
Ishwarbhai B. Patel
Examiner (ID: 1775, Phone: (571)272-1933 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2827, 2847, 2835, 2841 |
| Total Applications | 1757 |
| Issued Applications | 1164 |
| Pending Applications | 46 |
| Abandoned Applications | 568 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6471471
[patent_doc_number] => 20020023779
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-02-28
[patent_title] => 'Pre-patterned substrate layers for being personalized as needed'
[patent_app_type] => new
[patent_app_number] => 09/982221
[patent_app_country] => US
[patent_app_date] => 2001-10-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2036
[patent_no_of_claims] => 28
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 20
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0023/20020023779.pdf
[firstpage_image] =>[orig_patent_app_number] => 09982221
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/982221 | Pre-patterned substrate layers for being personalized as needed | Oct 17, 2001 | Abandoned |
| 09/977595 | PGA chip package and process for same | Oct 11, 2001 | Abandoned |
Array
(
[id] => 6236608
[patent_doc_number] => 20020043396
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-04-18
[patent_title] => 'Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof'
[patent_app_type] => new
[patent_app_number] => 09/973822
[patent_app_country] => US
[patent_app_date] => 2001-10-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 6802
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 134
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0043/20020043396.pdf
[firstpage_image] =>[orig_patent_app_number] => 09973822
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/973822 | Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof | Oct 10, 2001 | Issued |
Array
(
[id] => 1529063
[patent_doc_number] => 06479760
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2002-11-12
[patent_title] => 'Printed wiring board for semiconductor plastic package'
[patent_app_type] => B2
[patent_app_number] => 09/973688
[patent_app_country] => US
[patent_app_date] => 2001-10-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 9882
[patent_no_of_claims] => 7
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/479/06479760.pdf
[firstpage_image] =>[orig_patent_app_number] => 09973688
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/973688 | Printed wiring board for semiconductor plastic package | Oct 10, 2001 | Issued |
Array
(
[id] => 6815721
[patent_doc_number] => 20030066679
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-04-10
[patent_title] => 'Electrical circuit and method of formation'
[patent_app_type] => new
[patent_app_number] => 09/973294
[patent_app_country] => US
[patent_app_date] => 2001-10-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 16
[patent_no_of_words] => 5084
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 112
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0066/20030066679.pdf
[firstpage_image] =>[orig_patent_app_number] => 09973294
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/973294 | Electrical circuit and method of formation | Oct 8, 2001 | Abandoned |
Array
(
[id] => 5987241
[patent_doc_number] => 20020098985
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-07-25
[patent_title] => 'Superconducting cable'
[patent_app_type] => new
[patent_app_number] => 09/970653
[patent_app_country] => US
[patent_app_date] => 2001-10-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 5519
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 54
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0098/20020098985.pdf
[firstpage_image] =>[orig_patent_app_number] => 09970653
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/970653 | Superconducting cable and current transmission and/or distribution network including the superconducting cable | Oct 4, 2001 | Issued |
Array
(
[id] => 1083209
[patent_doc_number] => 06833510
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-12-21
[patent_title] => 'Semiconductor packages and methods for making the same'
[patent_app_type] => B2
[patent_app_number] => 09/971872
[patent_app_country] => US
[patent_app_date] => 2001-10-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 10
[patent_no_of_words] => 4411
[patent_no_of_claims] => 7
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/833/06833510.pdf
[firstpage_image] =>[orig_patent_app_number] => 09971872
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/971872 | Semiconductor packages and methods for making the same | Oct 3, 2001 | Issued |
Array
(
[id] => 1189636
[patent_doc_number] => 06734371
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-05-11
[patent_title] => 'Soldered heat sink anchor and method of use'
[patent_app_type] => B2
[patent_app_number] => 09/964812
[patent_app_country] => US
[patent_app_date] => 2001-09-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 3657
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 155
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/734/06734371.pdf
[firstpage_image] =>[orig_patent_app_number] => 09964812
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/964812 | Soldered heat sink anchor and method of use | Sep 27, 2001 | Issued |
Array
(
[id] => 1327343
[patent_doc_number] => 06603080
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-08-05
[patent_title] => 'Circuit board having ferrite powder containing layer'
[patent_app_type] => B2
[patent_app_number] => 09/966553
[patent_app_country] => US
[patent_app_date] => 2001-09-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 13
[patent_no_of_words] => 5235
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 120
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/603/06603080.pdf
[firstpage_image] =>[orig_patent_app_number] => 09966553
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/966553 | Circuit board having ferrite powder containing layer | Sep 26, 2001 | Issued |
Array
(
[id] => 6718221
