
Ishwarbhai B. Patel
Examiner (ID: 1775, Phone: (571)272-1933 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2827, 2847, 2835, 2841 |
| Total Applications | 1757 |
| Issued Applications | 1164 |
| Pending Applications | 46 |
| Abandoned Applications | 568 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 8216324
[patent_doc_number] => 20120132460
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-05-31
[patent_title] => 'LAMINATED WIRING BOARD'
[patent_app_type] => utility
[patent_app_number] => 13/378110
[patent_app_country] => US
[patent_app_date] => 2010-06-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 5885
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13378110
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/378110 | Laminated wiring board | Jun 2, 2010 | Issued |
Array
(
[id] => 8956309
[patent_doc_number] => 08502084
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-08-06
[patent_title] => 'Semiconductor package including power ball matrix and power ring having improved power integrity'
[patent_app_type] => utility
[patent_app_number] => 12/772385
[patent_app_country] => US
[patent_app_date] => 2010-05-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 28
[patent_figures_cnt] => 30
[patent_no_of_words] => 8847
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 262
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12772385
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/772385 | Semiconductor package including power ball matrix and power ring having improved power integrity | May 2, 2010 | Issued |
Array
(
[id] => 6425163
[patent_doc_number] => 20100277835
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-11-04
[patent_title] => 'PRINTED CIRCUIT BOARD AND MAGNETIC HEAD DRIVING DEVICE INCLUDING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/771500
[patent_app_country] => US
[patent_app_date] => 2010-04-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 6066
[patent_no_of_claims] => 6
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[pdf_file] => publications/A1/0277/20100277835.pdf
[firstpage_image] =>[orig_patent_app_number] => 12771500
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/771500 | Printed circuit board and magnetic head driving device including the same | Apr 29, 2010 | Issued |
Array
(
[id] => 7498099
[patent_doc_number] => 20110261539
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-10-27
[patent_title] => 'ADHESIVE REINFORCED OPEN HOLE INTERCONNECT'
[patent_app_type] => utility
[patent_app_number] => 12/764854
[patent_app_country] => US
[patent_app_date] => 2010-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2523
[patent_no_of_claims] => 20
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[pdf_file] => publications/A1/0261/20110261539.pdf
[firstpage_image] =>[orig_patent_app_number] => 12764854
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/764854 | Adhesive reinforced open hole interconnect | Apr 20, 2010 | Issued |
Array
(
[id] => 6010006
[patent_doc_number] => 20110220403
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-09-15
[patent_title] => 'SIDE PACKAGED TYPE PRINTED CIRCUIT BOARD'
[patent_app_type] => utility
[patent_app_number] => 12/762093
[patent_app_country] => US
[patent_app_date] => 2010-04-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 3314
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[pdf_file] => publications/A1/0220/20110220403.pdf
[firstpage_image] =>[orig_patent_app_number] => 12762093
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/762093 | SIDE PACKAGED TYPE PRINTED CIRCUIT BOARD | Apr 15, 2010 | Abandoned |
Array
(
[id] => 4600403
[patent_doc_number] => 07977581
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-07-12
[patent_title] => 'Shifted segment layout for differential signal traces to mitigate bundle weave effect'
[patent_app_type] => utility
[patent_app_number] => 12/757356
[patent_app_country] => US
[patent_app_date] => 2010-04-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/07/977/07977581.pdf
[firstpage_image] =>[orig_patent_app_number] => 12757356
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/757356 | Shifted segment layout for differential signal traces to mitigate bundle weave effect | Apr 8, 2010 | Issued |
Array
(
[id] => 7479325
[patent_doc_number] => 20110232947
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-09-29
[patent_title] => 'Structure of bridging electrode'
[patent_app_type] => utility
[patent_app_number] => 12/659874
[patent_app_country] => US
[patent_app_date] => 2010-03-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[pdf_file] => publications/A1/0232/20110232947.pdf
[firstpage_image] =>[orig_patent_app_number] => 12659874
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/659874 | Structure of bridging electrode | Mar 23, 2010 | Issued |
Array
(
[id] => 6010003
[patent_doc_number] => 20110220400
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-09-15
[patent_title] => 'CAPACITOR-CIRCUIT BOARD INTERFACE FOR WELDING SYSTEM COMPONENTS'
[patent_app_type] => utility
[patent_app_number] => 12/724075
[patent_app_country] => US
[patent_app_date] => 2010-03-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2755
[patent_no_of_claims] => 20
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0220/20110220400.pdf
[firstpage_image] =>[orig_patent_app_number] => 12724075
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/724075 | Capacitor-circuit board interface for welding system components | Mar 14, 2010 | Issued |
Array
(
[id] => 6082400
[patent_doc_number] => 20110214912
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-09-08
[patent_title] => 'VIA STRUCTURE FOR MULTI-GIGAHERTZ SIGNALING'
[patent_app_type] => utility
[patent_app_number] => 12/717570
[patent_app_country] => US
[patent_app_date] => 2010-03-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[pdf_file] => publications/A1/0214/20110214912.pdf
[firstpage_image] =>[orig_patent_app_number] => 12717570
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/717570 | Via structure for multi-gigahertz signaling | Mar 3, 2010 | Issued |
Array
(
[id] => 6082398
[patent_doc_number] => 20110214911
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-09-08
[patent_title] => 'CIRCUIT SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/716271
[patent_app_country] => US
[patent_app_date] => 2010-03-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 5053
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[pdf_file] => publications/A1/0214/20110214911.pdf
[firstpage_image] =>[orig_patent_app_number] => 12716271
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/716271 | Circuit system with leads and method of manufacture thereof | Mar 1, 2010 | Issued |
Array
(
[id] => 4624598
[patent_doc_number] => 08003897
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-08-23
[patent_title] => 'Printed wiring board'
[patent_app_type] => utility
[patent_app_number] => 12/713274
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[pdf_file] => patents/08/003/08003897.pdf
[firstpage_image] =>[orig_patent_app_number] => 12713274
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/713274 | Printed wiring board | Feb 25, 2010 | Issued |
Array
(
[id] => 7519146
[patent_doc_number] => 07973249
[patent_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/713249 | Multilayer printed wiring board | Feb 25, 2010 | Issued |
Array
(
[id] => 6395916
[patent_doc_number] => 20100147569
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-06-17
[patent_title] => 'COMPONENT-EMBEDDED PRINTED WIRING BOARD'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/709573 | COMPONENT-EMBEDDED PRINTED WIRING BOARD | Feb 21, 2010 | Abandoned |
Array
(
[id] => 8921257
[patent_doc_number] => 08487194
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[patent_title] => 'Circuit board including an embedded component'
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Array
(
[id] => 8625366
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Array
(
[id] => 8435805
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/686533 | PRINTED CIRCUIT BOARD | Jan 12, 2010 | Abandoned |
Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/651150 | Optimizing PCB power and ground connections for lead free solder processes | Dec 30, 2009 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/647859 | Multilayer wiring substrate | Dec 27, 2009 | Issued |