
Ishwarbhai B. Patel
Examiner (ID: 1775, Phone: (571)272-1933 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2827, 2847, 2835, 2841 |
| Total Applications | 1757 |
| Issued Applications | 1164 |
| Pending Applications | 46 |
| Abandoned Applications | 568 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 7629518
[patent_doc_number] => 06818838
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-11-16
[patent_title] => 'PCB component placement and trace routing therebetween'
[patent_app_type] => B1
[patent_app_number] => 10/390869
[patent_app_country] => US
[patent_app_date] => 2003-03-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 6
[patent_no_of_words] => 4037
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 6
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/818/06818838.pdf
[firstpage_image] =>[orig_patent_app_number] => 10390869
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/390869 | PCB component placement and trace routing therebetween | Mar 16, 2003 | Issued |
Array
(
[id] => 7452235
[patent_doc_number] => 20040118598
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-24
[patent_title] => 'Information handling system utilizing circuitized substrate'
[patent_app_type] => new
[patent_app_number] => 10/379575
[patent_app_country] => US
[patent_app_date] => 2003-03-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3152
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 73
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0118/20040118598.pdf
[firstpage_image] =>[orig_patent_app_number] => 10379575
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/379575 | Information handling system utilizing circuitized substrate | Mar 5, 2003 | Issued |
Array
(
[id] => 6795610
[patent_doc_number] => 20030174483
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-09-18
[patent_title] => 'Wiring board and method of fabricating tape-like wiring substrate'
[patent_app_type] => new
[patent_app_number] => 10/370289
[patent_app_country] => US
[patent_app_date] => 2003-02-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 5589
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 41
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0174/20030174483.pdf
[firstpage_image] =>[orig_patent_app_number] => 10370289
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/370289 | Wiring board and method of fabricating tape-like wiring substrate | Feb 18, 2003 | Issued |
Array
(
[id] => 6708500
[patent_doc_number] => 20030168249
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-09-11
[patent_title] => 'Wiring board and method for producing the same'
[patent_app_type] => new
[patent_app_number] => 10/365438
[patent_app_country] => US
[patent_app_date] => 2003-02-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 6130
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 69
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0168/20030168249.pdf
[firstpage_image] =>[orig_patent_app_number] => 10365438
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/365438 | Wiring board and method for producing the same | Feb 12, 2003 | Abandoned |
Array
(
[id] => 6680485
[patent_doc_number] => 20030116349
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-06-26
[patent_title] => 'Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument'
[patent_app_type] => new
[patent_app_number] => 10/361566
[patent_app_country] => US
[patent_app_date] => 2003-02-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 9167
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 105
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0116/20030116349.pdf
[firstpage_image] =>[orig_patent_app_number] => 10361566
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/361566 | Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument | Feb 10, 2003 | Issued |
Array
(
[id] => 1266957
[patent_doc_number] => 06661225
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-12-09
[patent_title] => 'Revolution detecting device'
[patent_app_type] => B2
[patent_app_number] => 10/348187
[patent_app_country] => US
[patent_app_date] => 2003-01-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 13
[patent_no_of_words] => 9869
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 288
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/661/06661225.pdf
[firstpage_image] =>[orig_patent_app_number] => 10348187
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/348187 | Revolution detecting device | Jan 21, 2003 | Issued |
Array
(
[id] => 7605111
[patent_doc_number] => 07115818
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-10-03
[patent_title] => 'Flexible multilayer wiring board and manufacture method thereof'
[patent_app_type] => utility
[patent_app_number] => 10/341466
[patent_app_country] => US
[patent_app_date] => 2003-01-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 11
[patent_no_of_words] => 6490
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 211
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/115/07115818.pdf
[firstpage_image] =>[orig_patent_app_number] => 10341466
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/341466 | Flexible multilayer wiring board and manufacture method thereof | Jan 13, 2003 | Issued |
Array
(
[id] => 7327620
[patent_doc_number] => 20040129453
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-08
[patent_title] => 'Electronic substrate with direct inner layer component interconnection'
[patent_app_type] => new
[patent_app_number] => 10/337949
[patent_app_country] => US
[patent_app_date] => 2003-01-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1411
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 42
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0129/20040129453.pdf
[firstpage_image] =>[orig_patent_app_number] => 10337949
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/337949 | Electronic substrate with direct inner layer component interconnection | Jan 6, 2003 | Abandoned |
Array
(
[id] => 7370511
[patent_doc_number] => 20040006407
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-01-08
[patent_title] => 'Layer allocating apparatus for multi-layer circuit board'
[patent_app_type] => new
[patent_app_number] => 10/330297
[patent_app_country] => US
[patent_app_date] => 2002-12-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2860
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 119
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0006/20040006407.pdf
[firstpage_image] =>[orig_patent_app_number] => 10330297
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/330297 | Layer allocating apparatus for multi-layer circuit board | Dec 29, 2002 | Issued |
Array
(
[id] => 5868339
[patent_doc_number] => 20060162956
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-07-27
[patent_title] => 'Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them'
