| Application number | Title of the application | Filing Date | Status |
|---|
Array
(
[id] => 1330036
[patent_doc_number] => 06581283
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-06-24
[patent_title] => 'Method for forming pin-form wires and the like'
[patent_app_type] => B2
[patent_app_number] => 09/729041
[patent_app_country] => US
[patent_app_date] => 2000-12-04
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[pdf_file] => patents/06/581/06581283.pdf
[firstpage_image] =>[orig_patent_app_number] => 09729041
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/729041 | Method for forming pin-form wires and the like | Dec 3, 2000 | Issued |
Array
(
[id] => 6875157
[patent_doc_number] => 20010000057
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-03-22
[patent_title] => 'Semiconductor mounting apparatus with a chip gripper traveling back and forth'
[patent_app_type] => new-utility
[patent_app_number] => 09/726736
[patent_app_country] => US
[patent_app_date] => 2000-11-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0000/20010000057.pdf
[firstpage_image] =>[orig_patent_app_number] => 09726736
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/726736 | Semiconductor mounting apparatus with a chip gripper traveling back and forth | Nov 28, 2000 | Abandoned |
Array
(
[id] => 1308619
[patent_doc_number] => 06604268
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-08-12
[patent_title] => 'Apparatus for processing an end of a shielded cable'
[patent_app_type] => B1
[patent_app_number] => 09/718565
[patent_app_country] => US
[patent_app_date] => 2000-11-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
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[pdf_file] => patents/06/604/06604268.pdf
[firstpage_image] =>[orig_patent_app_number] => 09718565
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/718565 | Apparatus for processing an end of a shielded cable | Nov 21, 2000 | Issued |
Array
(
[id] => 1196091
[patent_doc_number] => 06722030
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-04-20
[patent_title] => 'Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves'
[patent_app_type] => B1
[patent_app_number] => 09/622351
[patent_app_country] => US
[patent_app_date] => 2000-11-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 1120
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[pdf_file] => patents/06/722/06722030.pdf
[firstpage_image] =>[orig_patent_app_number] => 09622351
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/622351 | Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves | Nov 12, 2000 | Issued |
Array
(
[id] => 1086229
[patent_doc_number] => 06826827
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-12-07
[patent_title] => 'Forming conductive posts by selective removal of conductive material'
[patent_app_type] => B1
[patent_app_number] => 09/707452
[patent_app_country] => US
[patent_app_date] => 2000-11-07
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[pdf_file] => patents/06/826/06826827.pdf
[firstpage_image] =>[orig_patent_app_number] => 09707452
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/707452 | Forming conductive posts by selective removal of conductive material | Nov 6, 2000 | Issued |
Array
(
[id] => 1205117
[patent_doc_number] => 06711813
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-03-30
[patent_title] => 'Method for fabricating a thin film build-up structure on a sequentially laminated printed circuit board base'
[patent_app_type] => B1
[patent_app_number] => 09/707311
[patent_app_country] => US
[patent_app_date] => 2000-11-06
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[firstpage_image] =>[orig_patent_app_number] => 09707311
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/707311 | Method for fabricating a thin film build-up structure on a sequentially laminated printed circuit board base | Nov 5, 2000 | Issued |
Array
(
[id] => 1258143
[patent_doc_number] => 06658731
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-12-09
[patent_title] => 'Method for fabricating connectors for interconnecting etched tri-metal circuit structures'
[patent_app_type] => B1
[patent_app_number] => 09/703554
[patent_app_country] => US
[patent_app_date] => 2000-11-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => patents/06/658/06658731.pdf
[firstpage_image] =>[orig_patent_app_number] => 09703554
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/703554 | Method for fabricating connectors for interconnecting etched tri-metal circuit structures | Oct 31, 2000 | Issued |
Array
(
[id] => 1398677
[patent_doc_number] => 06505401
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-01-14
[patent_title] => 'Method of making an implantable medical electrical lead'
[patent_app_type] => B1
[patent_app_number] => 09/699161
[patent_app_country] => US
[patent_app_date] => 2000-10-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_claims] => 3
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/505/06505401.pdf
[firstpage_image] =>[orig_patent_app_number] => 09699161
