Search

Hoa B. Trinh

Examiner (ID: 4300, Phone: (571)272-1719 , Office: P/2817 )

Most Active Art Unit
2814
Art Unit(s)
2817, 2813, 2893, 3731, 2814
Total Applications
1769
Issued Applications
1421
Pending Applications
107
Abandoned Applications
243

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 7430044 [patent_doc_number] => 20040266177 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-12-30 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => new [patent_app_number] => 10/895144 [patent_app_country] => US [patent_app_date] => 2004-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 20612 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0266/20040266177.pdf [firstpage_image] =>[orig_patent_app_number] => 10895144 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/895144
Semiconductor device and method of manufacturing the same Jul 20, 2004 Issued
Array ( [id] => 7191069 [patent_doc_number] => 20050040406 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-02-24 [patent_title] => 'Semiconductor light emitting device' [patent_app_type] => utility [patent_app_number] => 10/889409 [patent_app_country] => US [patent_app_date] => 2004-07-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5947 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0040/20050040406.pdf [firstpage_image] =>[orig_patent_app_number] => 10889409 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/889409
Semiconductor light emitting device Jul 11, 2004 Abandoned
Array ( [id] => 609932 [patent_doc_number] => 07151316 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-12-19 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/886649 [patent_app_country] => US [patent_app_date] => 2004-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 22 [patent_no_of_words] => 4060 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/151/07151316.pdf [firstpage_image] =>[orig_patent_app_number] => 10886649 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/886649
Semiconductor device Jul 8, 2004 Issued
Array ( [id] => 5736011 [patent_doc_number] => 20060006401 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-01-12 [patent_title] => 'Flip chip light emitting diode' [patent_app_type] => utility [patent_app_number] => 10/887668 [patent_app_country] => US [patent_app_date] => 2004-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1424 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20060006401.pdf [firstpage_image] =>[orig_patent_app_number] => 10887668 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/887668
Flip chip light emitting diode Jul 7, 2004 Abandoned
Array ( [id] => 7527794 [patent_doc_number] => 08044387 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2011-10-25 [patent_title] => 'Semiconductor device built on plastic substrate' [patent_app_type] => utility [patent_app_number] => 10/885959 [patent_app_country] => US [patent_app_date] => 2004-07-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4611 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/044/08044387.pdf [firstpage_image] =>[orig_patent_app_number] => 10885959 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/885959
Semiconductor device built on plastic substrate Jul 6, 2004 Issued
Array ( [id] => 5892611 [patent_doc_number] => 20060001148 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-01-05 [patent_title] => 'Finger structure' [patent_app_type] => utility [patent_app_number] => 10/880738 [patent_app_country] => US [patent_app_date] => 2004-07-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 1428 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20060001148.pdf [firstpage_image] =>[orig_patent_app_number] => 10880738 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/880738
Packaging stacked chips with finger structure Jun 30, 2004 Issued
Array ( [id] => 5892612 [patent_doc_number] => 20060001149 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-01-05 [patent_title] => 'Packaged substrate having variable width conductors and a variably spaced reference plane' [patent_app_type] => utility [patent_app_number] => 10/883049 [patent_app_country] => US [patent_app_date] => 2004-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2043 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20060001149.pdf [firstpage_image] =>[orig_patent_app_number] => 10883049 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/883049
Packaged substrate having variable width conductors and a variably spaced reference plane Jun 29, 2004 Abandoned
Array ( [id] => 6978234 [patent_doc_number] => 20050287952 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-12-29 [patent_title] => 'Heat sink formed of multiple metal layers on backside of integrated circuit die' [patent_app_type] => utility [patent_app_number] => 10/879909 [patent_app_country] => US [patent_app_date] => 2004-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3766 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0287/20050287952.pdf [firstpage_image] =>[orig_patent_app_number] => 10879909 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/879909
Heat sink formed of multiple metal layers on backside of integrated circuit die Jun 28, 2004 Issued
Array ( [id] => 7405197 [patent_doc_number] => 20040262753 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-12-30 [patent_title] => 'Flip chip packaging structure and related packaging method' [patent_app_type] => new [patent_app_number] => 10/874289 [patent_app_country] => US [patent_app_date] => 2004-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 9265 [patent_no_of_claims] => 46 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0262/20040262753.pdf [firstpage_image] =>[orig_patent_app_number] => 10874289 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/874289
Flip chip packaging structure and related packaging method Jun 23, 2004 Issued
Array ( [id] => 817473 [patent_doc_number] => 07411281 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-08-12 [patent_title] => 'Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same' [patent_app_type] => utility [patent_app_number] => 10/870928 [patent_app_country] => US [patent_app_date] => 2004-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 15 [patent_no_of_words] => 5405 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/411/07411281.pdf [firstpage_image] =>[orig_patent_app_number] => 10870928 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/870928
Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same Jun 20, 2004 Issued
