Search

Hung K. Vu

Examiner (ID: 9736)

Most Active Art Unit
2897
Art Unit(s)
2811, 2897
Total Applications
1874
Issued Applications
1571
Pending Applications
97
Abandoned Applications
237

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17993327 [patent_doc_number] => 20220359364 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-11-10 [patent_title] => PACKAGE SUBSTRATE, CHIP PACKAGE AND INTEGRATED CIRCUIT CHIP [patent_app_type] => utility [patent_app_number] => 17/695854 [patent_app_country] => US [patent_app_date] => 2022-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4009 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 187 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17695854 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/695854
PACKAGE SUBSTRATE, CHIP PACKAGE AND INTEGRATED CIRCUIT CHIP Mar 15, 2022 Issued
Array ( [id] => 17709103 [patent_doc_number] => 20220209111 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-30 [patent_title] => METAL LANDING ON TOP ELECTRODE OF RRAM [patent_app_type] => utility [patent_app_number] => 17/694913 [patent_app_country] => US [patent_app_date] => 2022-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7322 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17694913 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/694913
Metal landing on top electrode of RRAM Mar 14, 2022 Issued
Array ( [id] => 18251390 [patent_doc_number] => 20230078429 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-03-16 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/691792 [patent_app_country] => US [patent_app_date] => 2022-03-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4205 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17691792 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/691792
Semiconductor device Mar 9, 2022 Issued
Array ( [id] => 17855254 [patent_doc_number] => 20220285297 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-09-08 [patent_title] => SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEMICONDUCTOR DIE AND HEAT SPREADING STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/687350 [patent_app_country] => US [patent_app_date] => 2022-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3953 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17687350 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/687350
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure Mar 3, 2022 Issued
Array ( [id] => 19596994 [patent_doc_number] => 12154847 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-11-26 [patent_title] => Semiconductor device including semiconductor chip having elongated bumps [patent_app_type] => utility [patent_app_number] => 17/687342 [patent_app_country] => US [patent_app_date] => 2022-03-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 18 [patent_no_of_words] => 7959 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 221 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17687342 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/687342
Semiconductor device including semiconductor chip having elongated bumps Mar 3, 2022 Issued
Array ( [id] => 18126159 [patent_doc_number] => 20230011778 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-01-12 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/652782 [patent_app_country] => US [patent_app_date] => 2022-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11836 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17652782 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/652782
Semiconductor package Feb 27, 2022 Issued
Array ( [id] => 18951045 [patent_doc_number] => 11894351 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-06 [patent_title] => Tunable white lighting systems [patent_app_type] => utility [patent_app_number] => 17/680531 [patent_app_country] => US [patent_app_date] => 2022-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 14 [patent_no_of_words] => 8145 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17680531 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/680531
Tunable white lighting systems Feb 24, 2022 Issued
Array ( [id] => 19886898 [patent_doc_number] => 12272628 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-04-08 [patent_title] => Semiconductor package having interposer substrate [patent_app_type] => utility [patent_app_number] => 17/673865 [patent_app_country] => US [patent_app_date] => 2022-02-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 11046 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 203 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17673865 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/673865
Semiconductor package having interposer substrate Feb 16, 2022 Issued
Array ( [id] => 17645505 [patent_doc_number] => 20220173244 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-02 [patent_title] => Method for Fabricating a Semiconductor Device [patent_app_type] => utility [patent_app_number] => 17/671530 [patent_app_country] => US [patent_app_date] => 2022-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3947 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17671530 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/671530
Method for Fabricating a Semiconductor Device Feb 13, 2022 Abandoned
Array ( [id] => 18555390 [patent_doc_number] => 20230253407 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-10 [patent_title] => CONTAMINANT COLLECTION ON SOI [patent_app_type] => utility [patent_app_number] => 17/665501 [patent_app_country] => US [patent_app_date] => 2022-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7984 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17665501 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/665501
Contaminant collection on SOI Feb 4, 2022 Issued
