
Hoa B. Trinh
Examiner (ID: 4300, Phone: (571)272-1719 , Office: P/2817 )
| Most Active Art Unit | 2814 |
| Art Unit(s) | 2817, 2813, 2893, 3731, 2814 |
| Total Applications | 1769 |
| Issued Applications | 1421 |
| Pending Applications | 107 |
| Abandoned Applications | 243 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4789544
[patent_doc_number] => 20080290517
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-11-27
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 12/153587
[patent_app_country] => US
[patent_app_date] => 2008-05-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 4493
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[pdf_file] => publications/A1/0290/20080290517.pdf
[firstpage_image] =>[orig_patent_app_number] => 12153587
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/153587 | Semiconductor device | May 20, 2008 | Issued |
Array
(
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[patent_doc_number] => 07745932
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[patent_kind] => B2
[patent_issue_date] => 2010-06-29
[patent_title] => 'Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 12/153558
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[patent_app_date] => 2008-05-21
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/153558 | Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same | May 20, 2008 | Issued |
Array
(
[id] => 9469697
[patent_doc_number] => 08723332
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-05-13
[patent_title] => 'Electrically interconnected stacked die assemblies'
[patent_app_type] => utility
[patent_app_number] => 12/124077
[patent_app_country] => US
[patent_app_date] => 2008-05-20
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[patent_drawing_sheets_cnt] => 20
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/124077 | Electrically interconnected stacked die assemblies | May 19, 2008 | Issued |
Array
(
[id] => 4695555
[patent_doc_number] => 20080217739
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-09-11
[patent_title] => 'Semiconductor packaging substrate structure with capacitor embedded therein'
[patent_app_type] => utility
[patent_app_number] => 12/153388
[patent_app_country] => US
[patent_app_date] => 2008-05-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/153388 | Semiconductor packaging substrate structure with capacitor embedded therein | May 18, 2008 | Abandoned |
Array
(
[id] => 260410
[patent_doc_number] => 07573139
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[patent_kind] => B2
[patent_issue_date] => 2009-08-11
[patent_title] => 'Packed system of semiconductor chips having a semiconductor interposer'
[patent_app_type] => utility
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[patent_app_date] => 2008-05-12
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[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/07/573/07573139.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/119276 | Packed system of semiconductor chips having a semiconductor interposer | May 11, 2008 | Issued |
Array
(
[id] => 8545302
[patent_doc_number] => 08320602
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-11-27
[patent_title] => 'Adjustable earphone'
[patent_app_type] => utility
[patent_app_number] => 12/116963
[patent_app_country] => US
[patent_app_date] => 2008-05-08
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/116963 | Adjustable earphone | May 7, 2008 | Issued |
Array
(
[id] => 5483330
[patent_doc_number] => 20090273095
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-11-05
[patent_title] => 'Rectangular-Shaped Controlled Collapse Chip Connection'
[patent_app_type] => utility
[patent_app_number] => 12/114867
[patent_app_country] => US
[patent_app_date] => 2008-05-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => publications/A1/0273/20090273095.pdf
[firstpage_image] =>[orig_patent_app_number] => 12114867
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/114867 | Rectangular-shaped controlled collapse chip connection | May 4, 2008 | Issued |
Array
(
[id] => 4708259
[patent_doc_number] => 20080296785
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-12-04
[patent_title] => 'Method of forming catalyst nanoparticles for nanowire growth and other applications'
[patent_app_type] => utility
[patent_app_number] => 12/150063
[patent_app_country] => US
[patent_app_date] => 2008-04-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 3455
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[pdf_file] => publications/A1/0296/20080296785.pdf
[firstpage_image] =>[orig_patent_app_number] => 12150063
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/150063 | Method of forming catalyst nanoparticles for nanowire growth and other applications | Apr 22, 2008 | Abandoned |
Array
(
[id] => 5293853
[patent_doc_number] => 20090008779
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-08
[patent_title] => 'Composite Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices'
[patent_app_type] => utility
[patent_app_number] => 12/058552
[patent_app_country] => US
[patent_app_date] => 2008-03-28
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[firstpage_image] =>[orig_patent_app_number] => 12058552
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/058552 | Composite carbon nanotube-based structures and methods for removing heat from solid-state devices | Mar 27, 2008 | Issued |
Array
(
[id] => 236246
[patent_doc_number] => 07595227
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-09-29
[patent_title] => 'Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same'
[patent_app_type] => utility
[patent_app_number] => 12/058067
[patent_app_country] => US
[patent_app_date] => 2008-03-28
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[pdf_file] => patents/07/595/07595227.pdf
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Array
(
[id] => 6519585
[patent_doc_number] => 20100123259
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[patent_issue_date] => 2010-05-20
[patent_title] => 'PHOTOSENSITIVE RESIN COMPOSITION'
[patent_app_type] => utility
[patent_app_number] => 12/531803
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[firstpage_image] =>[orig_patent_app_number] => 12531803
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/531803 | Photosensitive resin composition | Mar 24, 2008 | Issued |
Array
(
[id] => 4457719
[patent_doc_number] => 07893548
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[patent_title] => 'SiP substrate'
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Array
(
[id] => 4634988
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[patent_title] => 'Semiconductor device and manufacturing method thereof'
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Array
(
[id] => 8535100
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/051197 | Miniature stereo audio earphones | Mar 18, 2008 | Issued |
Array
(
[id] => 4695574
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[patent_title] => 'PACKAGE SUBSTRATE STRIP, METAL SURFACE TREATMENT METHOD THEREOF AND CHIP PACKAGE STRUCTURE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/044697 | Package substrate strip, metal surface treatment method thereof and chip package structure | Mar 6, 2008 | Issued |
Array
(
[id] => 6423083
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Array
(
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Array
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Array
(
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/036491 | Adjustable Ear-Hook Earphone with Compressible Inner Portion and Related Methods | Feb 24, 2008 | Abandoned |