[patent_app_type] => utility
[patent_app_number] => 10/500119
[patent_app_country] => US
[patent_app_date] => 2002-12-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 9291
[patent_no_of_claims] => 39
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0162/20060162956.pdf
[firstpage_image] =>[orig_patent_app_number] => 10500119
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/500119 | Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them | Dec 23, 2002 | Abandoned |
Array
(
[id] => 7452212
[patent_doc_number] => 20040118596
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-24
[patent_title] => 'Circuitized substrate assembly and method of making same'
[patent_app_type] => new
[patent_app_number] => 10/322527
[patent_app_country] => US
[patent_app_date] => 2002-12-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3262
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 68
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0118/20040118596.pdf
[firstpage_image] =>[orig_patent_app_number] => 10322527
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/322527 | Circuitized substrate assembly and method of making same | Dec 18, 2002 | Issued |
Array
(
[id] => 6758337
[patent_doc_number] => 20030121698
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-07-03
[patent_title] => 'Semiconductor device and printed wiring board having electrode pads'
[patent_app_type] => new
[patent_app_number] => 10/318063
[patent_app_country] => US
[patent_app_date] => 2002-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 17
[patent_no_of_words] => 9003
[patent_no_of_claims] => 26
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0121/20030121698.pdf
[firstpage_image] =>[orig_patent_app_number] => 10318063
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/318063 | Semiconductor device and printed wiring board having electrode pads | Dec 12, 2002 | Abandoned |
Array
(
[id] => 7355576
[patent_doc_number] => 20040003940
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-01-08
[patent_title] => 'Circuit board for flip-chip semiconductor package and fabrication method thereof'
[patent_app_type] => new
[patent_app_number] => 10/313675
[patent_app_country] => US
[patent_app_date] => 2002-12-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2639
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0003/20040003940.pdf
[firstpage_image] =>[orig_patent_app_number] => 10313675
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/313675 | Circuit board for flip-chip semiconductor package and fabrication method thereof | Dec 4, 2002 | Abandoned |
Array
(
[id] => 1081151
[patent_doc_number] => 06835897
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-12-28
[patent_title] => 'Warpage preventing substrate'
[patent_app_type] => B2
[patent_app_number] => 10/309564
[patent_app_country] => US
[patent_app_date] => 2002-12-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 7
[patent_no_of_words] => 3110
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/835/06835897.pdf
[firstpage_image] =>[orig_patent_app_number] => 10309564
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/309564 | Warpage preventing substrate | Dec 3, 2002 | Issued |
Array
(
[id] => 6665644
[patent_doc_number] => 20030110627
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-06-19
[patent_title] => 'Substrate for receiving a circuit configuration and method for producing the substrate'
[patent_app_type] => new
[patent_app_number] => 10/308049
[patent_app_country] => US
[patent_app_date] => 2002-12-02
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0110/20030110627.pdf
[firstpage_image] =>[orig_patent_app_number] => 10308049
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/308049 | Substrate for receiving a circuit configuration and method for producing the substrate | Dec 1, 2002 | Issued |
Array
(
[id] => 7394946
[patent_doc_number] => 20040104041
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-06-03
[patent_title] => 'Stress release feature for PWBs'
[patent_app_type] => new
[patent_app_number] => 10/306155
[patent_app_country] => US
[patent_app_date] => 2002-11-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 2860
[patent_no_of_claims] => 19
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0104/20040104041.pdf
[firstpage_image] =>[orig_patent_app_number] => 10306155
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/306155 | Stress release feature for PWBs | Nov 28, 2002 | Issued |
Array
(
[id] => 7458990
[patent_doc_number] => 20040100754
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-05-27
[patent_title] => 'Enhanced high-frequency via interconnection for improved reliability'
[patent_app_type] => new
[patent_app_number] => 10/306756
[patent_app_country] => US
[patent_app_date] => 2002-11-26
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0100/20040100754.pdf
[firstpage_image] =>[orig_patent_app_number] => 10306756
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/306756 | Enhanced high-frequency via interconnection for improved reliability | Nov 25, 2002 | Issued |
Array
(
[id] => 7383376
[patent_doc_number] => 20040020686
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-02-05
[patent_title] => 'Superconducting power cable with enhanced superconducting core'
[patent_app_type] => new
[patent_app_number] => 10/300770
[patent_app_country] => US
[patent_app_date] => 2002-11-21
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0020/20040020686.pdf
[firstpage_image] =>[orig_patent_app_number] => 10300770
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/300770 | Superconducting power cable with enhanced superconducting core | Nov 20, 2002 | Abandoned |
Array
(
[id] => 1073958
[patent_doc_number] => 06838623
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-01-04
[patent_title] => 'Electrical circuit board and a method for making the same'
[patent_app_type] => utility
[patent_app_number] => 10/300049
[patent_app_country] => US
[patent_app_date] => 2002-11-20
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/838/06838623.pdf
[firstpage_image] =>[orig_patent_app_number] => 10300049
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/300049 | Electrical circuit board and a method for making the same | Nov 19, 2002 | Issued |
Array
(
[id] => 6623345
[patent_doc_number] => 20030102155
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-06-05
[patent_title] => 'Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder'
[patent_app_type] => new
[patent_app_number] => 10/289358
[patent_app_country] => US
[patent_app_date] => 2002-11-07
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0102/20030102155.pdf
[firstpage_image] =>[orig_patent_app_number] => 10289358
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/289358 | Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder | Nov 6, 2002 | Issued |