
Ishwarbhai B. Patel
Examiner (ID: 1775, Phone: (571)272-1933 , Office: P/2847 )
| Most Active Art Unit | 2847 |
| Art Unit(s) | 2827, 2847, 2835, 2841 |
| Total Applications | 1757 |
| Issued Applications | 1164 |
| Pending Applications | 46 |
| Abandoned Applications | 568 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 1420375
[patent_doc_number] => 06509530
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-01-21
[patent_title] => 'Via intersect pad for electronic components and methods of manufacture'
[patent_app_type] => B2
[patent_app_number] => 09/887597
[patent_app_country] => US
[patent_app_date] => 2001-06-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 15
[patent_no_of_words] => 6748
[patent_no_of_claims] => 22
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 48
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/509/06509530.pdf
[firstpage_image] =>[orig_patent_app_number] => 09887597
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/887597 | Via intersect pad for electronic components and methods of manufacture | Jun 21, 2001 | Issued |
Array
(
[id] => 6315355
[patent_doc_number] => 20020195268
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-26
[patent_title] => 'THICK FILM CIRCUIT CONNECTION'
[patent_app_type] => new
[patent_app_number] => 09/886853
[patent_app_country] => US
[patent_app_date] => 2001-06-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 832
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 54
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0195/20020195268.pdf
[firstpage_image] =>[orig_patent_app_number] => 09886853
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/886853 | THICK FILM CIRCUIT CONNECTION | Jun 20, 2001 | Abandoned |
| 09/882725 | BGA substrate with direct heat dissipating structure | Jun 14, 2001 | Abandoned |
Array
(
[id] => 1420971
[patent_doc_number] => 06518508
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-02-11
[patent_title] => 'Ag-pre-plated lead frame for semiconductor package'
[patent_app_type] => B2
[patent_app_number] => 09/878341
[patent_app_country] => US
[patent_app_date] => 2001-06-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 11
[patent_no_of_words] => 7433
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 96
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/518/06518508.pdf
[firstpage_image] =>[orig_patent_app_number] => 09878341
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/878341 | Ag-pre-plated lead frame for semiconductor package | Jun 11, 2001 | Issued |
Array
(
[id] => 6565260
[patent_doc_number] => 20020014351
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-02-07
[patent_title] => 'Module-mounting motherboard device'
[patent_app_type] => new
[patent_app_number] => 09/870893
[patent_app_country] => US
[patent_app_date] => 2001-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2775
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 68
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0014/20020014351.pdf
[firstpage_image] =>[orig_patent_app_number] => 09870893
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/870893 | Module-mounting motherboard device | May 30, 2001 | Abandoned |
Array
(
[id] => 6379768
[patent_doc_number] => 20020179331
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-05
[patent_title] => 'Printed wiring board interposer sub-assembly and method'
[patent_app_type] => new
[patent_app_number] => 09/871556
[patent_app_country] => US
[patent_app_date] => 2001-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4580
[patent_no_of_claims] => 42
[patent_no_of_ind_claims] => 8
[patent_words_short_claim] => 72
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0179/20020179331.pdf
[firstpage_image] =>[orig_patent_app_number] => 09871556
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/871556 | Printed wiring board interposer sub-assembly | May 30, 2001 | Issued |
Array
(
[id] => 6920142
[patent_doc_number] => 20010027842
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-10-11
[patent_title] => 'Method for filling high aspect ratio via holes in electronic substrates and the resulting holes'
[patent_app_type] => new
[patent_app_number] => 09/871555
[patent_app_country] => US
[patent_app_date] => 2001-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 6571
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 71
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0027/20010027842.pdf
[firstpage_image] =>[orig_patent_app_number] => 09871555
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/871555 | Method for filling high aspect ratio via holes in electronic substrates and the resulting holes | May 30, 2001 | Issued |
Array
(
[id] => 1476036
[patent_doc_number] => 06388201
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2002-05-14
[patent_title] => 'Wired circuit board'
[patent_app_type] => B2
[patent_app_number] => 09/866813
[patent_app_country] => US
[patent_app_date] => 2001-05-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 13
[patent_no_of_words] => 10338
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/388/06388201.pdf
[firstpage_image] =>[orig_patent_app_number] => 09866813
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/866813 | Wired circuit board | May 29, 2001 | Issued |
Array
(
[id] => 1309066
[patent_doc_number] => 06617522
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-09-09
[patent_title] => 'Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics'
[patent_app_type] => B2
[patent_app_number] => 09/870039
[patent_app_country] => US
[patent_app_date] => 2001-05-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 3131
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 196
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/617/06617522.pdf
[firstpage_image] =>[orig_patent_app_number] => 09870039
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/870039 | Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics | May 29, 2001 | Issued |
Array
(
[id] => 1313585
[patent_doc_number] => 06613986
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-09-02
[patent_title] => 'Multilayer build-up wiring board'
[patent_app_type] => B1
[patent_app_number] => 09/787321
[patent_app_country] => US
[patent_app_date] => 2001-05-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 43
