Search

Ishwarbhai B. Patel

Examiner (ID: 1775, Phone: (571)272-1933 , Office: P/2847 )

Most Active Art Unit
2847
Art Unit(s)
2827, 2847, 2835, 2841
Total Applications
1757
Issued Applications
1164
Pending Applications
46
Abandoned Applications
568

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 8538623 [patent_doc_number] => 08314344 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-11-20 [patent_title] => 'Wiring board and manufacturing method of the same' [patent_app_type] => utility [patent_app_number] => 12/573256 [patent_app_country] => US [patent_app_date] => 2009-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 33 [patent_figures_cnt] => 33 [patent_no_of_words] => 15520 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 255 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12573256 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/573256
Wiring board and manufacturing method of the same Oct 4, 2009 Issued
Array ( [id] => 8543822 [patent_doc_number] => 08319115 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-11-27 [patent_title] => 'Wiring board and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 12/562956 [patent_app_country] => US [patent_app_date] => 2009-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 31 [patent_no_of_words] => 13899 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12562956 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/562956
Wiring board and manufacturing method thereof Sep 17, 2009 Issued
Array ( [id] => 5460921 [patent_doc_number] => 20090321121 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-31 [patent_title] => 'CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD' [patent_app_type] => utility [patent_app_number] => 12/552389 [patent_app_country] => US [patent_app_date] => 2009-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 9151 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0321/20090321121.pdf [firstpage_image] =>[orig_patent_app_number] => 12552389 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/552389
CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD Sep 1, 2009 Abandoned
Array ( [id] => 6495442 [patent_doc_number] => 20100012357 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-01-21 [patent_title] => 'Printed Circuit Board With Improved Via Design' [patent_app_type] => utility [patent_app_number] => 12/548933 [patent_app_country] => US [patent_app_date] => 2009-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 10822 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20100012357.pdf [firstpage_image] =>[orig_patent_app_number] => 12548933 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/548933
Printed circuit board with improved via design Aug 26, 2009 Issued
Array ( [id] => 6214741 [patent_doc_number] => 20100051341 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-03-04 [patent_title] => 'Circuit substrate having power/ground plane with grid holes' [patent_app_type] => utility [patent_app_number] => 12/583804 [patent_app_country] => US [patent_app_date] => 2009-08-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1764 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0051/20100051341.pdf [firstpage_image] =>[orig_patent_app_number] => 12583804 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/583804
Circuit substrate having power/ground plane with grid holes Aug 25, 2009 Issued
Array ( [id] => 6129115 [patent_doc_number] => 20110005824 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-01-13 [patent_title] => 'PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/544100 [patent_app_country] => US [patent_app_date] => 2009-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3164 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0005/20110005824.pdf [firstpage_image] =>[orig_patent_app_number] => 12544100 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/544100
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Aug 18, 2009 Abandoned
Array ( [id] => 9009743 [patent_doc_number] => 08525041 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-09-03 [patent_title] => 'Multilayer wiring board and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/543644 [patent_app_country] => US [patent_app_date] => 2009-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 44 [patent_no_of_words] => 7512 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12543644 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/543644
Multilayer wiring board and method for manufacturing the same Aug 18, 2009 Issued
Array ( [id] => 5364216 [patent_doc_number] => 20090301775 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-12-10 [patent_title] => 'Wired circuit board and electronic device' [patent_app_type] => utility [patent_app_number] => 12/461576 [patent_app_country] => US [patent_app_date] => 2009-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 12973 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0301/20090301775.pdf [firstpage_image] =>[orig_patent_app_number] => 12461576 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/461576
Wired circuit board and electronic device Aug 16, 2009 Abandoned
Array ( [id] => 8876188 [patent_doc_number] => 08471154 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2013-06-25 [patent_title] => 'Stackable variable height via package and method' [patent_app_type] => utility [patent_app_number] => 12/537048 [patent_app_country] => US [patent_app_date] => 2009-08-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 23 [patent_no_of_words] => 9730 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12537048 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/537048
Stackable variable height via package and method Aug 5, 2009 Issued
Array ( [id] => 6627952 [patent_doc_number] => 20100035021 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-02-11 [patent_title] => 'Method of manufacturing a substrate, substrate, device provided with a substrate, and determining method' [patent_app_type] => utility [patent_app_number] => 12/461268 [patent_app_country] => US [patent_app_date] => 2009-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4550 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0035/20100035021.pdf [firstpage_image] =>[orig_patent_app_number] => 12461268 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/461268
Method of manufacturing a substrate, substrate, device provided with a substrate, and determining method Aug 4, 2009 Issued
