
Jack Dinh
Examiner (ID: 394, Phone: (571)272-2327 , Office: P/2872 )
| Most Active Art Unit | 2872 |
| Art Unit(s) | 2872, 2873 |
| Total Applications | 1839 |
| Issued Applications | 1588 |
| Pending Applications | 122 |
| Abandoned Applications | 164 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 663907
[patent_doc_number] => 07102082
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-09-05
[patent_title] => 'Electromagnetic interference shielding of electrical cables and connectors'
[patent_app_type] => utility
[patent_app_number] => 10/691391
[patent_app_country] => US
[patent_app_date] => 2003-10-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 15
[patent_no_of_words] => 4125
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 114
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/102/07102082.pdf
[firstpage_image] =>[orig_patent_app_number] => 10691391
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/691391 | Electromagnetic interference shielding of electrical cables and connectors | Oct 20, 2003 | Issued |
Array
(
[id] => 7153172
[patent_doc_number] => 20050082089
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-04-21
[patent_title] => 'Stacked interconnect structure between copper lines of a semiconductor circuit'
[patent_app_type] => utility
[patent_app_number] => 10/688452
[patent_app_country] => US
[patent_app_date] => 2003-10-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 4779
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0082/20050082089.pdf
[firstpage_image] =>[orig_patent_app_number] => 10688452
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/688452 | Stacked interconnect structure between copper lines of a semiconductor circuit | Oct 17, 2003 | Abandoned |
Array
(
[id] => 7151450
[patent_doc_number] => 20050081375
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-04-21
[patent_title] => 'Printed circuit board assembly and method'
[patent_app_type] => utility
[patent_app_number] => 10/688341
[patent_app_country] => US
[patent_app_date] => 2003-10-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1385
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0081/20050081375.pdf
[firstpage_image] =>[orig_patent_app_number] => 10688341
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/688341 | Printed circuit board assembly and method | Oct 16, 2003 | Abandoned |
Array
(
[id] => 7170117
[patent_doc_number] => 20040200063
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-10-14
[patent_title] => 'Interposer substrates with multi-segment interconnect slots, semiconductor die packages including same, semiconductor dice for use therewith and methods of fabrication'
[patent_app_type] => new
[patent_app_number] => 10/685312
[patent_app_country] => US
[patent_app_date] => 2003-10-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4314
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 34
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0200/20040200063.pdf
[firstpage_image] =>[orig_patent_app_number] => 10685312
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/685312 | Interposer substrates with multi-segment interconnect slots, semiconductor die packages including same, semiconductor dice for use therewith and methods of fabrication | Oct 13, 2003 | Abandoned |
Array
(
[id] => 7156199
[patent_doc_number] => 20040074086
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-04-22
[patent_title] => 'Method for forming conductor wire on a substrate board'
[patent_app_type] => new
[patent_app_number] => 10/685844
[patent_app_country] => US
[patent_app_date] => 2003-10-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 12055
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 118
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0074/20040074086.pdf
[firstpage_image] =>[orig_patent_app_number] => 10685844
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/685844 | System for forming conductor wire on a substrate board | Oct 13, 2003 | Issued |
Array
(
[id] => 5651448
[patent_doc_number] => 20060137183
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-29
[patent_title] => 'Recoverable assembly and method of enclosing an elongated substrate using such an assembly'
[patent_app_type] => utility
[patent_app_number] => 10/531354
[patent_app_country] => US
[patent_app_date] => 2003-10-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3109
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0137/20060137183.pdf
[firstpage_image] =>[orig_patent_app_number] => 10531354
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/531354 | Recoverable assembly and method of enclosing an elongated substrate using such an assembly | Oct 13, 2003 | Abandoned |
Array
(
[id] => 7294215
[patent_doc_number] => 20040123457
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-01
[patent_title] => 'Method for connecting printed circuit boards'
[patent_app_type] => new
[patent_app_number] => 10/681213
[patent_app_country] => US
