Ishwarbhai B. Patel

Array ( [id] => 7424861 [patent_doc_number] => 20040007386 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-15 [patent_title] => 'Structure of printed circuit board (PCB)' [patent_app_type] => new [patent_app_number] => 10/192686 [patent_app_country] => US [patent_app_date] => 2002-07-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 1432 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0007/20040007386.pdf [firstpage_image] =>[orig_patent_app_number] => 10192686 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7424859 [patent_doc_number] => 20040007385 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-15 [patent_title] => 'Selective area solder placement' [patent_app_type] => new [patent_app_number] => 10/192346 [patent_app_country] => US [patent_app_date] => 2002-07-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2183 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0007/20040007385.pdf [firstpage_image] =>[orig_patent_app_number] => 10192346 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6254694 [patent_doc_number] => 20020185747 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-12 [patent_title] => 'Semiconductor device and method of manufacture thereof, circuit board and electronic instrument' [patent_app_type] => new [patent_app_number] => 10/190515 [patent_app_country] => US [patent_app_date] => 2002-07-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5770 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 17 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0185/20020185747.pdf [firstpage_image] =>[orig_patent_app_number] => 10190515 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6625881 [patent_doc_number] => 20030005582 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-09 [patent_title] => 'Circuit board, method for manufacturing same, and high-output module' [patent_app_type] => new [patent_app_number] => 10/187379 [patent_app_country] => US [patent_app_date] => 2002-07-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3650 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0005/20030005582.pdf [firstpage_image] =>[orig_patent_app_number] => 10187379 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6643591 [patent_doc_number] => 20030007330 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-09 [patent_title] => 'Multilayer circuit board and method for manufacturing multilayer circuit board' [patent_app_type] => new [patent_app_number] => 10/179203 [patent_app_country] => US [patent_app_date] => 2002-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3914 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0007/20030007330.pdf [firstpage_image] =>[orig_patent_app_number] => 10179203 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1181534 [patent_doc_number] => 06740824 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-05-25 [patent_title] => 'Ground connector assembly with substrate strain relief and method of making same' [patent_app_type] => B2 [patent_app_number] => 10/179066 [patent_app_country] => US [patent_app_date] => 2002-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2412 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/740/06740824.pdf [firstpage_image] =>[orig_patent_app_number] => 10179066 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6320884 [patent_doc_number] => 20020196613 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-26 [patent_title] => 'Through hole insertion type electronic component and method of packaging same' [patent_app_type] => new [patent_app_number] => 10/176521 [patent_app_country] => US [patent_app_date] => 2002-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 8599 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0196/20020196613.pdf [firstpage_image] =>[orig_patent_app_number] => 10176521 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6772007 [patent_doc_number] => 20030015345 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-23 [patent_title] => 'Laminated base sheet for flexible printed circuit board' [patent_app_type] => new [patent_app_number] => 10/175871 [patent_app_country] => US [patent_app_date] => 2002-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 3942 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0015/20030015345.pdf [firstpage_image] =>[orig_patent_app_number] => 10175871 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6728789 [patent_doc_number] => 20030184979 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-10-02 [patent_title] => 'Circuit board free of photo-sensitive material and fabrication method of the same' [patent_app_type] => new [patent_app_number] => 10/176168 [patent_app_country] => US [patent_app_date] => 2002-06-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2713 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0184/20030184979.pdf [firstpage_image] =>[orig_patent_app_number] => 10176168 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6732895 [patent_doc_number] => 20030010530 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-16 [patent_title] => 'Multilayer printed board' [patent_app_type] => new [patent_app_number] => 10/173625 [patent_app_country] => US [patent_app_date] => 2002-06-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 908 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0010/20030010530.pdf [firstpage_image] =>[orig_patent_app_number] => 10173625 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6556704 [patent_doc_number] => 20020164468 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-11-07 [patent_title] => 'Formation of multisegmented plated through holes' [patent_app_type] => new [patent_app_number] => 10/176254 [patent_app_country] => US [patent_app_date] => 2002-06-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 4852 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0164/20020164468.pdf [firstpage_image] =>[orig_patent_app_number] => 10176254 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6631708 [patent_doc_number] => 20030006069 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-09 [patent_title] => 'Conductive bond, multilayer printed circuit board, and method for making the multilayer printed circuit board' [patent_app_type] => new [patent_app_number] => 10/173053 [patent_app_country] => US [patent_app_date] => 2002-06-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4233 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 17 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0006/20030006069.pdf [firstpage_image] =>[orig_patent_app_number] => 10173053 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1093690 [patent_doc_number] => 06825422 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-11-30 [patent_title] => 'Interconnection element with contact blade' [patent_app_type] => B2 [patent_app_number] => 10/174455 [patent_app_country] => US [patent_app_date] => 2002-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 33 [patent_no_of_words] => 8595 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/825/06825422.pdf [firstpage_image] =>[orig_patent_app_number] => 10174455 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6777538 [patent_doc_number] => 20030048619 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-13 [patent_title] => 'Dielectrophoretic assembling of electrically functional microwires' [patent_app_type] => new [patent_app_number] => 10/172146 [patent_app_country] => US [patent_app_date] => 2002-06-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3205 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0048/20030048619.pdf [firstpage_image] =>[orig_patent_app_number] => 10172146 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6910444 [patent_doc_number] => 20050174202 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-08-11 [patent_title] => 'Superconducting wire material and method for preparation thereof, and superconducting magnet using the same' [patent_app_type] => utility [patent_app_number] => 10/480839 [patent_app_country] => US [patent_app_date] => 2002-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 7951 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0174/20050174202.pdf [firstpage_image] =>[orig_patent_app_number] => 10480839 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7629520 [patent_doc_number] => 06818836 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-11-16 [patent_title] => 'Printed circuit board and its manufacturing method' [patent_app_type] => B2 [patent_app_number] => 10/163998 [patent_app_country] => US [patent_app_date] => 2002-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 9 [patent_no_of_words] => 6696 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 6 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/818/06818836.pdf [firstpage_image] =>[orig_patent_app_number] => 10163998 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1224896 [patent_doc_number] => 06700077 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-02 [patent_title] => 'Packaging substrate with electrostatic discharge protection' [patent_app_type] => B2 [patent_app_number] => 10/164356 [patent_app_country] => US [patent_app_date] => 2002-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 1596 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 190 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/700/06700077.pdf [firstpage_image] =>[orig_patent_app_number] => 10164356 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6671377 [patent_doc_number] => 20030056980 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-27 [patent_title] => 'Multilayer board having precise perforations and circuit substrate having precise through-holes' [patent_app_type] => new [patent_app_number] => 10/160998 [patent_app_country] => US [patent_app_date] => 2002-06-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 11255 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0056/20030056980.pdf [firstpage_image] =>[orig_patent_app_number] => 10160998 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1120583 [patent_doc_number] => 06797889 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-09-28 [patent_title] => 'Assembly of power circuits and numerical data printed on a multilayer board' [patent_app_type] => B1 [patent_app_number] => 10/158252 [patent_app_country] => US [patent_app_date] => 2002-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 911 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/797/06797889.pdf [firstpage_image] =>[orig_patent_app_number] => 10158252 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6698986 [patent_doc_number] => 20030221866 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-12-04 [patent_title] => 'Micro-coaxial cable assembly and method for making the same' [patent_app_type] => new [patent_app_number] => 10/161464 [patent_app_country] => US [patent_app_date] => 2002-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 1637 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0221/20030221866.pdf [firstpage_image] =>[orig_patent_app_number] => 10161464 [rel_patent_id] =>[rel_patent_doc_number] =>)