Array ( [id] => 4600400 [patent_doc_number] => 07977578 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-07-12 [patent_title] => 'Tab tape for tape carrier package' [patent_app_type] => utility [patent_app_number] => 12/458936 [patent_app_country] => US [patent_app_date] => 2009-07-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 13 [patent_no_of_words] => 3140 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/977/07977578.pdf [firstpage_image] =>[orig_patent_app_number] => 12458936 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/458936
Tab tape for tape carrier package Jul 27, 2009 Issued
Array ( [id] => 6147617 [patent_doc_number] => 20110019375 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-01-27 [patent_title] => 'Z-DIRECTED PASS-THROUGH COMPONENTS FOR PRINTED CIRCUIT BOARDS' [patent_app_type] => utility [patent_app_number] => 12/508145 [patent_app_country] => US [patent_app_date] => 2009-07-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 15849 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0019/20110019375.pdf [firstpage_image] =>[orig_patent_app_number] => 12508145 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/508145
Z-directed pass-through components for printed circuit boards Jul 22, 2009 Issued
Array ( [id] => 8858925 [patent_doc_number] => 08461460 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-06-11 [patent_title] => 'Microelectronic interconnect element with decreased conductor spacing' [patent_app_type] => utility [patent_app_number] => 12/459864 [patent_app_country] => US [patent_app_date] => 2009-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 34 [patent_no_of_words] => 7720 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 218 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12459864 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/459864
Microelectronic interconnect element with decreased conductor spacing Jul 7, 2009 Issued
Array ( [id] => 8115341 [patent_doc_number] => 08158888 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-04-17 [patent_title] => 'Circuit substrate and method of fabricating the same and chip package structure' [patent_app_type] => utility [patent_app_number] => 12/490077 [patent_app_country] => US [patent_app_date] => 2009-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 17 [patent_no_of_words] => 3813 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/158/08158888.pdf [firstpage_image] =>[orig_patent_app_number] => 12490077 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/490077
Circuit substrate and method of fabricating the same and chip package structure Jun 22, 2009 Issued
Array ( [id] => 4610102 [patent_doc_number] => 07994432 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-08-09 [patent_title] => 'Heat resistant substrate incorporated circuit wiring board' [patent_app_type] => utility [patent_app_number] => 12/488207 [patent_app_country] => US [patent_app_date] => 2009-06-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 37 [patent_no_of_words] => 6427 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 203 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/994/07994432.pdf [firstpage_image] =>[orig_patent_app_number] => 12488207 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/488207
Heat resistant substrate incorporated circuit wiring board Jun 18, 2009 Issued
Array ( [id] => 7752299 [patent_doc_number] => 08110750 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-02-07 [patent_title] => 'Multilayer printed wiring board' [patent_app_type] => utility [patent_app_number] => 12/488299 [patent_app_country] => US [patent_app_date] => 2009-06-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 38 [patent_no_of_words] => 29954 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 19 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/110/08110750.pdf [firstpage_image] =>[orig_patent_app_number] => 12488299 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/488299
Multilayer printed wiring board Jun 18, 2009 Issued
Array ( [id] => 8968992 [patent_doc_number] => 08507806 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-08-13 [patent_title] => 'Heat resistant substrate incorporated circuit wiring board' [patent_app_type] => utility [patent_app_number] => 12/488224 [patent_app_country] => US [patent_app_date] => 2009-06-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 37 [patent_no_of_words] => 6425 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 244 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12488224 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/488224
Heat resistant substrate incorporated circuit wiring board Jun 18, 2009 Issued
Array ( [id] => 5566881 [patent_doc_number] => 20090250258 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-10-08 [patent_title] => 'Wiring Substrate, Semiconductor Package, Electronic Instrument, And Wiring Substrate Manufacturing Method' [patent_app_type] => utility [patent_app_number] => 12/486676 [patent_app_country] => US [patent_app_date] => 2009-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4952 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0250/20090250258.pdf [firstpage_image] =>[orig_patent_app_number] => 12486676 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/486676
Wiring Substrate, Semiconductor Package, Electronic Instrument, And Wiring Substrate Manufacturing Method Jun 16, 2009 Abandoned
Array ( [id] => 4624596 [patent_doc_number] => 08003895 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-08-23 [patent_title] => 'Electronic parts packaging structure and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/457324 [patent_app_country] => US [patent_app_date] => 2009-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 36 [patent_no_of_words] => 8647 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 219 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/003/08003895.pdf [firstpage_image] =>[orig_patent_app_number] => 12457324 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/457324
Electronic parts packaging structure and method of manufacturing the same Jun 7, 2009 Issued
Array ( [id] => 4486583 [patent_doc_number] => 07902464 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-03-08 [patent_title] => 'Heat sink arrangement for electrical apparatus' [patent_app_type] => utility [patent_app_number] => 12/475728 [patent_app_country] => US [patent_app_date] => 2009-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2308 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 303 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/902/07902464.pdf [firstpage_image] =>[orig_patent_app_number] => 12475728 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/475728
Heat sink arrangement for electrical apparatus May 31, 2009 Issued
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