
Hoai V. Pham
Examiner (ID: 18096)
| Most Active Art Unit | 2892 |
| Art Unit(s) | 2814, 2892, 2811 |
| Total Applications | 2250 |
| Issued Applications | 2043 |
| Pending Applications | 85 |
| Abandoned Applications | 160 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 17353132
[patent_doc_number] => 11227777
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2022-01-18
[patent_title] => Sacrificial separators for wafer level encapsulating
[patent_app_type] => utility
[patent_app_number] => 16/155607
[patent_app_country] => US
[patent_app_date] => 2018-10-09
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Array
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[patent_kind] => A1
[patent_issue_date] => 2019-02-14
[patent_title] => FLUORINE CONTAMINATION CONTROL IN SEMICONDUCTOR MANUFACTURING PROCESS
[patent_app_type] => utility
[patent_app_number] => 16/155186
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[rel_patent_id] =>[rel_patent_doc_number] =>) 16/155186 | Fluorine contamination control in semiconductor manufacturing process | Oct 8, 2018 | Issued |
Array
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[patent_title] => Bi-directional transistor devices having electrode covering sidewall of the Fin structure
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Array
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[patent_title] => Field-Effect Semiconductor Device and a Manufacturing Method Therefor
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[rel_patent_id] =>[rel_patent_doc_number] =>) 16/153037 | Semiconductor device having a first through contact structure in ohmic contact with the gate electrode | Oct 4, 2018 | Issued |
Array
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[patent_doc_number] => 20190043793
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[patent_issue_date] => 2019-02-07
[patent_title] => SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN EXTENDED SUBSTRATE AND A BOTTOM SUBSTRATE
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[patent_app_number] => 16/148178
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Array
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[patent_title] => DISPLAY ASSEMBLY, DISPLAY DEVICE AND MANUFACTURING PROCESS
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Array
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[patent_doc_number] => 11824048
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[patent_title] => Power semiconductor module and composite module having peripheral structures surrounding parts of the module main body
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Array
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[patent_title] => Semiconductor device and method for manufacturing semiconductor device having plurality of insulator
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Array
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[patent_title] => Wearable device comprising strip-shaped substrate and flexible display panel
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Array
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[patent_title] => Molded package with chip carrier comprising brazed electrically conductive layers
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Array
(
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[patent_title] => PARTIALLY MOLDED DIRECT CHIP ATTACH PACKAGE STRUCTURES FOR CONNECTIVITY MODULE SOLUTIONS
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Array
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[patent_title] => Organic light-emitting display apparatus for increasing contact area between sealing member and insulating layers
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 16/029684 | Electronic module having a filler in a sealing resin | Jul 8, 2018 | Issued |
Array
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Array
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Array
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