
Ishwarbhai B. Patel
Examiner (ID: 1775, Phone: (571)272-1933 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2827, 2847, 2835, 2841 |
| Total Applications | 1757 |
| Issued Applications | 1164 |
| Pending Applications | 46 |
| Abandoned Applications | 568 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 9277190
[patent_doc_number] => 20140027158
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-01-30
[patent_title] => 'CIRCUIT BOARD ASSEMBLY WITH FLEXIBLE PRINTED CIRCUIT BOARD AND REINFORCING PLATE'
[patent_app_type] => utility
[patent_app_number] => 13/707572
[patent_app_country] => US
[patent_app_date] => 2012-12-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 847
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13707572
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/707572 | Circuit board assembly with flexible printed circuit board and reinforcing plate | Dec 5, 2012 | Issued |
Array
(
[id] => 12107140
[patent_doc_number] => 09863616
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2018-01-09
[patent_title] => 'Circuit board for LED applications'
[patent_app_type] => utility
[patent_app_number] => 13/705897
[patent_app_country] => US
[patent_app_date] => 2012-12-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 7030
[patent_no_of_claims] => 20
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13705897
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/705897 | Circuit board for LED applications | Dec 4, 2012 | Issued |
Array
(
[id] => 8887887
[patent_doc_number] => 20130161071
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-06-27
[patent_title] => 'CONNECTION STRUCTURE, CONNECTION METHOD AND DIFFERENTIAL SIGNAL TRANSMISSION CABLE'
[patent_app_type] => utility
[patent_app_number] => 13/693648
[patent_app_country] => US
[patent_app_date] => 2012-12-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 5525
[patent_no_of_claims] => 16
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13693648
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/693648 | Connection structure, connection method and differential signal transmission cable | Dec 3, 2012 | Issued |
Array
(
[id] => 9366745
[patent_doc_number] => 20140076618
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-03-20
[patent_title] => 'METHOD OF FORMING GOLD THIN FILM AND PRINTED CIRCUIT BOARD'
[patent_app_type] => utility
[patent_app_number] => 13/692643
[patent_app_country] => US
[patent_app_date] => 2012-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3600
[patent_no_of_claims] => 14
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13692643
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/692643 | METHOD OF FORMING GOLD THIN FILM AND PRINTED CIRCUIT BOARD | Dec 2, 2012 | Abandoned |
Array
(
[id] => 9516718
[patent_doc_number] => 20140153210
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-06-05
[patent_title] => 'ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS'
[patent_app_type] => utility
[patent_app_number] => 13/692148
[patent_app_country] => US
[patent_app_date] => 2012-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 9599
[patent_no_of_claims] => 53
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/692148 | Advanced device assembly structures and methods | Dec 2, 2012 | Issued |
Array
(
[id] => 8850399
[patent_doc_number] => 20130140074
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-06-06
[patent_title] => 'VIA HOLE PLATING METHOD AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/692996
[patent_app_country] => US
[patent_app_date] => 2012-12-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2353
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13692996
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/692996 | VIA HOLE PLATING METHOD AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME | Dec 2, 2012 | Abandoned |
Array
(
[id] => 8838308
[patent_doc_number] => 20130133936
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-05-30
[patent_title] => 'Bonded Board and Manufacturing Method Thereof'
[patent_app_type] => utility
[patent_app_number] => 13/687734
[patent_app_country] => US
[patent_app_date] => 2012-11-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 10021
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13687734
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/687734 | Bonded Board and Manufacturing Method Thereof | Nov 27, 2012 | Abandoned |
Array
(
[id] => 9508190
[patent_doc_number] => 20140144681
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-05-29
[patent_title] => 'ADHESIVE METAL NITRIDE ON GLASS AND RELATED METHODS'
[patent_app_type] => utility
[patent_app_number] => 13/686620
[patent_app_country] => US
[patent_app_date] => 2012-11-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 8543
[patent_no_of_claims] => 31
[patent_no_of_ind_claims] => 3
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13686620
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/686620 | ADHESIVE METAL NITRIDE ON GLASS AND RELATED METHODS | Nov 26, 2012 | Abandoned |
Array
(
[id] => 11227256