[patent_app_date] => 2003-10-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 2282
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 122
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0123/20040123457.pdf
[firstpage_image] =>[orig_patent_app_number] => 10681213
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/681213 | Method for connecting printed circuit boards | Oct 8, 2003 | Issued |
Array
(
[id] => 8013475
[patent_doc_number] => 08136233
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-03-20
[patent_title] => 'Tools for seating connectors on substrates'
[patent_app_type] => utility
[patent_app_number] => 10/683204
[patent_app_country] => US
[patent_app_date] => 2003-10-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 43
[patent_no_of_words] => 4094
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 137
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/136/08136233.pdf
[firstpage_image] =>[orig_patent_app_number] => 10683204
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/683204 | Tools for seating connectors on substrates | Oct 8, 2003 | Issued |
Array
(
[id] => 98398
[patent_doc_number] => 07726013
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-06-01
[patent_title] => 'Method of manufacturing circuit board including transfer chip having a plurality of first pad electrodes connected to wiring'
[patent_app_type] => utility
[patent_app_number] => 10/680173
[patent_app_country] => US
[patent_app_date] => 2003-10-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 24
[patent_no_of_words] => 11417
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 259
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/726/07726013.pdf
[firstpage_image] =>[orig_patent_app_number] => 10680173
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/680173 | Method of manufacturing circuit board including transfer chip having a plurality of first pad electrodes connected to wiring | Oct 7, 2003 | Issued |
Array
(
[id] => 388871
[patent_doc_number] => 07299530
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-11-27
[patent_title] => 'Ball grid array rework using a continuous belt furnace'
[patent_app_type] => utility
[patent_app_number] => 10/680622
[patent_app_country] => US
[patent_app_date] => 2003-10-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 8
[patent_no_of_words] => 3139
[patent_no_of_claims] => 7
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 143
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/299/07299530.pdf
[firstpage_image] =>[orig_patent_app_number] => 10680622
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/680622 | Ball grid array rework using a continuous belt furnace | Oct 6, 2003 | Issued |
Array
(
[id] => 7325969
[patent_doc_number] => 20040128827
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-08
[patent_title] => 'Apparatus and system for mounting components and program for controlling the same'
[patent_app_type] => new
[patent_app_number] => 10/679412
[patent_app_country] => US
[patent_app_date] => 2003-10-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 20648
[patent_no_of_claims] => 27
[patent_no_of_ind_claims] => 11
[patent_words_short_claim] => 110
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0128/20040128827.pdf
[firstpage_image] =>[orig_patent_app_number] => 10679412
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/679412 | Apparatus and system for mounting components and program for controlling the same | Oct 6, 2003 | Abandoned |
Array
(
[id] => 7456015
[patent_doc_number] => 20040068165
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-04-08
[patent_title] => 'Electrically-conductive patterns for monitoring the filling of medical devices'
[patent_app_type] => new
[patent_app_number] => 10/678342
[patent_app_country] => US
[patent_app_date] => 2003-10-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 3745
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 56
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0068/20040068165.pdf
[firstpage_image] =>[orig_patent_app_number] => 10678342
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/678342 | Electrically-conductive patterns for monitoring the filling of medical devices | Oct 2, 2003 | Abandoned |
Array
(
[id] => 703125
[patent_doc_number] => 07059047
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-06-13
[patent_title] => 'Sockets for “springed” semiconductor devices'
[patent_app_type] => utility
[patent_app_number] => 10/673691
[patent_app_country] => US
[patent_app_date] => 2003-09-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 16
[patent_no_of_words] => 6917
[patent_no_of_claims] => 38
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 148
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/059/07059047.pdf
[firstpage_image] =>[orig_patent_app_number] => 10673691
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/673691 | Sockets for “springed†semiconductor devices | Sep 28, 2003 | Issued |
Array
(
[id] => 7330918