Array ( [id] => 19943716 [patent_doc_number] => 12315853 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-27 [patent_title] => System packaging for cellular modem and transceiver system of heterogeneous stacking [patent_app_type] => utility [patent_app_number] => 17/582870 [patent_app_country] => US [patent_app_date] => 2022-01-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 22 [patent_no_of_words] => 9326 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17582870 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/582870
System packaging for cellular modem and transceiver system of heterogeneous stacking Jan 23, 2022 Issued
Array ( [id] => 17583058 [patent_doc_number] => 20220139913 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-05 [patent_title] => ISOLATION IN INTEGRATED CIRCUIT DEVICES [patent_app_type] => utility [patent_app_number] => 17/577834 [patent_app_country] => US [patent_app_date] => 2022-01-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14446 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17577834 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/577834
ISOLATION IN INTEGRATED CIRCUIT DEVICES Jan 17, 2022 Abandoned
Array ( [id] => 17566663 [patent_doc_number] => 20220130812 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-28 [patent_title] => IMAGE SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/568740 [patent_app_country] => US [patent_app_date] => 2022-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5178 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -2 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17568740 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/568740
Image sensor package and manufacturing method thereof Jan 4, 2022 Issued
Array ( [id] => 18967568 [patent_doc_number] => 11901350 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-13 [patent_title] => Method for fabricating semiconductor device with stacking structure [patent_app_type] => utility [patent_app_number] => 17/563346 [patent_app_country] => US [patent_app_date] => 2021-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 35 [patent_figures_cnt] => 35 [patent_no_of_words] => 11018 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 172 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17563346 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/563346
Method for fabricating semiconductor device with stacking structure Dec 27, 2021 Issued
Array ( [id] => 18473238 [patent_doc_number] => 20230207526 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => SEMICONDUCTOR DEVICE WITH STACKING STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/563291 [patent_app_country] => US [patent_app_date] => 2021-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11009 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 102 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17563291 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/563291
Semiconductor device with stacking structure Dec 27, 2021 Issued
Array ( [id] => 17599402 [patent_doc_number] => 20220148976 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-05-12 [patent_title] => FLEXIBLE CIRCUIT BOARD AND CHIP PACKAGE INCLUDING SAME [patent_app_type] => utility [patent_app_number] => 17/559125 [patent_app_country] => US [patent_app_date] => 2021-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 24615 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17559125 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/559125
Flexible circuit board and chip package including same Dec 21, 2021 Issued
Array ( [id] => 17536976 [patent_doc_number] => 20220115585 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-14 [patent_title] => CURRENT SENSOR PACKAGE WITH CONTINUOUS INSULATION [patent_app_type] => utility [patent_app_number] => 17/555809 [patent_app_country] => US [patent_app_date] => 2021-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8175 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17555809 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/555809
Current sensor package with continuous insulation Dec 19, 2021 Issued
Array ( [id] => 18507586 [patent_doc_number] => 11705413 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-07-18 [patent_title] => Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure [patent_app_type] => utility [patent_app_number] => 17/549901 [patent_app_country] => US [patent_app_date] => 2021-12-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3650 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 247 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17549901 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/549901
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure Dec 13, 2021 Issued
Array ( [id] => 18440835 [patent_doc_number] => 20230188131 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-15 [patent_title] => STRUCTURE INCLUDING RESISTOR NETWORK FOR BACK BIASING FET STACK [patent_app_type] => utility [patent_app_number] => 17/643567 [patent_app_country] => US [patent_app_date] => 2021-12-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4965 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17643567 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/643567
Structure including resistor network for back biasing FET stack Dec 8, 2021 Issued
Array ( [id] => 18345485 [patent_doc_number] => 20230133595 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-05-04 [patent_title] => MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 17/539742 [patent_app_country] => US [patent_app_date] => 2021-12-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 38787 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17539742 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/539742
Memory devices having vertical transistors and methods for forming the same Nov 30, 2021 Issued
Menu