
Hoa Cao Nguyen
Examiner (ID: 286, Phone: (571)272-8293 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2841, 2835, 2847 |
| Total Applications | 1364 |
| Issued Applications | 1099 |
| Pending Applications | 12 |
| Abandoned Applications | 265 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
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[id] => 13670951
[patent_doc_number] => 10165674
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[patent_kind] => B1
[patent_issue_date] => 2018-12-25
[patent_title] => Circuit board and electromagnetic bandgap structure thereof
[patent_app_type] => utility
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Array
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[patent_issue_date] => 2019-06-04
[patent_title] => Package assembly with hermetic cavity
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Array
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[patent_issue_date] => 2018-05-03
[patent_title] => CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND METHODS OF FABRICATING SAME
[patent_app_type] => utility
[patent_app_number] => 15/858791
[patent_app_country] => US
[patent_app_date] => 2017-12-29
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/858791 | Contact structures with porous networks for solder connections, and methods of fabricating same | Dec 28, 2017 | Issued |
Array
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[patent_title] => Higher density multi-component and serial packages
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/852799 | Higher density multi-component and serial packages | Dec 21, 2017 | Issued |
Array
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[patent_title] => CIRCUIT BOARD ASSEMBLIES AND METHODS OF ASSEMBLING CIRCUIT BOARDS AND BUS BARS
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Array
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[patent_title] => METHOD FOR MANUFACTURING CAPACITOR BUILT-IN SUBSTRATE
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Array
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Array
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[patent_title] => Method and apparatus for attaching magnetic components to printed circuit boards
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Array
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Array
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Array
(
[id] => 14433471
[patent_doc_number] => 10321564
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[patent_kind] => B2
[patent_issue_date] => 2019-06-11
[patent_title] => Solder assembly of pins to the peripheral end face of a printed circuit board
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Array
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Array
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Array
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[patent_title] => SHIELDING MOLD FOR ELECTRIC AND MAGNETIC EMI MITIGATION
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Array
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Array
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