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Hung Nguyen

Examiner (ID: 17814, Phone: (571)272-2124 , Office: P/2882 )

Most Active Art Unit
2882
Art Unit(s)
2882, 2851
Total Applications
2869
Issued Applications
2463
Pending Applications
104
Abandoned Applications
302

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18774457 [patent_doc_number] => 20230369288 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/359890 [patent_app_country] => US [patent_app_date] => 2023-07-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8946 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18359890 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/359890
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME Jul 26, 2023 Pending
Array ( [id] => 18906059 [patent_doc_number] => 20240021544 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => SEAL RING FOR HYBRID-BOND [patent_app_type] => utility [patent_app_number] => 18/358343 [patent_app_country] => US [patent_app_date] => 2023-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15638 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18358343 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/358343
SEAL RING FOR HYBRID-BOND Jul 24, 2023 Pending
Array ( [id] => 18791274 [patent_doc_number] => 20230380302 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-23 [patent_title] => SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE [patent_app_type] => utility [patent_app_number] => 18/357814 [patent_app_country] => US [patent_app_date] => 2023-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8935 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18357814 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/357814
SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE Jul 23, 2023 Pending
Array ( [id] => 18757542 [patent_doc_number] => 20230361005 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-09 [patent_title] => OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER [patent_app_type] => utility [patent_app_number] => 18/355463 [patent_app_country] => US [patent_app_date] => 2023-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11732 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 69 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18355463 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/355463
OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER Jul 19, 2023 Pending
Array ( [id] => 18757682 [patent_doc_number] => 20230361145 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-09 [patent_title] => SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND IMAGING ELEMENT [patent_app_type] => utility [patent_app_number] => 18/354792 [patent_app_country] => US [patent_app_date] => 2023-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12269 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18354792 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/354792
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND IMAGING ELEMENT Jul 18, 2023 Pending
Array ( [id] => 18906088 [patent_doc_number] => 20240021573 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => RELIABLE HYBRID BONDED APPARATUS [patent_app_type] => utility [patent_app_number] => 18/353019 [patent_app_country] => US [patent_app_date] => 2023-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4056 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => 0 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18353019 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/353019
RELIABLE HYBRID BONDED APPARATUS Jul 13, 2023 Pending
Array ( [id] => 18712778 [patent_doc_number] => 20230335411 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-19 [patent_title] => CHIP PACKAGE STRUCTURE WITH NICKEL LAYER [patent_app_type] => utility [patent_app_number] => 18/341052 [patent_app_country] => US [patent_app_date] => 2023-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10200 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18341052 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/341052
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER Jun 25, 2023 Pending
Array ( [id] => 18712832 [patent_doc_number] => 20230335465 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-19 [patent_title] => THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/214216 [patent_app_country] => US [patent_app_date] => 2023-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8147 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 201 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18214216 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/214216
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE Jun 25, 2023 Pending
Array ( [id] => 18729440 [patent_doc_number] => 20230343736 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-26 [patent_title] => Semiconductor Package Including Test Pad and Bonding Pad Structure for Die Connection and Methods for Forming the Same [patent_app_type] => utility [patent_app_number] => 18/340832 [patent_app_country] => US [patent_app_date] => 2023-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7781 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18340832 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/340832
Semiconductor Package Including Test Pad and Bonding Pad Structure for Die Connection and Methods for Forming the Same Jun 23, 2023 Pending
Array ( [id] => 18696377 [patent_doc_number] => 20230326815 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-12 [patent_title] => DAISY-CHAIN SEAL RING STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/335413 [patent_app_country] => US [patent_app_date] => 2023-06-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 13837 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18335413 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/335413
DAISY-CHAIN SEAL RING STRUCTURE Jun 14, 2023 Pending
Array ( [id] => 18631814 [patent_doc_number] => 20230290719 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-09-14 [patent_title] => SEMICONDUCTOR STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/200580 [patent_app_country] => US [patent_app_date] => 2023-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4526 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18200580 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/200580
SEMICONDUCTOR STRUCTURE May 22, 2023 Pending
Array ( [id] => 18555223 [patent_doc_number] => 20230253240 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-10 [patent_title] => Dummy Fin Structures and Methods of Forming Same [patent_app_type] => utility [patent_app_number] => 18/302428 [patent_app_country] => US [patent_app_date] => 2023-04-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9901 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18302428 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/302428
Dummy Fin Structures and Methods of Forming Same Apr 17, 2023 Pending
Array ( [id] => 18540863 [patent_doc_number] => 20230245974 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-03 [patent_title] => DIE INTERCONNECTION SCHEME FOR PROVIDING A HIGH YIELDING PROCESS FOR HIGH PERFORMANCE MICROPROCESSORS [patent_app_type] => utility [patent_app_number] => 18/131829 [patent_app_country] => US [patent_app_date] => 2023-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8875 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18131829 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/131829
DIE INTERCONNECTION SCHEME FOR PROVIDING A HIGH YIELDING PROCESS FOR HIGH PERFORMANCE MICROPROCESSORS Apr 5, 2023 Pending
Array ( [id] => 18533230 [patent_doc_number] => 20230238306 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-27 [patent_title] => Semiconductor Package and Method for Manufacturing the Same [patent_app_type] => utility [patent_app_number] => 18/194792 [patent_app_country] => US [patent_app_date] => 2023-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7564 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18194792 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/194792
Semiconductor Package and Method for Manufacturing the Same Apr 2, 2023 Pending
Array ( [id] => 18533267 [patent_doc_number] => 20230238343 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-27 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/126205 [patent_app_country] => US [patent_app_date] => 2023-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10451 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18126205 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/126205
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Mar 23, 2023 Pending
Array ( [id] => 18473261 [patent_doc_number] => 20230207549 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => INTEGRATED CIRCUIT DEVICE [patent_app_type] => utility [patent_app_number] => 18/179056 [patent_app_country] => US [patent_app_date] => 2023-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12374 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 242 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18179056 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/179056
INTEGRATED CIRCUIT DEVICE Mar 5, 2023 Pending
Array ( [id] => 18424066 [patent_doc_number] => 20230178530 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-08 [patent_title] => PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/162671 [patent_app_country] => US [patent_app_date] => 2023-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10022 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18162671 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/162671
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Jan 30, 2023 Pending
Array ( [id] => 18337811 [patent_doc_number] => 20230129760 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS OF USING THE SAME [patent_app_type] => utility [patent_app_number] => 18/087819 [patent_app_country] => US [patent_app_date] => 2022-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11447 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18087819 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/087819
PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS OF USING THE SAME Dec 22, 2022 Pending
Array ( [id] => 18323853 [patent_doc_number] => 20230121981 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-20 [patent_title] => Forming Metal Contacts on Metal Gates [patent_app_type] => utility [patent_app_number] => 18/067117 [patent_app_country] => US [patent_app_date] => 2022-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7191 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18067117 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/067117
Forming metal contacts on metal gates Dec 15, 2022 Issued
Array ( [id] => 19081037 [patent_doc_number] => 11950431 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-02 [patent_title] => Magnetic tunnel junction (MTJ) device and forming method thereof [patent_app_type] => utility [patent_app_number] => 18/073574 [patent_app_country] => US [patent_app_date] => 2022-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 17 [patent_no_of_words] => 3949 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18073574 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/073574
Magnetic tunnel junction (MTJ) device and forming method thereof Dec 1, 2022 Issued
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