
Hoa B. Trinh
Examiner (ID: 4300, Phone: (571)272-1719 , Office: P/2817 )
| Most Active Art Unit | 2814 |
| Art Unit(s) | 2817, 2813, 2893, 3731, 2814 |
| Total Applications | 1769 |
| Issued Applications | 1421 |
| Pending Applications | 107 |
| Abandoned Applications | 243 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7430044
[patent_doc_number] => 20040266177
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-12-30
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => new
[patent_app_number] => 10/895144
[patent_app_country] => US
[patent_app_date] => 2004-07-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 22
[patent_figures_cnt] => 22
[patent_no_of_words] => 20612
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[pdf_file] => publications/A1/0266/20040266177.pdf
[firstpage_image] =>[orig_patent_app_number] => 10895144
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/895144 | Semiconductor device and method of manufacturing the same | Jul 20, 2004 | Issued |
Array
(
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[patent_doc_number] => 20050040406
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-02-24
[patent_title] => 'Semiconductor light emitting device'
[patent_app_type] => utility
[patent_app_number] => 10/889409
[patent_app_country] => US
[patent_app_date] => 2004-07-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[firstpage_image] =>[orig_patent_app_number] => 10889409
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/889409 | Semiconductor light emitting device | Jul 11, 2004 | Abandoned |
Array
(
[id] => 609932
[patent_doc_number] => 07151316
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-12-19
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 10/886649
[patent_app_country] => US
[patent_app_date] => 2004-07-09
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[patent_drawing_sheets_cnt] => 14
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[pdf_file] => patents/07/151/07151316.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/886649 | Semiconductor device | Jul 8, 2004 | Issued |
Array
(
[id] => 5736011
[patent_doc_number] => 20060006401
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-01-12
[patent_title] => 'Flip chip light emitting diode'
[patent_app_type] => utility
[patent_app_number] => 10/887668
[patent_app_country] => US
[patent_app_date] => 2004-07-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => publications/A1/0006/20060006401.pdf
[firstpage_image] =>[orig_patent_app_number] => 10887668
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/887668 | Flip chip light emitting diode | Jul 7, 2004 | Abandoned |
Array
(
[id] => 7527794
[patent_doc_number] => 08044387
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2011-10-25
[patent_title] => 'Semiconductor device built on plastic substrate'
[patent_app_type] => utility
[patent_app_number] => 10/885959
[patent_app_country] => US
[patent_app_date] => 2004-07-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/08/044/08044387.pdf
[firstpage_image] =>[orig_patent_app_number] => 10885959
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/885959 | Semiconductor device built on plastic substrate | Jul 6, 2004 | Issued |
Array
(
[id] => 5892611
[patent_doc_number] => 20060001148
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-01-05
[patent_title] => 'Finger structure'
[patent_app_type] => utility
[patent_app_number] => 10/880738
[patent_app_country] => US
[patent_app_date] => 2004-07-01
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 10880738
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/880738 | Packaging stacked chips with finger structure | Jun 30, 2004 | Issued |
Array
(
[id] => 5892612
[patent_doc_number] => 20060001149
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[patent_kind] => A1
[patent_issue_date] => 2006-01-05
[patent_title] => 'Packaged substrate having variable width conductors and a variably spaced reference plane'
[patent_app_type] => utility
[patent_app_number] => 10/883049
[patent_app_country] => US
[patent_app_date] => 2004-06-30
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[patent_drawing_sheets_cnt] => 5
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[pdf_file] => publications/A1/0001/20060001149.pdf
[firstpage_image] =>[orig_patent_app_number] => 10883049
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/883049 | Packaged substrate having variable width conductors and a variably spaced reference plane | Jun 29, 2004 | Abandoned |
Array
(
[id] => 6978234
[patent_doc_number] => 20050287952
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-12-29
[patent_title] => 'Heat sink formed of multiple metal layers on backside of integrated circuit die'
[patent_app_type] => utility
[patent_app_number] => 10/879909
[patent_app_country] => US
[patent_app_date] => 2004-06-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3766
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[pdf_file] => publications/A1/0287/20050287952.pdf
[firstpage_image] =>[orig_patent_app_number] => 10879909
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/879909 | Heat sink formed of multiple metal layers on backside of integrated circuit die | Jun 28, 2004 | Issued |
Array
(
[id] => 7405197
[patent_doc_number] => 20040262753
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-12-30
[patent_title] => 'Flip chip packaging structure and related packaging method'
[patent_app_type] => new
[patent_app_number] => 10/874289
[patent_app_country] => US
[patent_app_date] => 2004-06-24
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[pdf_file] => publications/A1/0262/20040262753.pdf
[firstpage_image] =>[orig_patent_app_number] => 10874289
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/874289 | Flip chip packaging structure and related packaging method | Jun 23, 2004 | Issued |
Array
(
[id] => 817473
[patent_doc_number] => 07411281
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-08-12
[patent_title] => 'Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same'
[patent_app_type] => utility
[patent_app_number] => 10/870928
[patent_app_country] => US
[patent_app_date] => 2004-06-21
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[patent_drawing_sheets_cnt] => 10
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[pdf_file] => patents/07/411/07411281.pdf
[firstpage_image] =>[orig_patent_app_number] => 10870928
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/870928 | Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same | Jun 20, 2004 | Issued |
Array
(
[id] => 480135
[patent_doc_number] => 07224045
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-05-29
[patent_title] => 'Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 10/869949
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/869949 | Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package | Jun 17, 2004 | Issued |
Array
(
[id] => 6963906
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[patent_title] => 'Leadframe packaging structure and the method of manufacturing the same'
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Array
(
[id] => 7205871
[patent_doc_number] => 20050258429
[patent_country] => US
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[patent_issue_date] => 2005-11-24
[patent_title] => 'Color oled device having improved peformance'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/845038 | Color OLED device having improved performance | May 12, 2004 | Issued |
Array
(
[id] => 7043349
[patent_doc_number] => 20050247944
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[patent_issue_date] => 2005-11-10
[patent_title] => 'Semiconductor light emitting device with flexible substrate'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/840459 | Semiconductor light emitting device with flexible substrate | May 4, 2004 | Abandoned |
Array
(
[id] => 7043433
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[patent_issue_date] => 2005-11-10
[patent_title] => 'CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE'
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Array
(
[id] => 491550
[patent_doc_number] => 07215017
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[patent_title] => 'Wafer level package, wafer level packaging procedure for making wafer level package'
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[patent_app_number] => 10/833149
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/833149 | Wafer level package, wafer level packaging procedure for making wafer level package | Apr 27, 2004 | Issued |
Array
(
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Array
(
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Array
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/747128 | Multi-chips stacked package | Dec 29, 2003 | Issued |