Search

Jack I Berman

Examiner (ID: 1875, Phone: (571)272-2468 , Office: P/2881 )

Most Active Art Unit
2506
Art Unit(s)
2899, 2878, 2506, 2881
Total Applications
2582
Issued Applications
2249
Pending Applications
67
Abandoned Applications
266

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5346251 [patent_doc_number] => 20090001612 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-01-01 [patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION' [patent_app_type] => utility [patent_app_number] => 11/768640 [patent_app_country] => US [patent_app_date] => 2007-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 8593 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20090001612.pdf [firstpage_image] =>[orig_patent_app_number] => 11768640 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/768640
Integrated circuit package system with dual side connection Jun 25, 2007 Issued
Array ( [id] => 4574864 [patent_doc_number] => 07859039 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-12-28 [patent_title] => 'X-shaped semiconductor capacitor structure' [patent_app_type] => utility [patent_app_number] => 11/760785 [patent_app_country] => US [patent_app_date] => 2007-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4206 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 226 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/859/07859039.pdf [firstpage_image] =>[orig_patent_app_number] => 11760785 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/760785
X-shaped semiconductor capacitor structure Jun 9, 2007 Issued
Array ( [id] => 5063159 [patent_doc_number] => 20070224799 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-27 [patent_title] => 'System for making a semiconductor device using bump material including liquid' [patent_app_type] => utility [patent_app_number] => 11/807100 [patent_app_country] => US [patent_app_date] => 2007-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4016 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0224/20070224799.pdf [firstpage_image] =>[orig_patent_app_number] => 11807100 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/807100
System for making a semiconductor device using bump material including liquid May 24, 2007 Abandoned
Array ( [id] => 4789552 [patent_doc_number] => 20080290525 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-11-27 [patent_title] => 'SILICON-ON-INSULATOR STRUCTURES FOR THROUGH VIA IN SILICON CARRIERS' [patent_app_type] => utility [patent_app_number] => 11/751105 [patent_app_country] => US [patent_app_date] => 2007-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4482 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0290/20080290525.pdf [firstpage_image] =>[orig_patent_app_number] => 11751105 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/751105
Silicon-on-insulator structures for through via in silicon carriers May 20, 2007 Issued
Array ( [id] => 4743427 [patent_doc_number] => 20080088028 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-17 [patent_title] => 'Substrate and manufacturing method of package structure' [patent_app_type] => utility [patent_app_number] => 11/790030 [patent_app_country] => US [patent_app_date] => 2007-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 3671 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0088/20080088028.pdf [firstpage_image] =>[orig_patent_app_number] => 11790030 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/790030
Substrate and manufacturing method of package structure Apr 22, 2007 Issued
Array ( [id] => 5210573 [patent_doc_number] => 20070249157 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-25 [patent_title] => 'Semiconductor device and method for manufacturing same' [patent_app_type] => utility [patent_app_number] => 11/785820 [patent_app_country] => US [patent_app_date] => 2007-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 4284 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0249/20070249157.pdf [firstpage_image] =>[orig_patent_app_number] => 11785820 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/785820
Semiconductor device and method for manufacturing same Apr 19, 2007 Abandoned
Array ( [id] => 13529 [patent_doc_number] => 07807563 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-10-05 [patent_title] => 'Method for manufacturing a layer arrangement and layer arrangement' [patent_app_type] => utility [patent_app_number] => 11/786770 [patent_app_country] => US [patent_app_date] => 2007-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 18 [patent_no_of_words] => 7949 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 179 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/807/07807563.pdf [firstpage_image] =>[orig_patent_app_number] => 11786770 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/786770
Method for manufacturing a layer arrangement and layer arrangement Apr 11, 2007 Issued
Array ( [id] => 5123618 [patent_doc_number] => 20070235888 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-11 [patent_title] => 'FILM TYPE PACKAGE AND DISPLAY APPARATUS HAVING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/697540 [patent_app_country] => US [patent_app_date] => 2007-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2833 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0235/20070235888.pdf [firstpage_image] =>[orig_patent_app_number] => 11697540 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/697540
FILM TYPE PACKAGE AND DISPLAY APPARATUS HAVING THE SAME Apr 5, 2007 Abandoned
Array ( [id] => 4648794 [patent_doc_number] => 20080036049 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-14 [patent_title] => 'STACKED INTEGRATION MODULE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/696750 [patent_app_country] => US [patent_app_date] => 2007-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2000 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20080036049.pdf [firstpage_image] =>[orig_patent_app_number] => 11696750 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/696750
STACKED INTEGRATION MODULE AND METHOD FOR MANUFACTURING THE SAME Apr 4, 2007 Abandoned
Array ( [id] => 5124620 [patent_doc_number] => 20070236891 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-11 [patent_title] => 'Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 11/730360 [patent_app_country] => US [patent_app_date] => 2007-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 9627 [patent_no_of_claims] => 38 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0236/20070236891.pdf [firstpage_image] =>[orig_patent_app_number] => 11730360 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/730360
Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the same Mar 29, 2007 Abandoned
