Search

Hoa B. Trinh

Examiner (ID: 4300, Phone: (571)272-1719 , Office: P/2817 )

Most Active Art Unit
2814
Art Unit(s)
2817, 2813, 2893, 3731, 2814
Total Applications
1769
Issued Applications
1421
Pending Applications
107
Abandoned Applications
243

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5180732 [patent_doc_number] => 20070052074 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-08 [patent_title] => 'Optical coupling element, method for producing the optical coupling element, and electronic device equipped with the optical coupling element' [patent_app_type] => utility [patent_app_number] => 11/510598 [patent_app_country] => US [patent_app_date] => 2006-08-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3935 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0052/20070052074.pdf [firstpage_image] =>[orig_patent_app_number] => 11510598 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/510598
Optical coupling element, method for producing the optical coupling element, and electronic device equipped with the optical coupling element Aug 27, 2006 Abandoned
Array ( [id] => 278363 [patent_doc_number] => 07557440 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-07-07 [patent_title] => 'Wiring board and ceramic chip to be embedded' [patent_app_type] => utility [patent_app_number] => 11/508968 [patent_app_country] => US [patent_app_date] => 2006-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 19 [patent_no_of_words] => 12232 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 265 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/557/07557440.pdf [firstpage_image] =>[orig_patent_app_number] => 11508968 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/508968
Wiring board and ceramic chip to be embedded Aug 23, 2006 Issued
Array ( [id] => 4768787 [patent_doc_number] => 20080054443 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-03-06 [patent_title] => 'Carrier board structure with semiconductor chip embedded therein' [patent_app_type] => utility [patent_app_number] => 11/508708 [patent_app_country] => US [patent_app_date] => 2006-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3096 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0054/20080054443.pdf [firstpage_image] =>[orig_patent_app_number] => 11508708 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/508708
Carrier board structure with semiconductor chip embedded therein Aug 22, 2006 Abandoned
Array ( [id] => 4667185 [patent_doc_number] => 20080042245 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-21 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFERSCALE SPACER' [patent_app_type] => utility [patent_app_number] => 11/465706 [patent_app_country] => US [patent_app_date] => 2006-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3520 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0042/20080042245.pdf [firstpage_image] =>[orig_patent_app_number] => 11465706 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/465706
Integrated circuit package system with waferscale spacer Aug 17, 2006 Issued
Array ( [id] => 5145810 [patent_doc_number] => 20070045864 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-01 [patent_title] => 'Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/503129 [patent_app_country] => US [patent_app_date] => 2006-08-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 6379 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0045/20070045864.pdf [firstpage_image] =>[orig_patent_app_number] => 11503129 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/503129
Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same Aug 13, 2006 Abandoned
Array ( [id] => 373274 [patent_doc_number] => 07473577 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-01-06 [patent_title] => 'Integrated chip carrier with compliant interconnect' [patent_app_type] => utility [patent_app_number] => 11/502969 [patent_app_country] => US [patent_app_date] => 2006-08-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 35 [patent_no_of_words] => 2448 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/473/07473577.pdf [firstpage_image] =>[orig_patent_app_number] => 11502969 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/502969
Integrated chip carrier with compliant interconnect Aug 10, 2006 Issued
Array ( [id] => 5168925 [patent_doc_number] => 20070069356 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-29 [patent_title] => 'Optical parts cap and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/501698 [patent_app_country] => US [patent_app_date] => 2006-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4168 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0069/20070069356.pdf [firstpage_image] =>[orig_patent_app_number] => 11501698 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/501698
Optical parts cap and method of manufacturing the same Aug 9, 2006 Abandoned
Array ( [id] => 363372 [patent_doc_number] => 07482182 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-01-27 [patent_title] => 'Semiconductor device and method of manufacturing same' [patent_app_type] => utility [patent_app_number] => 11/497618 [patent_app_country] => US [patent_app_date] => 2006-08-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 27 [patent_no_of_words] => 13400 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/482/07482182.pdf [firstpage_image] =>[orig_patent_app_number] => 11497618 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/497618
Semiconductor device and method of manufacturing same Aug 1, 2006 Issued
Array ( [id] => 4980651 [patent_doc_number] => 20070085207 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-04-19 [patent_title] => 'Pad structure, method of forming a pad structure, semiconductor device having a pad structure and method of manufacturing a semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/497279 [patent_app_country] => US [patent_app_date] => 2006-08-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 10756 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0085/20070085207.pdf [firstpage_image] =>[orig_patent_app_number] => 11497279 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/497279
Pad structure, method of forming a pad structure, semiconductor device having a pad structure and method of manufacturing a semiconductor device Aug 1, 2006 Abandoned
Array ( [id] => 840364 [patent_doc_number] => 07390692 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-06-24 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/497169 [patent_app_country] => US [patent_app_date] => 2006-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 50 [patent_no_of_words] => 19526 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 205 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/390/07390692.pdf [firstpage_image] =>[orig_patent_app_number] => 11497169 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/497169
