig_patent_app_number] => 12851618 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/851618
Electronic device and manufacturing method therefor Aug 5, 2010 Issued
Array ( [id] => 6021381 [patent_doc_number] => 20110049707 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-03-03 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 12/850828 [patent_app_country] => US [patent_app_date] => 2010-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3318 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0049/20110049707.pdf [firstpage_image] =>[orig_patent_app_number] => 12850828 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/850828
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE Aug 4, 2010 Abandoned
Array ( [id] => 6075377 [patent_doc_number] => 20110140267 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-06-16 [patent_title] => 'ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/849089 [patent_app_country] => US [patent_app_date] => 2010-08-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3236 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0140/20110140267.pdf [firstpage_image] =>[orig_patent_app_number] => 12849089 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/849089
Electronic device package and method for fabricating the same Aug 2, 2010 Issued
Array ( [id] => 10898782 [patent_doc_number] => 08922004 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-12-30 [patent_title] => 'Copper bump structures having sidewall protection layers' [patent_app_type] => utility [patent_app_number] => 12/846260 [patent_app_country] => US [patent_app_date] => 2010-07-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 2484 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12846260 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/846260
Copper bump structures having sidewall protection layers Jul 28, 2010 Issued
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