
Hoa B. Trinh
Examiner (ID: 4300, Phone: (571)272-1719 , Office: P/2817 )
| Most Active Art Unit | 2814 |
| Art Unit(s) | 2817, 2813, 2893, 3731, 2814 |
| Total Applications | 1769 |
| Issued Applications | 1421 |
| Pending Applications | 107 |
| Abandoned Applications | 243 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7086590
[patent_doc_number] => 20050006702
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-01-13
[patent_title] => 'Semiconductor integrated circuit, semiconductor device, and semiconductor device fabrication method'
[patent_app_type] => utility
[patent_app_number] => 10/747149
[patent_app_country] => US
[patent_app_date] => 2003-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 5445
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0006/20050006702.pdf
[firstpage_image] =>[orig_patent_app_number] => 10747149
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/747149 | Semiconductor device with an enhancement type field effect transistor in which threshold voltage is dependent upon substrate bias voltage | Dec 29, 2003 | Issued |
Array
(
[id] => 7260474
[patent_doc_number] => 20040150116
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-08-05
[patent_title] => 'Thermal enhance MCM package'
[patent_app_type] => new
[patent_app_number] => 10/747038
[patent_app_country] => US
[patent_app_date] => 2003-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 1546
[patent_no_of_claims] => 19
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[pdf_file] => publications/A1/0150/20040150116.pdf
[firstpage_image] =>[orig_patent_app_number] => 10747038
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/747038 | Thermal enhance MCM package | Dec 29, 2003 | Issued |
Array
(
[id] => 756439
[patent_doc_number] => 07019407
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-03-28
[patent_title] => 'Flip chip package structure'
[patent_app_type] => utility
[patent_app_number] => 10/707609
[patent_app_country] => US
[patent_app_date] => 2003-12-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 12
[patent_no_of_words] => 4166
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 172
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/019/07019407.pdf
[firstpage_image] =>[orig_patent_app_number] => 10707609
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/707609 | Flip chip package structure | Dec 23, 2003 | Issued |
Array
(
[id] => 504538
[patent_doc_number] => 07202115
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-04-10
[patent_title] => 'Thin film transistor, its manufacture method and display device'
[patent_app_type] => utility
[patent_app_number] => 10/745419
[patent_app_country] => US
[patent_app_date] => 2003-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 17
[patent_no_of_words] => 5227
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 158
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/202/07202115.pdf
[firstpage_image] =>[orig_patent_app_number] => 10745419
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/745419 | Thin film transistor, its manufacture method and display device | Dec 21, 2003 | Issued |
Array
(
[id] => 659688
[patent_doc_number] => 07105913
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-09-12
[patent_title] => 'Two-layer patterned resistor'
[patent_app_type] => utility
[patent_app_number] => 10/743589
[patent_app_country] => US
[patent_app_date] => 2003-12-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 13
[patent_no_of_words] => 5189
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 199
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/105/07105913.pdf
[firstpage_image] =>[orig_patent_app_number] => 10743589
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/743589 | Two-layer patterned resistor | Dec 21, 2003 | Issued |
Array
(
[id] => 975975
[patent_doc_number] => 06933592
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-08-23
[patent_title] => 'Substrate structure capable of reducing package singular stress'
[patent_app_type] => utility
[patent_app_number] => 10/739168
[patent_app_country] => US
[patent_app_date] => 2003-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1212
[patent_no_of_claims] => 5
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/933/06933592.pdf
[firstpage_image] =>[orig_patent_app_number] => 10739168
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/739168 | Substrate structure capable of reducing package singular stress | Dec 18, 2003 | Issued |
Array
(
[id] => 7295847
[patent_doc_number] => 20040124443
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-01
[patent_title] => 'Semiconductor device and manufacturing method thereof'
[patent_app_type] => new
[patent_app_number] => 10/735759
[patent_app_country] => US
[patent_app_date] => 2003-12-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 6169
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0124/20040124443.pdf
[firstpage_image] =>[orig_patent_app_number] => 10735759
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/735759 | Semiconductor device and manufacturing method thereof | Dec 15, 2003 | Abandoned |
Array
(
[id] => 896170
[patent_doc_number] => 07342254
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-03-11
[patent_title] => 'Light-emitting device having a diffractive film on its light-output face and manufacturing method therefor'
[patent_app_type] => utility
[patent_app_number] => 10/506258
[patent_app_country] => US
[patent_app_date] => 2003-12-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 18
[patent_no_of_words] => 5708
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 86
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/342/07342254.pdf
[firstpage_image] =>[orig_patent_app_number] => 10506258
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/506258 | Light-emitting device having a diffractive film on its light-output face and manufacturing method therefor | Dec 3, 2003 | Issued |
Array
(
[id] => 935665
[patent_doc_number] => 06975015
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-12-13
[patent_title] => 'Modulated trigger device'
[patent_app_type] => utility
[patent_app_number] => 10/707289
[patent_app_country] => US
[patent_app_date] => 2003-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 26
[patent_no_of_words] => 4457
[patent_no_of_claims] => 9
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/975/06975015.pdf
[firstpage_image] =>[orig_patent_app_number] => 10707289
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/707289 | Modulated trigger device | Dec 2, 2003 | Issued |
