Search

Ishwarbhai B. Patel

Examiner (ID: 13112, Phone: (571)272-1933 , Office: P/2847 )

Most Active Art Unit
2847
Art Unit(s)
2841, 2827, 2835, 2847
Total Applications
1782
Issued Applications
1162
Pending Applications
78
Abandoned Applications
569

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5384280 [patent_doc_number] => 20090225524 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-09-10 [patent_title] => 'Hollowed Printed Circuit Board Having Via Hole And Method For Forming Via Hole In Hollowed Printed Circuit Board' [patent_app_type] => utility [patent_app_number] => 12/043961 [patent_app_country] => US [patent_app_date] => 2008-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1276 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0225/20090225524.pdf [firstpage_image] =>[orig_patent_app_number] => 12043961 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/043961
Hollowed Printed Circuit Board Having Via Hole And Method For Forming Via Hole In Hollowed Printed Circuit Board Mar 6, 2008 Abandoned
Array ( [id] => 4816353 [patent_doc_number] => 20080223612 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-09-18 [patent_title] => 'WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 12/044372 [patent_app_country] => US [patent_app_date] => 2008-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 5552 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0223/20080223612.pdf [firstpage_image] =>[orig_patent_app_number] => 12044372 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/044372
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF Mar 6, 2008 Abandoned
Array ( [id] => 4883258 [patent_doc_number] => 20080257590 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-23 [patent_title] => 'HIGH THERMAL CONDUCTING CIRCUIT SUBSTRATE AND MANUFACTURING PROCESS THEREOF' [patent_app_type] => utility [patent_app_number] => 12/034564 [patent_app_country] => US [patent_app_date] => 2008-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4138 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0257/20080257590.pdf [firstpage_image] =>[orig_patent_app_number] => 12034564 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/034564
HIGH THERMAL CONDUCTING CIRCUIT SUBSTRATE AND MANUFACTURING PROCESS THEREOF Feb 19, 2008 Abandoned
Array ( [id] => 8115347 [patent_doc_number] => 08158890 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2012-04-17 [patent_title] => 'Method and apparatus for low inductive design pattern' [patent_app_type] => utility [patent_app_number] => 12/034353 [patent_app_country] => US [patent_app_date] => 2008-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 2656 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/158/08158890.pdf [firstpage_image] =>[orig_patent_app_number] => 12034353 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/034353
Method and apparatus for low inductive design pattern Feb 19, 2008 Issued
Array ( [id] => 5287586 [patent_doc_number] => 20090020316 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-22 [patent_title] => 'METHOD OF MANUFACTURING CHIP ON FILM AND STRUCTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 12/033876 [patent_app_country] => US [patent_app_date] => 2008-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 1791 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0020/20090020316.pdf [firstpage_image] =>[orig_patent_app_number] => 12033876 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/033876
METHOD OF MANUFACTURING CHIP ON FILM AND STRUCTURE THEREOF Feb 18, 2008 Abandoned
Array ( [id] => 8082645 [patent_doc_number] => 08148644 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-04-03 [patent_title] => 'Electronic card and aircraft including same' [patent_app_type] => utility [patent_app_number] => 12/528167 [patent_app_country] => US [patent_app_date] => 2008-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 2141 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/148/08148644.pdf [firstpage_image] =>[orig_patent_app_number] => 12528167 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/528167
Electronic card and aircraft including same Feb 17, 2008 Issued
Array ( [id] => 6269929 [patent_doc_number] => 20100116525 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-05-13 [patent_title] => 'FLEXIBLE PRINTED WIRING BOARD' [patent_app_type] => utility [patent_app_number] => 12/526917 [patent_app_country] => US [patent_app_date] => 2008-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 6011 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0116/20100116525.pdf [firstpage_image] =>[orig_patent_app_number] => 12526917 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/526917
Flexible printed wiring board Feb 14, 2008 Issued
Array ( [id] => 5477106 [patent_doc_number] => 20090200063 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-08-13 [patent_title] => 'EMBEDDED SPARK GAP' [patent_app_type] => utility [patent_app_number] => 12/028164 [patent_app_country] => US [patent_app_date] => 2008-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2383 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0200/20090200063.pdf [firstpage_image] =>[orig_patent_app_number] => 12028164 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/028164
EMBEDDED SPARK GAP Feb 7, 2008 Abandoned
Array ( [id] => 5517982 [patent_doc_number] => 20090025963 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-29 [patent_title] => 'Wired circuit board and production method thereof' [patent_app_type] => utility [patent_app_number] => 12/068501 [patent_app_country] => US [patent_app_date] => 2008-02-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6480 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0025/20090025963.pdf [firstpage_image] =>[orig_patent_app_number] => 12068501 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/068501
Wired circuit board and production method thereof Feb 6, 2008 Issued
Array ( [id] => 7519142 [patent_doc_number] => 07973245 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-07-05 [patent_title] => 'Wiring board and capacitor to be built into wiring board' [patent_app_type] => utility [patent_app_number] => 12/026838 [patent_app_country] => US [patent_app_date] => 2008-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 24 [patent_no_of_words] => 14721 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 190 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/973/07973245.pdf [firstpage_image] =>[orig_patent_app_number] => 12026838 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/026838
