
Hoa B. Trinh
Examiner (ID: 4300, Phone: (571)272-1719 , Office: P/2817 )
| Most Active Art Unit | 2814 |
| Art Unit(s) | 2817, 2813, 2893, 3731, 2814 |
| Total Applications | 1769 |
| Issued Applications | 1421 |
| Pending Applications | 107 |
| Abandoned Applications | 243 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4503683
[patent_doc_number] => 07919847
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-04-05
[patent_title] => 'Semiconductor wafer, semiconductor device, and semiconductor device manufacturing method'
[patent_app_type] => utility
[patent_app_number] => 11/713436
[patent_app_country] => US
[patent_app_date] => 2007-03-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 23
[patent_no_of_words] => 6870
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 137
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/919/07919847.pdf
[firstpage_image] =>[orig_patent_app_number] => 11713436
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/713436 | Semiconductor wafer, semiconductor device, and semiconductor device manufacturing method | Mar 1, 2007 | Issued |
Array
(
[id] => 837282
[patent_doc_number] => 07394098
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-07-01
[patent_title] => 'Thin film transistor, its manufacture method and display device'
[patent_app_type] => utility
[patent_app_number] => 11/710168
[patent_app_country] => US
[patent_app_date] => 2007-02-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 17
[patent_no_of_words] => 5250
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 167
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/394/07394098.pdf
[firstpage_image] =>[orig_patent_app_number] => 11710168
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/710168 | Thin film transistor, its manufacture method and display device | Feb 22, 2007 | Issued |
Array
(
[id] => 81428
[patent_doc_number] => 07745253
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-06-29
[patent_title] => 'Ribbon bonding in an electronic package'
[patent_app_type] => utility
[patent_app_number] => 11/675534
[patent_app_country] => US
[patent_app_date] => 2007-02-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 17
[patent_no_of_words] => 8250
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 112
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/745/07745253.pdf
[firstpage_image] =>[orig_patent_app_number] => 11675534
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/675534 | Ribbon bonding in an electronic package | Feb 14, 2007 | Issued |
Array
(
[id] => 8410765
[patent_doc_number] => 08274162
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-09-25
[patent_title] => 'Apparatus and method for reduced delamination of an integrated circuit module'
[patent_app_type] => utility
[patent_app_number] => 11/656138
[patent_app_country] => US
[patent_app_date] => 2007-01-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 9
[patent_no_of_words] => 4437
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 163
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11656138
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/656138 | Apparatus and method for reduced delamination of an integrated circuit module | Jan 19, 2007 | Issued |
Array
(
[id] => 5110520
[patent_doc_number] => 20070194435
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-23
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/618159
[patent_app_country] => US
[patent_app_date] => 2006-12-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 14
[patent_no_of_words] => 7160
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 0
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0194/20070194435.pdf
[firstpage_image] =>[orig_patent_app_number] => 11618159
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/618159 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Dec 28, 2006 | Abandoned |
Array
(
[id] => 4749247
[patent_doc_number] => 20080157318
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-03
[patent_title] => 'BRIDGE STACK INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 11/616878
[patent_app_country] => US
[patent_app_date] => 2006-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 13579
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0157/20080157318.pdf
[firstpage_image] =>[orig_patent_app_number] => 11616878
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/616878 | Bridge stack integrated circuit package-on-package system | Dec 27, 2006 | Issued |
Array
(
[id] => 4749278
[patent_doc_number] => 20080157349
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-03
[patent_title] => 'IC package having improved structure'
[patent_app_type] => utility
[patent_app_number] => 11/647789
[patent_app_country] => US
[patent_app_date] => 2006-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1307
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0157/20080157349.pdf
[firstpage_image] =>[orig_patent_app_number] => 11647789
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/647789 | IC package having improved structure | Dec 27, 2006 | Abandoned |
Array
(
[id] => 5196744
[patent_doc_number] => 20070296062
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-27
[patent_title] => 'Substrate Strip and Substrate Structure and Method for Manufacturing the Same'
[patent_app_type] => utility
[patent_app_number] => 11/617138
[patent_app_country] => US
[patent_app_date] => 2006-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 2916
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0296/20070296062.pdf
[firstpage_image] =>[orig_patent_app_number] => 11617138
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/617138 | Substrate strip and substrate structure and method for manufacturing the same | Dec 27, 2006 | Issued |
Array
(
[id] => 4974789
[patent_doc_number] => 20070216019
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-20
[patent_title] => 'LAMINATED IC PACKAGING SUBSTRATE AND INTER-CONNECTOR STRUCTURE THEREOF'
[patent_app_type] => utility
[patent_app_number] => 11/616299
[patent_app_country] => US
[patent_app_date] => 2006-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 3819
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0216/20070216019.pdf
[firstpage_image] =>[orig_patent_app_number] => 11616299
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/616299 | LAMINATED IC PACKAGING SUBSTRATE AND INTER-CONNECTOR STRUCTURE THEREOF | Dec 26, 2006 | Abandoned |
Array
(
[id] => 4575548
[patent_doc_number] => 07859116
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2010-12-28