[patent_doc_number] => 20030051908
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-03-20
[patent_title] => 'Dram module package'
[patent_app_type] => new
[patent_app_number] => 09/967714
[patent_app_country] => US
[patent_app_date] => 2001-09-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2353
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 106
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0051/20030051908.pdf
[firstpage_image] =>[orig_patent_app_number] => 09967714
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/967714 | Dram module package | Sep 26, 2001 | Abandoned |
Array
(
[id] => 6488643
[patent_doc_number] => 20020189853
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-19
[patent_title] => 'BGA substrate with direct heat dissipating structure'
[patent_app_type] => new
[patent_app_number] => 09/957372
[patent_app_country] => US
[patent_app_date] => 2001-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3832
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 2
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0189/20020189853.pdf
[firstpage_image] =>[orig_patent_app_number] => 09957372
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/957372 | BGA substrate with direct heat dissipating structure | Sep 19, 2001 | Abandoned |
Array
(
[id] => 6713383
[patent_doc_number] => 20030024730
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-02-06
[patent_title] => 'Filaments for composite oxide superconductors'
[patent_app_type] => new
[patent_app_number] => 09/954123
[patent_app_country] => US
[patent_app_date] => 2001-09-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 9538
[patent_no_of_claims] => 78
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0024/20030024730.pdf
[firstpage_image] =>[orig_patent_app_number] => 09954123
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/954123 | Filaments for composite oxide superconductors | Sep 16, 2001 | Abandoned |
Array
(
[id] => 6463457
[patent_doc_number] => 20020150673
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-10-17
[patent_title] => 'Printed wiring boards and methods for making them'
[patent_app_type] => new
[patent_app_number] => 09/954486
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[patent_app_date] => 2001-09-17
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[patent_drawing_sheets_cnt] => 0
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[pdf_file] => publications/A1/0150/20020150673.pdf
[firstpage_image] =>[orig_patent_app_number] => 09954486
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/954486 | Printed wiring boards and methods for making them | Sep 16, 2001 | Issued |
Array
(
[id] => 5812683
[patent_doc_number] => 20020038721
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-04-04
[patent_title] => 'Wiring circuit board having bumps and method of producing same'
[patent_app_type] => new
[patent_app_number] => 09/951611
[patent_app_country] => US
[patent_app_date] => 2001-09-14
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[pdf_file] => publications/A1/0038/20020038721.pdf
[firstpage_image] =>[orig_patent_app_number] => 09951611
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/951611 | Wiring circuit board having bumps and method of producing same | Sep 13, 2001 | Issued |
Array
(
[id] => 1193566
[patent_doc_number] => 06730860
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-05-04
[patent_title] => 'Electronic assembly and a method of constructing an electronic assembly'
[patent_app_type] => B2
[patent_app_number] => 09/952653
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/730/06730860.pdf
[firstpage_image] =>[orig_patent_app_number] => 09952653
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/952653 | Electronic assembly and a method of constructing an electronic assembly | Sep 12, 2001 | Issued |
Array
(
[id] => 7639917
[patent_doc_number] => 06395999
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-28
[patent_title] => 'Electronic power module and a method of manufacturing such a module'
[patent_app_type] => B1
[patent_app_number] => 09/889931
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[firstpage_image] =>[orig_patent_app_number] => 09889931
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/889931 | Electronic power module and a method of manufacturing such a module | Sep 11, 2001 | Issued |
Array
(
[id] => 5947865
[patent_doc_number] => 20020005296
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-01-17
[patent_title] => 'Surface mount package for long lead devices'
[patent_app_type] => new
[patent_app_number] => 09/949558
[patent_app_country] => US
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[pdf_file] => publications/A1/0005/20020005296.pdf
[firstpage_image] =>[orig_patent_app_number] => 09949558
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/949558 | Surface mount package for long lead devices | Sep 9, 2001 | Issued |
Array
(
[id] => 1189634
[patent_doc_number] => 06734370
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-05-11
[patent_title] => 'Multilayer modules with flexible substrates'
[patent_app_type] => B2
[patent_app_number] => 09/948950
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 09948950
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/948950 | Multilayer modules with flexible substrates | Sep 6, 2001 | Issued |
Array
(
[id] => 1468284
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[patent_title] => 'Laminate circuit structure and method of fabricating'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/947130 | Laminate circuit structure and method of fabricating | Sep 4, 2001 | Issued |
Array
(
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[patent_title] => 'Structure and method for shadow mask electrode'
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[firstpage_image] =>[orig_patent_app_number] => 09943827
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/943827 | Structure and method for shadow mask electrode | Aug 30, 2001 | Issued |