[patent_doc_number] => 09454982
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-09-27
[patent_title] => 'Wiring structure of head suspension having a stacked interleaved part and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 13/660477
[patent_app_country] => US
[patent_app_date] => 2012-10-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 43
[patent_no_of_words] => 7231
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13660477
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/660477 | Wiring structure of head suspension having a stacked interleaved part and method of manufacturing the same | Oct 24, 2012 | Issued |
Array
(
[id] => 8778652
[patent_doc_number] => 20130100626
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-04-25
[patent_title] => 'WIRING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/659147
[patent_app_country] => US
[patent_app_date] => 2012-10-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13659147
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/659147 | Wiring substrate and manufacturing method of the same | Oct 23, 2012 | Issued |
Array
(
[id] => 8776695
[patent_doc_number] => 20130098670
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-04-25
[patent_title] => 'WIRING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/659294
[patent_app_country] => US
[patent_app_date] => 2012-10-24
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/659294 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME | Oct 23, 2012 | Abandoned |
Array
(
[id] => 8825174
[patent_doc_number] => 20130126219
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-05-23
[patent_title] => 'MULTI-PLY CIRCUIT BOARD WITH FIBER BUNDLES'
[patent_app_type] => utility
[patent_app_number] => 13/657253
[patent_app_country] => US
[patent_app_date] => 2012-10-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/657253 | MULTI-PLY CIRCUIT BOARD WITH FIBER BUNDLES | Oct 21, 2012 | Abandoned |
Array
(
[id] => 9279250
[patent_doc_number] => 20140029218
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-01-30
[patent_title] => 'APPARATUS FOR EFFICIENT WIRE ROUTING IN A DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/656364
[patent_app_country] => US
[patent_app_date] => 2012-10-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13656364
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/656364 | Apparatus for efficient wire routing in a device | Oct 18, 2012 | Issued |
Array
(
[id] => 9219623
[patent_doc_number] => 20140014398
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-01-16
[patent_title] => 'CORELESS SUBTRATE AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 13/650050
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[patent_app_date] => 2012-10-11
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13650050
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/650050 | CORELESS SUBTRATE AND METHOD OF MANUFACTURING THE SAME | Oct 10, 2012 | Abandoned |
Array
(
[id] => 8729572
[patent_doc_number] => 20130075141
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2013-03-28
[patent_title] => 'WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/624310 | Wiring substrate and method of manufacturing the same | Sep 20, 2012 | Issued |
Array
(
[id] => 9368831
[patent_doc_number] => 20140078704
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-03-20
[patent_title] => 'FUNCTIONAL GLASS HANDLER WAFER WITH THROUGH VIAS'
[patent_app_type] => utility
[patent_app_number] => 13/623873
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13623873
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/623873 | Composite wiring board with electrical through connections | Sep 19, 2012 | Issued |
Array
(
[id] => 8582134
[patent_doc_number] => 20130000955
[patent_country] => US
[patent_kind] => A1
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[patent_title] => 'WIRING BOARD AND MANUFACTURING METHOD OF THE SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/611472 | WIRING BOARD AND MANUFACTURING METHOD OF THE SAME | Sep 11, 2012 | Abandoned |
Array
(
[id] => 8742146
[patent_doc_number] => 20130081863
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[patent_kind] => A1
[patent_issue_date] => 2013-04-04
[patent_title] => 'SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/607971 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME | Sep 9, 2012 | Abandoned |
Array
(
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[patent_doc_number] => 20130105213
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[patent_issue_date] => 2013-05-02
[patent_title] => 'PACKAGING SUBSTRATE HAVING EMBEDDED THROUGH-VIA INTERPOSER AND METHOD OF FABRICATING THE SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/604968 | Packaging substrate having embedded through-via interposer and method of fabricating the same | Sep 5, 2012 | Issued |
Array
(
[id] => 8999551
[patent_doc_number] => 20130220675
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/594971 | METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD | Aug 26, 2012 | Abandoned |