
Hoa Cao Nguyen
Examiner (ID: 6011, Phone: (571)272-8293 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2847, 2835, 2841 |
| Total Applications | 1364 |
| Issued Applications | 1099 |
| Pending Applications | 12 |
| Abandoned Applications | 265 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 9631242
[patent_doc_number] => 20140209350
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-07-31
[patent_title] => 'PLATE-LIKE ELECTRIC CONDUCTOR FOR A BUSBAR AND THE BUSBAR FORMED THEREFROM'
[patent_app_type] => utility
[patent_app_number] => 14/243228
[patent_app_country] => US
[patent_app_date] => 2014-04-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6574
[patent_no_of_claims] => 7
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14243228
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/243228 | Plate-like electric conductor for a busbar and the busbar formed therefrom | Apr 1, 2014 | Issued |
Array
(
[id] => 10397292
[patent_doc_number] => 20150282299
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-10-01
[patent_title] => 'THIN PROFILE METAL TRACE TO SUPPRESS SKIN EFFECT AND EXTEND PACKAGE INTERCONNECT BANDWIDTH'
[patent_app_type] => utility
[patent_app_number] => 14/242795
[patent_app_country] => US
[patent_app_date] => 2014-04-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14242795
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/242795 | THIN PROFILE METAL TRACE TO SUPPRESS SKIN EFFECT AND EXTEND PACKAGE INTERCONNECT BANDWIDTH | Mar 31, 2014 | Abandoned |
Array
(
[id] => 10087943
[patent_doc_number] => 09125304
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-09-01
[patent_title] => 'Circuit board having via and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 14/226526
[patent_app_country] => US
[patent_app_date] => 2014-03-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/226526 | Circuit board having via and manufacturing method thereof | Mar 25, 2014 | Issued |
Array
(
[id] => 10553009
[patent_doc_number] => 09277657
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-03-01
[patent_title] => 'Wiring board'
[patent_app_type] => utility
[patent_app_number] => 14/222077
[patent_app_country] => US
[patent_app_date] => 2014-03-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/222077 | Wiring board | Mar 20, 2014 | Issued |
Array
(
[id] => 10915821
[patent_doc_number] => 20140318840
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-10-30
[patent_title] => 'STACKED STRUCTURE AND MANUFACTURING METHOD OF THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/221330
[patent_app_country] => US
[patent_app_date] => 2014-03-21
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/221330 | Stacked structure and manufacturing method of the same | Mar 20, 2014 | Issued |
Array
(
[id] => 11302431
[patent_doc_number] => 09510455
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-11-29
[patent_title] => 'Electronic component embedded substrate and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 14/219768
[patent_app_country] => US
[patent_app_date] => 2014-03-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/219768 | Electronic component embedded substrate and manufacturing method thereof | Mar 18, 2014 | Issued |
Array
(
[id] => 10379801
[patent_doc_number] => 20150264808
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-09-17
[patent_title] => 'Solder Attachment of Electrical Components'
[patent_app_type] => utility
[patent_app_number] => 14/210440
[patent_app_country] => US
[patent_app_date] => 2014-03-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/210440 | Solder Attachment of Electrical Components | Mar 13, 2014 | Abandoned |
Array
(
[id] => 11182473
[patent_doc_number] => 09414490
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-08-09
[patent_title] => 'Electrical circuit board trace pattern to minimize capacitor cracking and improve reliability'
[patent_app_type] => utility
[patent_app_number] => 14/206750
[patent_app_country] => US
[patent_app_date] => 2014-03-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14206750
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/206750 | Electrical circuit board trace pattern to minimize capacitor cracking and improve reliability | Mar 11, 2014 | Issued |
Array
(
[id] => 9726749
[patent_doc_number] => 20140262455
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-09-18
[patent_title] => 'SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES USING PLATING RESIST'
[patent_app_type] => utility
[patent_app_number] => 14/205331
[patent_app_country] => US
[patent_app_date] => 2014-03-11
[patent_effective_date] => 0000-00-00
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14205331
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/205331 | Simultaneous and selective wide gap partitioning of via structures using plating resist | Mar 10, 2014 | Issued |
Array
(
[id] => 11348025
[patent_doc_number] => 09532450
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-12-27
[patent_title] => 'Lowering the sheet resistance of a conductive layer'
[patent_app_type] => utility
[patent_app_number] => 14/203161
[patent_app_country] => US
[patent_app_date] => 2014-03-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14203161
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/203161 | Lowering the sheet resistance of a conductive layer | Mar 9, 2014 | Issued |
Array
(
[id] => 11189282
[patent_doc_number] => 09420709
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-08-16
[patent_title] => 'Coreless board for semiconductor package, method of manufacturing the same, and method of manufacturing semiconductor package using the same'
[patent_app_type] => utility
[patent_app_number] => 14/199326
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/199326 | Coreless board for semiconductor package, method of manufacturing the same, and method of manufacturing semiconductor package using the same | Mar 5, 2014 | Issued |
Array
(
[id] => 10592260
[patent_doc_number] => 09313892
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-04-12
[patent_title] => 'Electronic component and electronic component package'
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Array
(
[id] => 10251454
[patent_doc_number] => 20150136450
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[patent_issue_date] => 2015-05-21
[patent_title] => 'TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/185433 | TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME | Feb 19, 2014 | Abandoned |
Array
(
[id] => 9655341
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[patent_issue_date] => 2014-08-14
[patent_title] => 'WIRING BOARD AND LIGHT EMITTING DEVICE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/177599 | Wiring board and light emitting device | Feb 10, 2014 | Issued |
Array
(
[id] => 10216853
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Array
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Array
(
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Array
(
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Array
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Array
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