
Hoa B. Trinh
Examiner (ID: 4300, Phone: (571)272-1719 , Office: P/2817 )
| Most Active Art Unit | 2814 |
| Art Unit(s) | 2817, 2813, 2893, 3731, 2814 |
| Total Applications | 1769 |
| Issued Applications | 1421 |
| Pending Applications | 107 |
| Abandoned Applications | 243 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5180732
[patent_doc_number] => 20070052074
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-08
[patent_title] => 'Optical coupling element, method for producing the optical coupling element, and electronic device equipped with the optical coupling element'
[patent_app_type] => utility
[patent_app_number] => 11/510598
[patent_app_country] => US
[patent_app_date] => 2006-08-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3935
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0052/20070052074.pdf
[firstpage_image] =>[orig_patent_app_number] => 11510598
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/510598 | Optical coupling element, method for producing the optical coupling element, and electronic device equipped with the optical coupling element | Aug 27, 2006 | Abandoned |
Array
(
[id] => 278363
[patent_doc_number] => 07557440
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-07-07
[patent_title] => 'Wiring board and ceramic chip to be embedded'
[patent_app_type] => utility
[patent_app_number] => 11/508968
[patent_app_country] => US
[patent_app_date] => 2006-08-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 19
[patent_no_of_words] => 12232
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 265
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/557/07557440.pdf
[firstpage_image] =>[orig_patent_app_number] => 11508968
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/508968 | Wiring board and ceramic chip to be embedded | Aug 23, 2006 | Issued |
Array
(
[id] => 4768787
[patent_doc_number] => 20080054443
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-03-06
[patent_title] => 'Carrier board structure with semiconductor chip embedded therein'
[patent_app_type] => utility
[patent_app_number] => 11/508708
[patent_app_country] => US
[patent_app_date] => 2006-08-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 3096
[patent_no_of_claims] => 10
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[pdf_file] => publications/A1/0054/20080054443.pdf
[firstpage_image] =>[orig_patent_app_number] => 11508708
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/508708 | Carrier board structure with semiconductor chip embedded therein | Aug 22, 2006 | Abandoned |
Array
(
[id] => 4667185
[patent_doc_number] => 20080042245
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-21
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFERSCALE SPACER'
[patent_app_type] => utility
[patent_app_number] => 11/465706
[patent_app_country] => US
[patent_app_date] => 2006-08-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3520
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0042/20080042245.pdf
[firstpage_image] =>[orig_patent_app_number] => 11465706
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/465706 | Integrated circuit package system with waferscale spacer | Aug 17, 2006 | Issued |
Array
(
[id] => 5145810
[patent_doc_number] => 20070045864
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-01
[patent_title] => 'Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/503129
[patent_app_country] => US
[patent_app_date] => 2006-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 13
[patent_no_of_words] => 6379
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0045/20070045864.pdf
[firstpage_image] =>[orig_patent_app_number] => 11503129
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/503129 | Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same | Aug 13, 2006 | Abandoned |
Array
(
[id] => 373274
[patent_doc_number] => 07473577
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-01-06
[patent_title] => 'Integrated chip carrier with compliant interconnect'
[patent_app_type] => utility
[patent_app_number] => 11/502969
[patent_app_country] => US
[patent_app_date] => 2006-08-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[patent_no_of_words] => 2448
[patent_no_of_claims] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/473/07473577.pdf
[firstpage_image] =>[orig_patent_app_number] => 11502969
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/502969 | Integrated chip carrier with compliant interconnect | Aug 10, 2006 | Issued |
Array
(
[id] => 5168925
[patent_doc_number] => 20070069356
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-29
[patent_title] => 'Optical parts cap and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/501698
[patent_app_country] => US
[patent_app_date] => 2006-08-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 4168
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0069/20070069356.pdf
[firstpage_image] =>[orig_patent_app_number] => 11501698
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/501698 | Optical parts cap and method of manufacturing the same | Aug 9, 2006 | Abandoned |
Array
(
[id] => 363372
[patent_doc_number] => 07482182
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-01-27
[patent_title] => 'Semiconductor device and method of manufacturing same'
[patent_app_type] => utility
[patent_app_number] => 11/497618
[patent_app_country] => US
[patent_app_date] => 2006-08-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 27
[patent_no_of_words] => 13400
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 125
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/482/07482182.pdf
[firstpage_image] =>[orig_patent_app_number] => 11497618
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/497618 | Semiconductor device and method of manufacturing same | Aug 1, 2006 | Issued |
Array
(
[id] => 4980651
