
Ishwarbhai B. Patel
Examiner (ID: 1775, Phone: (571)272-1933 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2827, 2847, 2835, 2841 |
| Total Applications | 1757 |
| Issued Applications | 1164 |
| Pending Applications | 46 |
| Abandoned Applications | 568 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 9612882
[patent_doc_number] => 20140202739
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-07-24
[patent_title] => 'PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION'
[patent_app_type] => utility
[patent_app_number] => 14/221431
[patent_app_country] => US
[patent_app_date] => 2014-03-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 6002
[patent_no_of_claims] => 6
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14221431
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/221431 | PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION | Mar 20, 2014 | Abandoned |
Array
(
[id] => 9715965
[patent_doc_number] => 20140251663
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-09-11
[patent_title] => 'SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES USING PLATING RESIST'
[patent_app_type] => utility
[patent_app_number] => 14/205337
[patent_app_country] => US
[patent_app_date] => 2014-03-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 25
[patent_no_of_words] => 15692
[patent_no_of_claims] => 14
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14205337
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/205337 | Simultaneous and selective wide gap partitioning of via structures using plating resist | Mar 10, 2014 | Issued |
Array
(
[id] => 10372267
[patent_doc_number] => 20150257273
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-09-10
[patent_title] => 'ELECTRONIC COMPONENT BUILT-IN MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/201166
[patent_app_country] => US
[patent_app_date] => 2014-03-07
[patent_effective_date] => 0000-00-00
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14201166
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/201166 | Electronic component built-in multi-layer wiring board and method of manufacturing the same | Mar 6, 2014 | Issued |
Array
(
[id] => 11601526
[patent_doc_number] => 09648721
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-05-09
[patent_title] => 'Apparatus for mounting a printed circuit board'
[patent_app_type] => utility
[patent_app_number] => 14/199294
[patent_app_country] => US
[patent_app_date] => 2014-03-06
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/199294 | Apparatus for mounting a printed circuit board | Mar 5, 2014 | Issued |
Array
(
[id] => 11223337
[patent_doc_number] => 09451697
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-09-20
[patent_title] => 'High speed printed circuit board with uniform via inside diameter'
[patent_app_type] => utility
[patent_app_number] => 14/196642
[patent_app_country] => US
[patent_app_date] => 2014-03-04
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/196642 | High speed printed circuit board with uniform via inside diameter | Mar 3, 2014 | Issued |
Array
(
[id] => 10531233
[patent_doc_number] => 09257373
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-02-09
[patent_title] => 'Electronic component device'
[patent_app_type] => utility
[patent_app_number] => 14/170900
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/170900 | Electronic component device | Feb 2, 2014 | Issued |
Array
(
[id] => 11804047
[patent_doc_number] => 09544992
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[patent_title] => 'PCB having offset differential signal routing'
[patent_app_type] => utility
[patent_app_number] => 14/164320
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Array
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Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/164320 | PCB having offset differential signal routing | Jan 26, 2014 | Issued |
Array
(
[id] => 9600257
[patent_doc_number] => 20140196938
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-07-17
[patent_title] => 'LEAD FRAME'
[patent_app_type] => utility
[patent_app_number] => 14/146310
[patent_app_country] => US
[patent_app_date] => 2014-01-02
[patent_effective_date] => 0000-00-00
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14146310
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/146310 | Lead frame | Jan 1, 2014 | Issued |
Array
(
[id] => 10971114
[patent_doc_number] => 20140374148
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-12-25
[patent_title] => 'CONDUCTIVE CONNECTION STRUCTURE FOR CONDUCTIVE WIRING LAYER OF FLEXIBLE CIRCUIT BOARD'
[patent_app_type] => utility
[patent_app_number] => 14/138383
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/138383 | Conductive connection structure for conductive wiring layer of flexible circuit board | Dec 22, 2013 | Issued |
Array
(
[id] => 9898257
[patent_doc_number] => 20150053456
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2015-02-26
[patent_title] => 'PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF'
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Array
(
[id] => 9541702
[patent_doc_number] => 20140166349
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[patent_title] => 'CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME'
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Array
(
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Array
(
[id] => 9640844
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Array
(
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Array
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