[patent_title] => 'Exposed metal bezel for use in sensor devices and method therefor'
[patent_app_type] => utility
[patent_app_number] => 11/616069
[patent_app_country] => US
[patent_app_date] => 2006-12-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 21
[patent_no_of_words] => 2098
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 58
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/859/07859116.pdf
[firstpage_image] =>[orig_patent_app_number] => 11616069
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/616069 | Exposed metal bezel for use in sensor devices and method therefor | Dec 25, 2006 | Issued |
Array
(
[id] => 7504946
[patent_doc_number] => 08035238
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-10-11
[patent_title] => 'Driving circuit and liquid crystal display device including the same'
[patent_app_type] => utility
[patent_app_number] => 11/641789
[patent_app_country] => US
[patent_app_date] => 2006-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 5039
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/035/08035238.pdf
[firstpage_image] =>[orig_patent_app_number] => 11641789
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/641789 | Driving circuit and liquid crystal display device including the same | Dec 19, 2006 | Issued |
Array
(
[id] => 4795329
[patent_doc_number] => 20080006915
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-10
[patent_title] => 'Semiconductor package, method of production of same, printed circuit board, and electronic apparatus'
[patent_app_type] => utility
[patent_app_number] => 11/641718
[patent_app_country] => US
[patent_app_date] => 2006-12-20
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[pdf_file] => publications/A1/0006/20080006915.pdf
[firstpage_image] =>[orig_patent_app_number] => 11641718
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/641718 | Semiconductor package, method of production of same, printed circuit board, and electronic apparatus | Dec 19, 2006 | Abandoned |
Array
(
[id] => 4863937
[patent_doc_number] => 20080142996
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-19
[patent_title] => 'Controlling flow of underfill using polymer coating and resulting devices'
[patent_app_type] => utility
[patent_app_number] => 11/641638
[patent_app_country] => US
[patent_app_date] => 2006-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => publications/A1/0142/20080142996.pdf
[firstpage_image] =>[orig_patent_app_number] => 11641638
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/641638 | Controlling flow of underfill using polymer coating and resulting devices | Dec 18, 2006 | Abandoned |
Array
(
[id] => 62827
[patent_doc_number] => 07763537
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-07-27
[patent_title] => 'Metal interconnection of semiconductor device and method for forming the same'
[patent_app_type] => utility
[patent_app_number] => 11/612638
[patent_app_country] => US
[patent_app_date] => 2006-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 2947
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[pdf_file] => patents/07/763/07763537.pdf
[firstpage_image] =>[orig_patent_app_number] => 11612638
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/612638 | Metal interconnection of semiconductor device and method for forming the same | Dec 18, 2006 | Issued |
Array
(
[id] => 5116918
[patent_doc_number] => 20070138632
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-21
[patent_title] => 'Electronic carrier board and package structure thereof'
[patent_app_type] => utility
[patent_app_number] => 11/642439
[patent_app_country] => US
[patent_app_date] => 2006-12-19
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11642439
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/642439 | Electronic carrier board and package structure thereof | Dec 18, 2006 | Abandoned |
Array
(
[id] => 4532610
[patent_doc_number] => 07923833
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-04-12
[patent_title] => 'Semiconductor module'
[patent_app_type] => utility
[patent_app_number] => 12/086715
[patent_app_country] => US
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[pdf_file] => patents/07/923/07923833.pdf
[firstpage_image] =>[orig_patent_app_number] => 12086715
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/086715 | Semiconductor module | Dec 10, 2006 | Issued |
Array
(
[id] => 196635
[patent_doc_number] => 07635913
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-12-22
[patent_title] => 'Stacked integrated circuit package-in-package system'
[patent_app_type] => utility
[patent_app_number] => 11/608829
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[patent_app_date] => 2006-12-09
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[pdf_file] => patents/07/635/07635913.pdf
[firstpage_image] =>[orig_patent_app_number] => 11608829
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/608829 | Stacked integrated circuit package-in-package system | Dec 8, 2006 | Issued |
Array
(
[id] => 6464307
[patent_doc_number] => 20100007006
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[patent_kind] => A1
[patent_issue_date] => 2010-01-14
[patent_title] => 'Integrated Semiconductor Outline Package'
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[patent_app_number] => 12/513906
[patent_app_country] => US
[patent_app_date] => 2006-12-05
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[pdf_file] => publications/A1/0007/20100007006.pdf
[firstpage_image] =>[orig_patent_app_number] => 12513906
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/513906 | Integrated semiconductor outline package | Dec 4, 2006 | Issued |
Array
(
[id] => 4829462
[patent_doc_number] => 20080128899
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-05
[patent_title] => 'System for clamping heat sink'
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[firstpage_image] =>[orig_patent_app_number] => 11607219
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/607219 | System for clamping heat sink | Nov 30, 2006 | Issued |
Array
(
[id] => 8549146
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[patent_kind] => B2
[patent_issue_date] => 2012-12-04
[patent_title] => 'Assembly comprising a support element and a chip, support element, method for shielding, and method for protecting'
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11607218
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/607218 | Assembly comprising a support element and a chip, support element, method for shielding, and method for protecting | Nov 30, 2006 | Issued |