[patent_doc_number] => 20040130863
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-07-08
[patent_title] => 'Method and apparatus for mounting electronic components and program therefor'
[patent_app_type] => new
[patent_app_number] => 10/669552
[patent_app_country] => US
[patent_app_date] => 2003-09-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 9401
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 135
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0130/20040130863.pdf
[firstpage_image] =>[orig_patent_app_number] => 10669552
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/669552 | Method and apparatus for mounting electronic components and program therefor | Sep 24, 2003 | Abandoned |
Array
(
[id] => 5184812
[patent_doc_number] => 20070163118
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-19
[patent_title] => 'Exhaust line catalyst or muffler shell for motor vehicle and method of producing one such shell'
[patent_app_type] => utility
[patent_app_number] => 10/527886
[patent_app_country] => US
[patent_app_date] => 2003-09-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 1171
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0163/20070163118.pdf
[firstpage_image] =>[orig_patent_app_number] => 10527886
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/527886 | Exhaust line catalyst or muffler shell for motor vehicle and method of producing one such shell | Sep 24, 2003 | Abandoned |
Array
(
[id] => 194053
[patent_doc_number] => 07637005
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-12-29
[patent_title] => 'Cable-processing machine with swiveling device for serving processing stations with cable-ends'
[patent_app_type] => utility
[patent_app_number] => 10/670954
[patent_app_country] => US
[patent_app_date] => 2003-09-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 9
[patent_no_of_words] => 1988
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 229
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/637/07637005.pdf
[firstpage_image] =>[orig_patent_app_number] => 10670954
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/670954 | Cable-processing machine with swiveling device for serving processing stations with cable-ends | Sep 24, 2003 | Issued |
Array
(
[id] => 7007144
[patent_doc_number] => 20050060878
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-03-24
[patent_title] => 'Electrical connector insertion and removal tool'
[patent_app_type] => utility
[patent_app_number] => 10/666905
[patent_app_country] => US
[patent_app_date] => 2003-09-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 6084
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0060/20050060878.pdf
[firstpage_image] =>[orig_patent_app_number] => 10666905
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/666905 | Electrical connector insertion and removal tool | Sep 18, 2003 | Issued |
Array
(
[id] => 1060526
[patent_doc_number] => 06848179
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-02-01
[patent_title] => 'Terminal mounting method and apparatus'
[patent_app_type] => utility
[patent_app_number] => 10/663724
[patent_app_country] => US
[patent_app_date] => 2003-09-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 27
[patent_figures_cnt] => 52
[patent_no_of_words] => 16450
[patent_no_of_claims] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/848/06848179.pdf
[firstpage_image] =>[orig_patent_app_number] => 10663724
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/663724 | Terminal mounting method and apparatus | Sep 16, 2003 | Issued |
Array
(
[id] => 7124084
[patent_doc_number] => 20050055827
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-03-17
[patent_title] => 'Mechanism for positioning a substrate of an image sensor'
[patent_app_type] => utility
[patent_app_number] => 10/665064
[patent_app_country] => US
[patent_app_date] => 2003-09-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 1855
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 1
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0055/20050055827.pdf
[firstpage_image] =>[orig_patent_app_number] => 10665064
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/665064 | Mechanism for positioning a substrate of an image sensor | Sep 16, 2003 | Abandoned |
Array
(
[id] => 7193600
[patent_doc_number] => 20050050724
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-03-10
[patent_title] => 'Method for fabricating high density of multi-polyimide-layer DPC lines on a ceramic board'
[patent_app_type] => utility
[patent_app_number] => 10/659883
[patent_app_country] => US
[patent_app_date] => 2003-09-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 1389
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0050/20050050724.pdf
[firstpage_image] =>[orig_patent_app_number] => 10659883
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/659883 | Method for fabricating high density of multi-polyimide-layer DPC lines on a ceramic board | Sep 9, 2003 | Abandoned |