Semiconductor device and method for manufacturing the same Jul 31, 2006 Issued
Array ( [id] => 4654992 [patent_doc_number] => 20080023852 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-31 [patent_title] => 'Metal pad of mode dial and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/495678 [patent_app_country] => US [patent_app_date] => 2006-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1388 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20080023852.pdf [firstpage_image] =>[orig_patent_app_number] => 11495678 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/495678
Metal pad of mode dial and manufacturing method thereof Jul 30, 2006 Abandoned
Array ( [id] => 55050 [patent_doc_number] => 07768116 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-08-03 [patent_title] => 'Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 11/495649 [patent_app_country] => US [patent_app_date] => 2006-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 26 [patent_no_of_words] => 4317 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/768/07768116.pdf [firstpage_image] =>[orig_patent_app_number] => 11495649 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/495649
Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same Jul 30, 2006 Issued
Array ( [id] => 5145594 [patent_doc_number] => 20070045648 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-01 [patent_title] => 'Package structure of light emitting diode' [patent_app_type] => utility [patent_app_number] => 11/493769 [patent_app_country] => US [patent_app_date] => 2006-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3074 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0045/20070045648.pdf [firstpage_image] =>[orig_patent_app_number] => 11493769 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/493769
Package structure of light emitting diode Jul 26, 2006 Abandoned
Array ( [id] => 5133786 [patent_doc_number] => 20070075415 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-04-05 [patent_title] => 'Semiconductor device and semiconductor device production method' [patent_app_type] => utility [patent_app_number] => 11/492918 [patent_app_country] => US [patent_app_date] => 2006-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 6843 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0075/20070075415.pdf [firstpage_image] =>[orig_patent_app_number] => 11492918 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/492918
Semiconductor device and semiconductor device production method Jul 25, 2006 Abandoned
Array ( [id] => 5202357 [patent_doc_number] => 20070023836 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-02-01 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/492879 [patent_app_country] => US [patent_app_date] => 2006-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 7811 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20070023836.pdf [firstpage_image] =>[orig_patent_app_number] => 11492879 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/492879
Semiconductor device Jul 25, 2006 Abandoned
Array ( [id] => 204557 [patent_doc_number] => 07629238 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-12-08 [patent_title] => 'Device isolation structure of a semiconductor device and method of forming the same' [patent_app_type] => utility [patent_app_number] => 11/494388 [patent_app_country] => US [patent_app_date] => 2006-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2619 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 201 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/629/07629238.pdf [firstpage_image] =>[orig_patent_app_number] => 11494388 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/494388
Device isolation structure of a semiconductor device and method of forming the same Jul 25, 2006 Issued
Array ( [id] => 205387 [patent_doc_number] => 07629688 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-12-08 [patent_title] => 'Bonded structure and bonding method' [patent_app_type] => utility [patent_app_number] => 11/491029 [patent_app_country] => US [patent_app_date] => 2006-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 10 [patent_no_of_words] => 3884 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/629/07629688.pdf [firstpage_image] =>[orig_patent_app_number] => 11491029 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/491029
Bonded structure and bonding method Jul 23, 2006 Issued
Array ( [id] => 583335 [patent_doc_number] => 07453093 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-11-18 [patent_title] => 'LED package and fabricating method thereof' [patent_app_type] => utility [patent_app_number] => 11/489578 [patent_app_country] => US [patent_app_date] => 2006-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4129 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/453/07453093.pdf [firstpage_image] =>[orig_patent_app_number] => 11489578 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/489578
LED package and fabricating method thereof Jul 19, 2006 Issued
Array ( [id] => 5049132 [patent_doc_number] => 20070029676 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-02-08 [patent_title] => 'Semiconductor device and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/489668 [patent_app_country] => US [patent_app_date] => 2006-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 38 [patent_no_of_words] => 29878 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0029/20070029676.pdf [firstpage_image] =>[orig_patent_app_number] => 11489668 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/489668
Semiconductor device and method for manufacturing the same Jul 19, 2006 Abandoned
Array ( [id] => 4600843 [patent_doc_number] => 07977801 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-07-12 [patent_title] => 'Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method' [patent_app_type] => utility [patent_app_number] => 11/995356 [patent_app_country] => US [patent_app_date] => 2006-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 30 [patent_no_of_words] => 15352 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 302 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/977/07977801.pdf [firstpage_image] =>[orig_patent_app_number] => 11995356 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/995356
Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method Jul 13, 2006 Issued
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