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/699161 | Method of making an implantable medical electrical lead | Oct 26, 2000 | Issued |
| 09/697880 | Alignment of sliders with a dimple post in head gimbal assemblies | Oct 25, 2000 | Abandoned |
Array
(
[id] => 1161739
[patent_doc_number] => 06745463
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-06-08
[patent_title] => 'Manufacturing method of rigid flexible printed circuit board'
[patent_app_type] => B1
[patent_app_number] => 09/694822
[patent_app_country] => US
[patent_app_date] => 2000-10-24
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[pdf_file] => patents/06/745/06745463.pdf
[firstpage_image] =>[orig_patent_app_number] => 09694822
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/694822 | Manufacturing method of rigid flexible printed circuit board | Oct 23, 2000 | Issued |
Array
(
[id] => 1134747
[patent_doc_number] => 06775906
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-08-17
[patent_title] => 'Method of manufacturing an integrated circuit carrier'
[patent_app_type] => B1
[patent_app_number] => 09/693484
[patent_app_country] => US
[patent_app_date] => 2000-10-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[pdf_file] => patents/06/775/06775906.pdf
[firstpage_image] =>[orig_patent_app_number] => 09693484
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/693484 | Method of manufacturing an integrated circuit carrier | Oct 19, 2000 | Issued |
Array
(
[id] => 1265828
[patent_doc_number] => 06647614
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-11-18
[patent_title] => 'Method for changing an electrical resistance of a resistor'
[patent_app_type] => B1
[patent_app_number] => 09/693765
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[patent_app_date] => 2000-10-20
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[patent_drawing_sheets_cnt] => 6
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[firstpage_image] =>[orig_patent_app_number] => 09693765
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/693765 | Method for changing an electrical resistance of a resistor | Oct 19, 2000 | Issued |
Array
(
[id] => 1287456
[patent_doc_number] => 06625873
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-09-30
[patent_title] => 'Method of making an injection molding nozzle with tip insert'
[patent_app_type] => B1
[patent_app_number] => 09/678248
[patent_app_country] => US
[patent_app_date] => 2000-10-04
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/678248 | Method of making an injection molding nozzle with tip insert | Oct 3, 2000 | Issued |
| 09/672222 | Low inductive wire bond chip packaging | Sep 26, 2000 | Abandoned |
Array
(
[id] => 743561
[patent_doc_number] => 07020958
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2006-04-04
[patent_title] => 'Methods forming an integrated circuit package with a split cavity wall'
[patent_app_type] => utility
[patent_app_number] => 09/665034
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/665034 | Methods forming an integrated circuit package with a split cavity wall | Sep 18, 2000 | Issued |
Array
(
[id] => 1390780
[patent_doc_number] => 06513237
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[patent_kind] => B1
[patent_issue_date] => 2003-02-04
[patent_title] => 'Method for producing pressin contact'
[patent_app_type] => B1
[patent_app_number] => 09/663495
[patent_app_country] => US
[patent_app_date] => 2000-09-18
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 09663495
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/663495 | Method for producing pressin contact | Sep 17, 2000 | Issued |
| 09/663253 | A METHOD FOR PRODUING A C0NDUCTOR BOARD AND THE CONDUCTOR BOARD THEREBY PRODUCED | Sep 14, 2000 | Abandoned |
Array
(
[id] => 1134752
[patent_doc_number] => 06775907
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[patent_kind] => B1
[patent_issue_date] => 2004-08-17
[patent_title] => 'Process for manufacturing a printed wiring board'
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[patent_app_number] => 09/661738
[patent_app_country] => US
[patent_app_date] => 2000-09-14
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[firstpage_image] =>[orig_patent_app_number] => 09661738
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/661738 | Process for manufacturing a printed wiring board | Sep 13, 2000 | Issued |
| 09/659302 | Flexible lead structures and methods of making same | Sep 11, 2000 | Abandoned |
Array
(
[id] => 1242796
[patent_doc_number] => 06675454
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-01-13
[patent_title] => 'Method for recycling used printed circuit boards'
[patent_app_type] => B1
[patent_app_number] => 09/601212
[patent_app_country] => US
[patent_app_date] => 2000-09-11
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[firstpage_image] =>[orig_patent_app_number] => 09601212
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/601212 | Method for recycling used printed circuit boards | Sep 10, 2000 | Issued |