Array ( [id] => 4462444 [patent_doc_number] => 07880300 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-01 [patent_title] => 'Semiconductor chip comprising a metal coating structure and associated production method' [patent_app_type] => utility [patent_app_number] => 11/692530 [patent_app_country] => US [patent_app_date] => 2007-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 9 [patent_no_of_words] => 4915 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 152 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/880/07880300.pdf [firstpage_image] =>[orig_patent_app_number] => 11692530 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/692530
Semiconductor chip comprising a metal coating structure and associated production method Mar 27, 2007 Issued
Array ( [id] => 4462419 [patent_doc_number] => 07880288 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-01 [patent_title] => 'Semiconductor module with semiconductor chips and method for producing it' [patent_app_type] => utility [patent_app_number] => 11/692020 [patent_app_country] => US [patent_app_date] => 2007-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 9 [patent_no_of_words] => 5396 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 263 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/880/07880288.pdf [firstpage_image] =>[orig_patent_app_number] => 11692020 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/692020
Semiconductor module with semiconductor chips and method for producing it Mar 26, 2007 Issued
Array ( [id] => 4719025 [patent_doc_number] => 20080241547 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-02 [patent_title] => 'METHODS OF LASER SURFACE MODIFICATION OF CERAMIC PACKAGES FOR UNDERFILL SPREAD CONTROL AND STRUCTURES FORMED THEREBY' [patent_app_type] => utility [patent_app_number] => 11/691390 [patent_app_country] => US [patent_app_date] => 2007-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1466 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0241/20080241547.pdf [firstpage_image] =>[orig_patent_app_number] => 11691390 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/691390
METHODS OF LASER SURFACE MODIFICATION OF CERAMIC PACKAGES FOR UNDERFILL SPREAD CONTROL AND STRUCTURES FORMED THEREBY Mar 25, 2007 Abandoned
Array ( [id] => 4737265 [patent_doc_number] => 20080230917 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-09-25 [patent_title] => ' METHOD OF FABRICATING TWO-STEP SELF-ALIGNED CONTACT' [patent_app_type] => utility [patent_app_number] => 11/686740 [patent_app_country] => US [patent_app_date] => 2007-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4751 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0230/20080230917.pdf [firstpage_image] =>[orig_patent_app_number] => 11686740 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/686740
Method of fabricating two-step self-aligned contact Mar 14, 2007 Issued
Array ( [id] => 4695591 [patent_doc_number] => 20080217775 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-09-11 [patent_title] => 'Method of forming contact plugs for eliminating tungsten seam issue' [patent_app_type] => utility [patent_app_number] => 11/714770 [patent_app_country] => US [patent_app_date] => 2007-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2128 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0217/20080217775.pdf [firstpage_image] =>[orig_patent_app_number] => 11714770 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/714770
Method of forming contact plugs for eliminating tungsten seam issue Mar 6, 2007 Abandoned
Array ( [id] => 5196771 [patent_doc_number] => 20070296089 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-27 [patent_title] => 'Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby' [patent_app_type] => utility [patent_app_number] => 11/714010 [patent_app_country] => US [patent_app_date] => 2007-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2817 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0296/20070296089.pdf [firstpage_image] =>[orig_patent_app_number] => 11714010 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/714010
Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby Mar 4, 2007 Abandoned
Array ( [id] => 8435982 [patent_doc_number] => 08283753 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-10-09 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/712910 [patent_app_country] => US [patent_app_date] => 2007-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 24 [patent_no_of_words] => 10102 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11712910 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/712910
Semiconductor device Mar 1, 2007 Issued
Array ( [id] => 5008180 [patent_doc_number] => 20070278657 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-06 [patent_title] => 'Chip stack, method of fabrication thereof, and semiconductor package having the same' [patent_app_type] => utility [patent_app_number] => 11/710490 [patent_app_country] => US [patent_app_date] => 2007-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 7690 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0278/20070278657.pdf [firstpage_image] =>[orig_patent_app_number] => 11710490 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/710490
Chip stack, method of fabrication thereof, and semiconductor package having the same Feb 25, 2007 Abandoned
Array ( [id] => 5256818 [patent_doc_number] => 20070210450 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-13 [patent_title] => 'Method of forming a bump and a connector structure having the bump' [patent_app_type] => utility [patent_app_number] => 11/708496 [patent_app_country] => US [patent_app_date] => 2007-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 6070 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0210/20070210450.pdf [firstpage_image] =>[orig_patent_app_number] => 11708496 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/708496
Method of forming a bump and a connector structure having the bump Feb 20, 2007 Abandoned
Array ( [id] => 152773 [patent_doc_number] => 07679167 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-03-16 [patent_title] => 'Electronic assembly for image sensor device and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 11/707110 [patent_app_country] => US [patent_app_date] => 2007-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2489 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/679/07679167.pdf [firstpage_image] =>[orig_patent_app_number] => 11707110 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/707110
Electronic assembly for image sensor device and fabrication method thereof Feb 15, 2007 Issued
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