[patent_doc_number] => 20070085207
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-04-19
[patent_title] => 'Pad structure, method of forming a pad structure, semiconductor device having a pad structure and method of manufacturing a semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/497279
[patent_app_country] => US
[patent_app_date] => 2006-08-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 10756
[patent_no_of_claims] => 33
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[pdf_file] => publications/A1/0085/20070085207.pdf
[firstpage_image] =>[orig_patent_app_number] => 11497279
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/497279 | Pad structure, method of forming a pad structure, semiconductor device having a pad structure and method of manufacturing a semiconductor device | Aug 1, 2006 | Abandoned |
Array
(
[id] => 840364
[patent_doc_number] => 07390692
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-06-24
[patent_title] => 'Semiconductor device and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/497169
[patent_app_country] => US
[patent_app_date] => 2006-08-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
[patent_figures_cnt] => 50
[patent_no_of_words] => 19526
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[pdf_file] => patents/07/390/07390692.pdf
[firstpage_image] =>[orig_patent_app_number] => 11497169
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/497169 | Semiconductor device and method for manufacturing the same | Jul 31, 2006 | Issued |
Array
(
[id] => 4654992
[patent_doc_number] => 20080023852
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-31
[patent_title] => 'Metal pad of mode dial and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/495678
[patent_app_country] => US
[patent_app_date] => 2006-07-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => publications/A1/0023/20080023852.pdf
[firstpage_image] =>[orig_patent_app_number] => 11495678
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/495678 | Metal pad of mode dial and manufacturing method thereof | Jul 30, 2006 | Abandoned |
Array
(
[id] => 55050
[patent_doc_number] => 07768116
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-08-03
[patent_title] => 'Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/495649
[patent_app_country] => US
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[pdf_file] => patents/07/768/07768116.pdf
[firstpage_image] =>[orig_patent_app_number] => 11495649
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/495649 | Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same | Jul 30, 2006 | Issued |
Array
(
[id] => 5145594
[patent_doc_number] => 20070045648
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-01
[patent_title] => 'Package structure of light emitting diode'
[patent_app_type] => utility
[patent_app_number] => 11/493769
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11493769
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/493769 | Package structure of light emitting diode | Jul 26, 2006 | Abandoned |
Array
(
[id] => 5133786
[patent_doc_number] => 20070075415
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-04-05
[patent_title] => 'Semiconductor device and semiconductor device production method'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/492918 | Semiconductor device and semiconductor device production method | Jul 25, 2006 | Abandoned |
Array
(
[id] => 5202357
[patent_doc_number] => 20070023836
[patent_country] => US
[patent_kind] => A1
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[patent_title] => 'Semiconductor device'
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[firstpage_image] =>[orig_patent_app_number] => 11492879
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/492879 | Semiconductor device | Jul 25, 2006 | Abandoned |
Array
(
[id] => 204557
[patent_doc_number] => 07629238
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[patent_kind] => B2
[patent_issue_date] => 2009-12-08
[patent_title] => 'Device isolation structure of a semiconductor device and method of forming the same'
[patent_app_type] => utility
[patent_app_number] => 11/494388
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[firstpage_image] =>[orig_patent_app_number] => 11494388
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/494388 | Device isolation structure of a semiconductor device and method of forming the same | Jul 25, 2006 | Issued |
Array
(
[id] => 205387
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[patent_issue_date] => 2009-12-08
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[firstpage_image] =>[orig_patent_app_number] => 11491029
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/491029 | Bonded structure and bonding method | Jul 23, 2006 | Issued |
Array
(
[id] => 583335
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[firstpage_image] =>[orig_patent_app_number] => 11489578
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/489578 | LED package and fabricating method thereof | Jul 19, 2006 | Issued |
Array
(
[id] => 5049132
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[firstpage_image] =>[orig_patent_app_number] => 11489668
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/489668 | Semiconductor device and method for manufacturing the same | Jul 19, 2006 | Abandoned |
Array
(
[id] => 4600843
[patent_doc_number] => 07977801
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[patent_kind] => B2
[patent_issue_date] => 2011-07-12
[patent_title] => 'Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method'
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/977/07977801.pdf
[firstpage_image] =>[orig_patent_app_number] => 11995356
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/995356 | Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method | Jul 13, 2006 | Issued |