![](/images/general/no_picture/200_user.png)
Jack I Berman
Examiner (ID: 1875, Phone: (571)272-2468 , Office: P/2881 )
Most Active Art Unit | 2506 |
Art Unit(s) | 2899, 2878, 2506, 2881 |
Total Applications | 2582 |
Issued Applications | 2249 |
Pending Applications | 67 |
Abandoned Applications | 266 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 4762679
[patent_doc_number] => 20080173888
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-24
[patent_title] => 'Light-emitting diode chip package body and packaging method thereof'
[patent_app_type] => utility
[patent_app_number] => 12/007276
[patent_app_country] => US
[patent_app_date] => 2008-01-09
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[pdf_file] => publications/A1/0173/20080173888.pdf
[firstpage_image] =>[orig_patent_app_number] => 12007276
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/007276 | Light-emitting diode chip package body and packaging method thereof | Jan 8, 2008 | Issued |
Array
(
[id] => 5578721
[patent_doc_number] => 20090174067
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-07-09
[patent_title] => 'AIRGAP-CONTAINING INTERCONNECT STRUCTURE WITH PATTERNABLE LOW-K MATERIAL AND METHOD OF FABRICATING'
[patent_app_type] => utility
[patent_app_number] => 11/971470
[patent_app_country] => US
[patent_app_date] => 2008-01-09
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0174/20090174067.pdf
[firstpage_image] =>[orig_patent_app_number] => 11971470
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/971470 | Airgap-containing interconnect structure with patternable low-k material and method of fabricating | Jan 8, 2008 | Issued |
Array
(
[id] => 4925140
[patent_doc_number] => 20080164503
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-10
[patent_title] => 'Ferroelectric Memory Devices Having a Protruding Bottom Electrode and Methods of Forming the Same'
[patent_app_type] => utility
[patent_app_number] => 11/970770
[patent_app_country] => US
[patent_app_date] => 2008-01-08
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/970770 | Ferroelectric Memory Devices Having a Protruding Bottom Electrode and Methods of Forming the Same | Jan 7, 2008 | Abandoned |
Array
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[id] => 5578738
[patent_doc_number] => 20090174084
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-07-09
[patent_title] => 'VIA OFFSETTING TO REDUCE STRESS UNDER THE FIRST LEVEL INTERCONNECT (FLI) IN MICROELECTRONICS PACKAGING'
[patent_app_type] => utility
[patent_app_number] => 11/970130
[patent_app_country] => US
[patent_app_date] => 2008-01-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/970130 | Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging | Jan 6, 2008 | Issued |
Array
(
[id] => 4952688
[patent_doc_number] => 20080185712
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[patent_issue_date] => 2008-08-07
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/968840
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Array
(
[id] => 4849456
[patent_doc_number] => 20080315198
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[patent_kind] => A1
[patent_issue_date] => 2008-12-25
[patent_title] => 'IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME'
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[patent_app_number] => 11/967380
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[pdf_file] => publications/A1/0315/20080315198.pdf
[firstpage_image] =>[orig_patent_app_number] => 11967380
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/967380 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME | Dec 30, 2007 | Abandoned |
Array
(
[id] => 5432266
[patent_doc_number] => 20090166852
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-07-02
[patent_title] => 'SEMICONDUCTOR PACKAGES WITH THERMAL INTERFACE MATERIALS'
[patent_app_type] => utility
[patent_app_number] => 11/967860
[patent_app_country] => US
[patent_app_date] => 2007-12-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0166/20090166852.pdf
[firstpage_image] =>[orig_patent_app_number] => 11967860
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/967860 | SEMICONDUCTOR PACKAGES WITH THERMAL INTERFACE MATERIALS | Dec 30, 2007 | Abandoned |
Array
(
[id] => 5432240
[patent_doc_number] => 20090166826
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-07-02
[patent_title] => 'LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES'
[patent_app_type] => utility
[patent_app_number] => 11/965620
[patent_app_country] => US
[patent_app_date] => 2007-12-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => publications/A1/0166/20090166826.pdf
[firstpage_image] =>[orig_patent_app_number] => 11965620
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/965620 | LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES | Dec 26, 2007 | Abandoned |
Array
(
[id] => 4876725
[patent_doc_number] => 20080150108
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-26
[patent_title] => 'SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME'
[patent_app_type] => utility
[patent_app_number] => 11/964460
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[pdf_file] => publications/A1/0150/20080150108.pdf
[firstpage_image] =>[orig_patent_app_number] => 11964460
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/964460 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME | Dec 25, 2007 | Abandoned |
Array
(
[id] => 5499357
[patent_doc_number] => 20090160045
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-06-25
[patent_title] => 'WAFER LEVEL CHIP SCALE PACKAGING'
[patent_app_type] => utility
[patent_app_number] => 11/963690
[patent_app_country] => US
[patent_app_date] => 2007-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => publications/A1/0160/20090160045.pdf
[firstpage_image] =>[orig_patent_app_number] => 11963690
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/963690 | Wafer level chip scale packaging | Dec 20, 2007 | Issued |
Array
(
[id] => 8760605
[patent_doc_number] => 08421128
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-04-16
[patent_title] => 'Semiconductor device heat dissipation structure'
[patent_app_type] => utility
[patent_app_number] => 11/960030
[patent_app_country] => US
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11960030
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/960030 | Semiconductor device heat dissipation structure | Dec 18, 2007 | Issued |
Array
(
[id] => 5499365
[patent_doc_number] => 20090160053
[patent_country] => US
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[patent_title] => 'METHOD OF MANUFACTURING A SEMICONDUCOTOR DEVICE'
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Array
(
[id] => 5282287
[patent_doc_number] => 20090095961
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[patent_title] => 'Combination of LED and heat dissipation device'
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Array
(
[id] => 4820847
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[patent_title] => 'Damascene interconnect structure having air gaps between metal lines and method for fabricating the same'
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Array
(
[id] => 5563224
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[patent_title] => 'Portable inflatable and illuminative speaker'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/984913 | Portable inflatable and illuminative speaker | Nov 25, 2007 | Abandoned |
Array
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[id] => 4829480
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Array
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Array
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Array
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Array
(
[id] => 4640023
[patent_doc_number] => 08018050
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-09-13
[patent_title] => 'Integrated circuit package with integrated heat sink'
[patent_app_type] => utility
[patent_app_number] => 11/933990
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11933990
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/933990 | Integrated circuit package with integrated heat sink | Oct 31, 2007 | Issued |