Array ( [id] => 480135 [patent_doc_number] => 07224045 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-05-29 [patent_title] => 'Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package' [patent_app_type] => utility [patent_app_number] => 10/869949 [patent_app_country] => US [patent_app_date] => 2004-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 39 [patent_no_of_words] => 11190 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 166 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/224/07224045.pdf [firstpage_image] =>[orig_patent_app_number] => 10869949 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/869949
Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package Jun 17, 2004 Issued
Array ( [id] => 6963906 [patent_doc_number] => 20050230803 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-10-20 [patent_title] => 'Leadframe packaging structure and the method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/864368 [patent_app_country] => US [patent_app_date] => 2004-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 2851 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0230/20050230803.pdf [firstpage_image] =>[orig_patent_app_number] => 10864368 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/864368
Leadframe packaging structure and the method of manufacturing the same Jun 9, 2004 Abandoned
Array ( [id] => 7205871 [patent_doc_number] => 20050258429 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-11-24 [patent_title] => 'Color oled device having improved peformance' [patent_app_type] => utility [patent_app_number] => 10/845038 [patent_app_country] => US [patent_app_date] => 2004-05-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 5078 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0258/20050258429.pdf [firstpage_image] =>[orig_patent_app_number] => 10845038 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/845038
Color OLED device having improved performance May 12, 2004 Issued
Array ( [id] => 7043349 [patent_doc_number] => 20050247944 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-11-10 [patent_title] => 'Semiconductor light emitting device with flexible substrate' [patent_app_type] => utility [patent_app_number] => 10/840459 [patent_app_country] => US [patent_app_date] => 2004-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3292 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0247/20050247944.pdf [firstpage_image] =>[orig_patent_app_number] => 10840459 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/840459
Semiconductor light emitting device with flexible substrate May 4, 2004 Abandoned
Array ( [id] => 7043433 [patent_doc_number] => 20050248028 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-11-10 [patent_title] => 'CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE' [patent_app_type] => utility [patent_app_number] => 10/709428 [patent_app_country] => US [patent_app_date] => 2004-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2580 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0248/20050248028.pdf [firstpage_image] =>[orig_patent_app_number] => 10709428 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/709428
CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE May 4, 2004 Abandoned
Array ( [id] => 491550 [patent_doc_number] => 07215017 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-05-08 [patent_title] => 'Wafer level package, wafer level packaging procedure for making wafer level package' [patent_app_type] => utility [patent_app_number] => 10/833149 [patent_app_country] => US [patent_app_date] => 2004-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 3366 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/215/07215017.pdf [firstpage_image] =>[orig_patent_app_number] => 10833149 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/833149
Wafer level package, wafer level packaging procedure for making wafer level package Apr 27, 2004 Issued
Array ( [id] => 7291854 [patent_doc_number] => 20040212091 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-10-28 [patent_title] => 'Semiconductor device substrate' [patent_app_type] => new [patent_app_number] => 10/827318 [patent_app_country] => US [patent_app_date] => 2004-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3707 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0212/20040212091.pdf [firstpage_image] =>[orig_patent_app_number] => 10827318 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/827318
Semiconductor device substrate Apr 19, 2004 Abandoned
Array ( [id] => 7385631 [patent_doc_number] => 20040180296 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-09-16 [patent_title] => 'Novel method to improve bump reliability for flip chip device' [patent_app_type] => new [patent_app_number] => 10/810965 [patent_app_country] => US [patent_app_date] => 2004-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4911 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 214 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0180/20040180296.pdf [firstpage_image] =>[orig_patent_app_number] => 10810965 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/810965
Method to improve bump reliability for flip chip device Mar 25, 2004 Issued
Array ( [id] => 7421337 [patent_doc_number] => 20040183193 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-09-23 [patent_title] => 'Packaging method, packaging structure and package substrate for electronic parts' [patent_app_type] => new [patent_app_number] => 10/803879 [patent_app_country] => US [patent_app_date] => 2004-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 5649 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0183/20040183193.pdf [firstpage_image] =>[orig_patent_app_number] => 10803879 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/803879
Packaging method, packaging structure and package substrate for electronic parts Mar 18, 2004 Issued
Array ( [id] => 428982 [patent_doc_number] => 07268418 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-09-11 [patent_title] => 'Multi-chips stacked package' [patent_app_type] => utility [patent_app_number] => 10/747128 [patent_app_country] => US [patent_app_date] => 2003-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 2535 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 166 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/268/07268418.pdf [firstpage_image] =>[orig_patent_app_number] => 10747128 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/747128
Multi-chips stacked package Dec 29, 2003 Issued
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