[patent_figures_cnt] => 107
[patent_no_of_words] => 23220
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/613/06613986.pdf
[firstpage_image] =>[orig_patent_app_number] => 09787321
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/787321 | Multilayer build-up wiring board | May 16, 2001 | Issued |
Array
(
[id] => 1384569
[patent_doc_number] => 06555756
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-04-29
[patent_title] => 'Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof'
[patent_app_type] => B2
[patent_app_number] => 09/855671
[patent_app_country] => US
[patent_app_date] => 2001-05-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 22
[patent_no_of_words] => 7109
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 204
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/555/06555756.pdf
[firstpage_image] =>[orig_patent_app_number] => 09855671
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/855671 | Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof | May 15, 2001 | Issued |
Array
(
[id] => 7634487
[patent_doc_number] => 06657133
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-12-02
[patent_title] => 'Ball grid array chip capacitor structure'
[patent_app_type] => B1
[patent_app_number] => 09/858763
[patent_app_country] => US
[patent_app_date] => 2001-05-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 11
[patent_no_of_words] => 2606
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/657/06657133.pdf
[firstpage_image] =>[orig_patent_app_number] => 09858763
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/858763 | Ball grid array chip capacitor structure | May 14, 2001 | Issued |
Array
(
[id] => 1596662
[patent_doc_number] => 06384341
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-07
[patent_title] => 'Differential connector footprint for a multi-layer circuit board'
[patent_app_type] => B1
[patent_app_number] => 09/845907
[patent_app_country] => US
[patent_app_date] => 2001-04-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 5012
[patent_no_of_claims] => 40
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/384/06384341.pdf
[firstpage_image] =>[orig_patent_app_number] => 09845907
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/845907 | Differential connector footprint for a multi-layer circuit board | Apr 29, 2001 | Issued |
Array
(
[id] => 1158627
[patent_doc_number] => 06762366
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-07-13
[patent_title] => 'Ball assignment for ball grid array package'
[patent_app_type] => B1
[patent_app_number] => 09/844530
[patent_app_country] => US
[patent_app_date] => 2001-04-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_no_of_words] => 5885
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/762/06762366.pdf
[firstpage_image] =>[orig_patent_app_number] => 09844530
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/844530 | Ball assignment for ball grid array package | Apr 26, 2001 | Issued |
Array
(
[id] => 1309096
[patent_doc_number] => 06617526
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-09-09
[patent_title] => 'UHF ground interconnects'
[patent_app_type] => B2
[patent_app_number] => 09/839151
[patent_app_country] => US
[patent_app_date] => 2001-04-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 2625
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/617/06617526.pdf
[firstpage_image] =>[orig_patent_app_number] => 09839151
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/839151 | UHF ground interconnects | Apr 22, 2001 | Issued |
Array
(
[id] => 6894932
[patent_doc_number] => 20010025722
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-10-04
[patent_title] => 'Glass-ceramic wiring board'
[patent_app_type] => new
[patent_app_number] => 09/835406
[patent_app_country] => US
[patent_app_date] => 2001-04-17
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0025/20010025722.pdf
[firstpage_image] =>[orig_patent_app_number] => 09835406
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/835406 | Glass-ceramic wiring board | Apr 16, 2001 | Issued |
Array
(
[id] => 1388841
[patent_doc_number] => 06552275
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-04-22
[patent_title] => 'Surface mount component'
[patent_app_type] => B2
[patent_app_number] => 09/835758
[patent_app_country] => US
[patent_app_date] => 2001-04-16
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/552/06552275.pdf
[firstpage_image] =>[orig_patent_app_number] => 09835758
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/835758 | Surface mount component | Apr 15, 2001 | Issued |
Array
(
[id] => 6488659
[patent_doc_number] => 20020189854
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-19
[patent_title] => 'Design for long fatigue life in flexible circuits'
[patent_app_type] => new
[patent_app_number] => 09/829715
[patent_app_country] => US
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[pdf_file] => publications/A1/0189/20020189854.pdf
[firstpage_image] =>[orig_patent_app_number] => 09829715
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/829715 | Design for long fatigue life in flexible circuits | Apr 9, 2001 | Abandoned |
Array
(
[id] => 1408469
[patent_doc_number] => 06534723
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-03-18
[patent_title] => 'Multilayer printed-circuit board and semiconductor device'
[patent_app_type] => B1
[patent_app_number] => 09/821460
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[pdf_file] => patents/06/534/06534723.pdf
[firstpage_image] =>[orig_patent_app_number] => 09821460
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/821460 | Multilayer printed-circuit board and semiconductor device | Apr 5, 2001 | Issued |
Array
(
[id] => 6094213
[patent_doc_number] => 20020051350
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-05-02
[patent_title] => 'Load adjustment board and data processing apparatus'
[patent_app_type] => new
[patent_app_number] => 09/824015
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[pdf_file] => publications/A1/0051/20020051350.pdf
[firstpage_image] =>[orig_patent_app_number] => 09824015
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/824015 | Load adjustment board and data processing apparatus | Apr 2, 2001 | Issued |