Hoa B. Trinh

Array ( [id] => 5364871 [patent_doc_number] => 20090302430 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-10 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/477178 [patent_app_country] => US [patent_app_date] => 2009-06-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 6345 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0302/20090302430.pdf [firstpage_image] =>[orig_patent_app_number] => 12477178 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4496272 [patent_doc_number] => 07956454 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-06-07 [patent_title] => 'Wiring board and ceramic chip to be embedded' [patent_app_type] => utility [patent_app_number] => 12/475648 [patent_app_country] => US [patent_app_date] => 2009-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 19 [patent_no_of_words] => 12297 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/956/07956454.pdf [firstpage_image] =>[orig_patent_app_number] => 12475648 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8665013 [patent_doc_number] => 08378475 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2013-02-19 [patent_title] => 'Optoelectronic chip carriers' [patent_app_type] => utility [patent_app_number] => 12/455367 [patent_app_country] => US [patent_app_date] => 2009-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2991 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12455367 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8294947 [patent_doc_number] => 08222743 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-07-17 [patent_title] => 'Flash memory storage apparatus' [patent_app_type] => utility [patent_app_number] => 12/472637 [patent_app_country] => US [patent_app_date] => 2009-05-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 12 [patent_no_of_words] => 5064 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 187 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12472637 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8726076 [patent_doc_number] => 08405198 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-03-26 [patent_title] => 'Stress-engineered interconnect packages with activator-assisted molds' [patent_app_type] => utility [patent_app_number] => 12/471188 [patent_app_country] => US [patent_app_date] => 2009-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 2861 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12471188 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10577011 [patent_doc_number] => 09299661 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-03-29 [patent_title] => 'Integrated circuit package and method of making same' [patent_app_type] => utility [patent_app_number] => 12/467748 [patent_app_country] => US [patent_app_date] => 2009-05-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 23 [patent_no_of_words] => 5031 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12467748 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6453315 [patent_doc_number] => 20100283487 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-11-11 [patent_title] => 'SYSTEM AND METHOD FOR SENSING VOLTAGE IN MEDIUM-TO-HIGH VOLTAGE APPLICATIONS' [patent_app_type] => utility [patent_app_number] => 12/463249 [patent_app_country] => US [patent_app_date] => 2009-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2730 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0283/20100283487.pdf [firstpage_image] =>[orig_patent_app_number] => 12463249 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5313646 [patent_doc_number] => 20090278244 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-11-12 [patent_title] => 'IC DEVICE HAVING LOW RESISTANCE TSV COMPRISING GROUND CONNECTION' [patent_app_type] => utility [patent_app_number] => 12/463086 [patent_app_country] => US [patent_app_date] => 2009-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 5723 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0278/20090278244.pdf [firstpage_image] =>[orig_patent_app_number] => 12463086 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8233271 [patent_doc_number] => 08198717 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2012-06-12 [patent_title] => 'Signal shifting to allow independent control of identical stacked memory modules' [patent_app_type] => utility [patent_app_number] => 12/463329 [patent_app_country] => US [patent_app_date] => 2009-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2675 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/198/08198717.pdf [firstpage_image] =>[orig_patent_app_number] => 12463329 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8458609 [patent_doc_number] => 08294280 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-10-23 [patent_title] => 'Panelized backside processing for thin semiconductors' [patent_app_type] => utility [patent_app_number] => 12/437168 [patent_app_country] => US [patent_app_date] => 2009-05-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 30 [patent_no_of_words] => 5096 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12437168 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6446491 [patent_doc_number] => 20100283138 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-11-11 [patent_title] => 'Nickel-Based Bonding of Semiconductor Wafers' [patent_app_type] => utility [patent_app_number] => 12/436569 [patent_app_country] => US [patent_app_date] => 2009-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 6014 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0283/20100283138.pdf [firstpage_image] =>[orig_patent_app_number] => 12436569 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6446602 [patent_doc_number] => 20100283146 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-11-11 [patent_title] => 'SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/436266 [patent_app_country] => US [patent_app_date] => 2009-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2038 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0283/20100283146.pdf [firstpage_image] =>[orig_patent_app_number] => 12436266 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6446379 [patent_doc_number] => 20100283134 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-11-11 [patent_title] => 'High Power Ceramic on Copper Package' [patent_app_type] => utility [patent_app_number] => 12/436652 [patent_app_country] => US [patent_app_date] => 2009-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3121 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0283/20100283134.pdf [firstpage_image] =>[orig_patent_app_number] => 12436652 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6280624 [patent_doc_number] => 20100155939 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-06-24 [patent_title] => 'CIRCUIT BOARD AND FABRICATION METHOD THEREOF AND CHIP PACKAGE STRUCTURE' [patent_app_type] => utility [patent_app_number] => 12/432367 [patent_app_country] => US [patent_app_date] => 2009-04-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3858 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0155/20100155939.pdf [firstpage_image] =>[orig_patent_app_number] => 12432367 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5477698 [patent_doc_number] => 20090200655 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-08-13 [patent_title] => 'Method of electrically connecting a microelectronic component' [patent_app_type] => utility [patent_app_number] => 12/384868 [patent_app_country] => US [patent_app_date] => 2009-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4473 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0200/20090200655.pdf [firstpage_image] =>[orig_patent_app_number] => 12384868 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5567430 [patent_doc_number] => 20090250808 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-10-08 [patent_title] => 'RELIABILITY IMPROVEMENT IN A COMPOUND SEMICONDUCTOR MMIC' [patent_app_type] => utility [patent_app_number] => 12/416711 [patent_app_country] => US [patent_app_date] => 2009-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3218 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0250/20090250808.pdf [firstpage_image] =>[orig_patent_app_number] => 12416711 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5469760 [patent_doc_number] => 20090242926 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-10-01 [patent_title] => 'PACKAGE FOR OPTICAL SEMICONDUCTOR ELEMENT' [patent_app_type] => utility [patent_app_number] => 12/408887 [patent_app_country] => US [patent_app_date] => 2009-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3176 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0242/20090242926.pdf [firstpage_image] =>[orig_patent_app_number] => 12408887 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7773228 [patent_doc_number] => 20120038067 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-02-16 [patent_title] => 'ENCAPSULATION METHODS FOR ORGANIC ELECTRICAL DEVICES' [patent_app_type] => utility [patent_app_number] => 13/202062 [patent_app_country] => US [patent_app_date] => 2009-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 10290 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0038/20120038067.pdf [firstpage_image] =>[orig_patent_app_number] => 13202062 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7773225 [patent_doc_number] => 20120038066 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-02-16 [patent_title] => 'ENCAPSULATION METHODS AND DIELECTRIC LAYERS FOR ORGANIC ELECTRICAL DEVICES' [patent_app_type] => utility [patent_app_number] => 13/202065 [patent_app_country] => US [patent_app_date] => 2009-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 11509 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0038/20120038066.pdf [firstpage_image] =>[orig_patent_app_number] => 13202065 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6525160 [patent_doc_number] => 20100220886 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-09-02 [patent_title] => 'EAR-ATTACHMENT DEVICE AND METHOD' [patent_app_type] => utility [patent_app_number] => 12/394778 [patent_app_country] => US [patent_app_date] => 2009-02-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 6494 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0220/20100220886.pdf [firstpage_image] =>[orig_patent_app_number] => 12394778 [rel_patent_id] =>[rel_patent_doc_number] =>)