Array
(
[id] => 803632
[patent_doc_number] => 07423337
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2008-09-09
[patent_title] => 'Integrated circuit device package having a support coating for improved reliability during temperature cycling'
[patent_app_type] => utility
[patent_app_number] => 10/707208
[patent_app_country] => US
[patent_app_date] => 2003-11-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 14
[patent_no_of_words] => 5080
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/423/07423337.pdf
[firstpage_image] =>[orig_patent_app_number] => 10707208
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/707208 | Integrated circuit device package having a support coating for improved reliability during temperature cycling | Nov 25, 2003 | Issued |
Array
(
[id] => 7101352
[patent_doc_number] => 20050104078
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-19
[patent_title] => 'Light-emitting diode having chemical compound based reflective structure'
[patent_app_type] => utility
[patent_app_number] => 10/705929
[patent_app_country] => US
[patent_app_date] => 2003-11-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0104/20050104078.pdf
[firstpage_image] =>[orig_patent_app_number] => 10705929
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/705929 | Light-emitting diode having chemical compound based reflective structure | Nov 12, 2003 | Abandoned |
Array
(
[id] => 7198889
[patent_doc_number] => 20050051897
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-03-10
[patent_title] => 'Bonding pad design for impedance matching improvement'
[patent_app_type] => utility
[patent_app_number] => 10/705978
[patent_app_country] => US
[patent_app_date] => 2003-11-13
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[pdf_file] => publications/A1/0051/20050051897.pdf
[firstpage_image] =>[orig_patent_app_number] => 10705978
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/705978 | Bonding pad design for impedance matching improvement | Nov 12, 2003 | Issued |
Array
(
[id] => 495917
[patent_doc_number] => 07211879
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2007-05-01
[patent_title] => 'Semiconductor package with chamfered corners and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 10/706468
[patent_app_country] => US
[patent_app_date] => 2003-11-12
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/211/07211879.pdf
[firstpage_image] =>[orig_patent_app_number] => 10706468
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/706468 | Semiconductor package with chamfered corners and method of manufacturing the same | Nov 11, 2003 | Issued |
Array
(
[id] => 7466951
[patent_doc_number] => 20040102037
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-05-27
[patent_title] => 'Semiconductor device production method and semiconductor device'
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0102/20040102037.pdf
[firstpage_image] =>[orig_patent_app_number] => 10704608
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/704608 | Semiconductor device production method | Nov 11, 2003 | Issued |
Array
(
[id] => 7286510
[patent_doc_number] => 20040108578
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-10
[patent_title] => 'Leadframe and method for manufacturing the same'
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[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0108/20040108578.pdf
[firstpage_image] =>[orig_patent_app_number] => 10702549
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/702549 | Leadframe and method for manufacturing the same | Nov 6, 2003 | Abandoned |
Array
(
[id] => 7030803
[patent_doc_number] => 20050029525
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-02-10
[patent_title] => 'Semiconductor device and method for fabricating the same'
[patent_app_type] => utility
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[pdf_file] => publications/A1/0029/20050029525.pdf
[firstpage_image] =>[orig_patent_app_number] => 10704089
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/704089 | Semiconductor device and method for fabricating the same | Nov 6, 2003 | Issued |
Array
(
[id] => 390610
[patent_doc_number] => 07301206
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-11-27
[patent_title] => 'Semiconductor-on-insulator SRAM configured using partially-depleted and fully-depleted transistors'
[patent_app_type] => utility
[patent_app_number] => 10/700869
[patent_app_country] => US
[patent_app_date] => 2003-11-04
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/301/07301206.pdf
[firstpage_image] =>[orig_patent_app_number] => 10700869
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/700869 | Semiconductor-on-insulator SRAM configured using partially-depleted and fully-depleted transistors | Nov 3, 2003 | Issued |
Array
(
[id] => 7354058
[patent_doc_number] => 20040089958
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-05-13
[patent_title] => 'Conductor wafer and substrate'
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[patent_app_number] => 10/698468
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[pdf_file] => publications/A1/0089/20040089958.pdf
[firstpage_image] =>[orig_patent_app_number] => 10698468
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/698468 | Conductor wafer and substrate | Nov 2, 2003 | Abandoned |
Array
(
[id] => 7323346
[patent_doc_number] => 20040251472
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-12-16
[patent_title] => 'Memory cell for modification of revision identifier in an integrated circuit chip'
[patent_app_type] => new
[patent_app_number] => 10/697079
[patent_app_country] => US
[patent_app_date] => 2003-10-31
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 10697079
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/697079 | Memory cell for modification of revision identifier in an integrated circuit chip | Oct 30, 2003 | Abandoned |
Array
(
[id] => 6969734
[patent_doc_number] => 20050035444
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-02-17
[patent_title] => 'Multi-chip package device with heat sink and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 10/696198
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[patent_app_date] => 2003-10-28
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0035/20050035444.pdf
[firstpage_image] =>[orig_patent_app_number] => 10696198
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/696198 | Multi-chip package device with heat sink and fabrication method thereof | Oct 27, 2003 | Abandoned |