| Application number | Title of the application | Filing Date | Status |
|---|
Array
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[id] => 7639918
[patent_doc_number] => 06395998
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-28
[patent_title] => 'Electronic package having an adhesive retaining cavity'
[patent_app_type] => B1
[patent_app_number] => 09/661652
[patent_app_country] => US
[patent_app_date] => 2000-09-13
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/661652 | Electronic package having an adhesive retaining cavity | Sep 12, 2000 | Issued |
| 09/661253 | Superconducting tapes | Sep 12, 2000 | Abandoned |
Array
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[patent_doc_number] => 06492599
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[patent_kind] => B1
[patent_issue_date] => 2002-12-10
[patent_title] => 'Multilayer wiring board, manufacturing method thereof, and wafer block contact board'
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Array
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[patent_doc_number] => 06552277
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[patent_issue_date] => 2003-04-22
[patent_title] => 'Techniques for forming a connection between a pin and a circuit board'
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Array
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[patent_kind] => B1
[patent_issue_date] => 2002-10-15
[patent_title] => 'Three dimensional structure and method of manufacturing the same'
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/649169 | Via connector and method of making same | Aug 24, 2000 | Issued |
Array
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[patent_issue_date] => 2004-05-18
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Array
(
[id] => 4330324
[patent_doc_number] => 06329604
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[patent_kind] => NA
[patent_issue_date] => 2001-12-11
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[firstpage_image] =>[orig_patent_app_number] => 635175
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/635175 | Multilayer printed circuit board | Aug 8, 2000 | Issued |
Array
(
[id] => 1550731
[patent_doc_number] => 06346679
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[patent_kind] => B1
[patent_issue_date] => 2002-02-12
[patent_title] => 'Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate'
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[patent_app_number] => 09/635478
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[firstpage_image] =>[orig_patent_app_number] => 09635478
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/635478 | Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate | Aug 7, 2000 | Issued |
Array
(
[id] => 7643655
[patent_doc_number] => 06429385
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Array
(
[id] => 1587475
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[patent_kind] => B1
[patent_issue_date] => 2002-03-19
[patent_title] => 'Electrical device mounting wiring board and method of producing the same'
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[patent_app_number] => 09/627846
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[patent_app_date] => 2000-07-28
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| 09/600370 | METHOD OF EASILY IDENTIFYING AN ELECTRODE AMONG ALL THE ELECTRODES 0F ANARRAY AND AN ARRAY OF ELECTRODES FOR IMPLEMENTING THE METHOD | Jul 13, 2000 | Abandoned |
Array
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Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/582665 | Multilayer printed wiring board | Jun 28, 2000 | Issued |
| 09/603840 | CONNECTION STRUCTURE | Jun 25, 2000 | Abandoned |
Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/424179 | Substrate for electronic packaging, pin jig fixture | Jun 21, 2000 | Issued |
Array
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Array
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