Wiring board and capacitor to be built into wiring board Feb 5, 2008 Issued
Array ( [id] => 4952151 [patent_doc_number] => 20080185175 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-08-07 [patent_title] => 'Multilayer wiring board and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 12/068169 [patent_app_country] => US [patent_app_date] => 2008-02-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 6328 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0185/20080185175.pdf [firstpage_image] =>[orig_patent_app_number] => 12068169 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/068169
Multilayer wiring board and method of manufacturing the same Feb 3, 2008 Issued
Array ( [id] => 5376871 [patent_doc_number] => 20090188710 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-07-30 [patent_title] => 'SYSTEM AND METHOD FOR FORMING FILLED VIAS AND PLATED THROUGH HOLES' [patent_app_type] => utility [patent_app_number] => 12/022157 [patent_app_country] => US [patent_app_date] => 2008-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3267 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0188/20090188710.pdf [firstpage_image] =>[orig_patent_app_number] => 12022157 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/022157
SYSTEM AND METHOD FOR FORMING FILLED VIAS AND PLATED THROUGH HOLES Jan 29, 2008 Abandoned
Array ( [id] => 5283546 [patent_doc_number] => 20090097220 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-16 [patent_title] => 'Printed circuit board' [patent_app_type] => utility [patent_app_number] => 12/010749 [patent_app_country] => US [patent_app_date] => 2008-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 2392 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0097/20090097220.pdf [firstpage_image] =>[orig_patent_app_number] => 12010749 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/010749
Printed circuit board Jan 28, 2008 Abandoned
Array ( [id] => 5425272 [patent_doc_number] => 20090084582 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-02 [patent_title] => 'Printed circuit board having stepped conduction layer' [patent_app_type] => utility [patent_app_number] => 12/010750 [patent_app_country] => US [patent_app_date] => 2008-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 5326 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0084/20090084582.pdf [firstpage_image] =>[orig_patent_app_number] => 12010750 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/010750
Printed circuit board having stepped conduction layer Jan 28, 2008 Abandoned
Array ( [id] => 4509987 [patent_doc_number] => 07915538 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-03-29 [patent_title] => 'Multilayer wiring board and its manufacturing method' [patent_app_type] => utility [patent_app_number] => 12/021548 [patent_app_country] => US [patent_app_date] => 2008-01-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 83 [patent_no_of_words] => 10140 [patent_no_of_claims] => 1 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/915/07915538.pdf [firstpage_image] =>[orig_patent_app_number] => 12021548 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/021548
Multilayer wiring board and its manufacturing method Jan 28, 2008 Issued
Array ( [id] => 4600404 [patent_doc_number] => 07977582 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-07-12 [patent_title] => 'Flexible multilayer printed circuit assembly with reduced EMI emissions' [patent_app_type] => utility [patent_app_number] => 12/020643 [patent_app_country] => US [patent_app_date] => 2008-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 3858 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/977/07977582.pdf [firstpage_image] =>[orig_patent_app_number] => 12020643 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/020643
Flexible multilayer printed circuit assembly with reduced EMI emissions Jan 27, 2008 Issued
Array ( [id] => 5377789 [patent_doc_number] => 20090189628 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-07-30 [patent_title] => 'Reworkable bonding pad layout and debug method thereof' [patent_app_type] => utility [patent_app_number] => 12/010453 [patent_app_country] => US [patent_app_date] => 2008-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1312 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0189/20090189628.pdf [firstpage_image] =>[orig_patent_app_number] => 12010453 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/010453
Reworkable bonding pad layout and debug method thereof Jan 24, 2008 Abandoned
Array ( [id] => 4775288 [patent_doc_number] => 20080283286 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-11-20 [patent_title] => 'PRINTED CIRCUIT BOARD' [patent_app_type] => utility [patent_app_number] => 12/019661 [patent_app_country] => US [patent_app_date] => 2008-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4484 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0283/20080283286.pdf [firstpage_image] =>[orig_patent_app_number] => 12019661 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/019661
Printed circuit board Jan 24, 2008 Issued
Array ( [id] => 4542059 [patent_doc_number] => 07875811 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-01-25 [patent_title] => 'High speed interposer' [patent_app_type] => utility [patent_app_number] => 12/010335 [patent_app_country] => US [patent_app_date] => 2008-01-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 6274 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 288 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/875/07875811.pdf [firstpage_image] =>[orig_patent_app_number] => 12010335 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/010335
High speed interposer Jan 23, 2008 Issued
Array ( [id] => 5425281 [patent_doc_number] => 20090084591 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-04-02 [patent_title] => 'Cavity capacitor fabrication method and printed circuit board having embedded cavity capacitor' [patent_app_type] => utility [patent_app_number] => 12/007369 [patent_app_country] => US [patent_app_date] => 2008-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 3743 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0084/20090084591.pdf [firstpage_image] =>[orig_patent_app_number] => 12007369 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/007369
Cavity capacitor fabrication method and printed circuit board having embedded cavity capacitor Jan 8, 2008 Abandoned
Menu