![](/images/general/no_picture/200_user.png)
Jack I Berman
Examiner (ID: 1875, Phone: (571)272-2468 , Office: P/2881 )
Most Active Art Unit | 2506 |
Art Unit(s) | 2899, 2878, 2506, 2881 |
Total Applications | 2582 |
Issued Applications | 2249 |
Pending Applications | 67 |
Abandoned Applications | 266 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 5346251
[patent_doc_number] => 20090001612
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-01
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION'
[patent_app_type] => utility
[patent_app_number] => 11/768640
[patent_app_country] => US
[patent_app_date] => 2007-06-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 8593
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0001/20090001612.pdf
[firstpage_image] =>[orig_patent_app_number] => 11768640
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/768640 | Integrated circuit package system with dual side connection | Jun 25, 2007 | Issued |
Array
(
[id] => 4574864
[patent_doc_number] => 07859039
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-12-28
[patent_title] => 'X-shaped semiconductor capacitor structure'
[patent_app_type] => utility
[patent_app_number] => 11/760785
[patent_app_country] => US
[patent_app_date] => 2007-06-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 4206
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 226
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/859/07859039.pdf
[firstpage_image] =>[orig_patent_app_number] => 11760785
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/760785 | X-shaped semiconductor capacitor structure | Jun 9, 2007 | Issued |
Array
(
[id] => 5063159
[patent_doc_number] => 20070224799
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-27
[patent_title] => 'System for making a semiconductor device using bump material including liquid'
[patent_app_type] => utility
[patent_app_number] => 11/807100
[patent_app_country] => US
[patent_app_date] => 2007-05-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4016
[patent_no_of_claims] => 3
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0224/20070224799.pdf
[firstpage_image] =>[orig_patent_app_number] => 11807100
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/807100 | System for making a semiconductor device using bump material including liquid | May 24, 2007 | Abandoned |
Array
(
[id] => 4789552
[patent_doc_number] => 20080290525
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-11-27
[patent_title] => 'SILICON-ON-INSULATOR STRUCTURES FOR THROUGH VIA IN SILICON CARRIERS'
[patent_app_type] => utility
[patent_app_number] => 11/751105
[patent_app_country] => US
[patent_app_date] => 2007-05-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 4482
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0290/20080290525.pdf
[firstpage_image] =>[orig_patent_app_number] => 11751105
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/751105 | Silicon-on-insulator structures for through via in silicon carriers | May 20, 2007 | Issued |
Array
(
[id] => 4743427
[patent_doc_number] => 20080088028
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-17
[patent_title] => 'Substrate and manufacturing method of package structure'
[patent_app_type] => utility
[patent_app_number] => 11/790030
[patent_app_country] => US
[patent_app_date] => 2007-04-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 3671
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0088/20080088028.pdf
[firstpage_image] =>[orig_patent_app_number] => 11790030
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/790030 | Substrate and manufacturing method of package structure | Apr 22, 2007 | Issued |
Array
(
[id] => 5210573
[patent_doc_number] => 20070249157
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-25
[patent_title] => 'Semiconductor device and method for manufacturing same'
[patent_app_type] => utility
[patent_app_number] => 11/785820
[patent_app_country] => US
[patent_app_date] => 2007-04-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 4284
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0249/20070249157.pdf
[firstpage_image] =>[orig_patent_app_number] => 11785820
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/785820 | Semiconductor device and method for manufacturing same | Apr 19, 2007 | Abandoned |
Array
(
[id] => 13529
[patent_doc_number] => 07807563
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-10-05
[patent_title] => 'Method for manufacturing a layer arrangement and layer arrangement'
[patent_app_type] => utility
[patent_app_number] => 11/786770
[patent_app_country] => US
[patent_app_date] => 2007-04-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 18
[patent_no_of_words] => 7949
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 179
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/807/07807563.pdf
[firstpage_image] =>[orig_patent_app_number] => 11786770
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/786770 | Method for manufacturing a layer arrangement and layer arrangement | Apr 11, 2007 | Issued |
Array
(
[id] => 5123618
[patent_doc_number] => 20070235888
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-11
[patent_title] => 'FILM TYPE PACKAGE AND DISPLAY APPARATUS HAVING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/697540
[patent_app_country] => US
[patent_app_date] => 2007-04-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2833
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0235/20070235888.pdf
[firstpage_image] =>[orig_patent_app_number] => 11697540
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/697540 | FILM TYPE PACKAGE AND DISPLAY APPARATUS HAVING THE SAME | Apr 5, 2007 | Abandoned |
Array
(
[id] => 4648794
[patent_doc_number] => 20080036049
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-14
[patent_title] => 'STACKED INTEGRATION MODULE AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/696750
[patent_app_country] => US
[patent_app_date] => 2007-04-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2000
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0036/20080036049.pdf
[firstpage_image] =>[orig_patent_app_number] => 11696750
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/696750 | STACKED INTEGRATION MODULE AND METHOD FOR MANUFACTURING THE SAME | Apr 4, 2007 | Abandoned |
Array
(
[id] => 5124620
[patent_doc_number] => 20070236891
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-11
[patent_title] => 'Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/730360
[patent_app_country] => US
[patent_app_date] => 2007-03-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 9627
[patent_no_of_claims] => 38
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0236/20070236891.pdf
[firstpage_image] =>[orig_patent_app_number] => 11730360
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/730360 | Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the same | Mar 29, 2007 | Abandoned |
Array
(
[id] => 4462444
[patent_doc_number] => 07880300
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-02-01
[patent_title] => 'Semiconductor chip comprising a metal coating structure and associated production method'
[patent_app_type] => utility
[patent_app_number] => 11/692530
[patent_app_country] => US
[patent_app_date] => 2007-03-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 9
[patent_no_of_words] => 4915
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 152
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/880/07880300.pdf
[firstpage_image] =>[orig_patent_app_number] => 11692530
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/692530 | Semiconductor chip comprising a metal coating structure and associated production method | Mar 27, 2007 | Issued |
Array
(
[id] => 4462419
[patent_doc_number] => 07880288
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-02-01
[patent_title] => 'Semiconductor module with semiconductor chips and method for producing it'
[patent_app_type] => utility
[patent_app_number] => 11/692020
[patent_app_country] => US
[patent_app_date] => 2007-03-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 9
[patent_no_of_words] => 5396
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 263
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/880/07880288.pdf
[firstpage_image] =>[orig_patent_app_number] => 11692020
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/692020 | Semiconductor module with semiconductor chips and method for producing it | Mar 26, 2007 | Issued |
Array
(
[id] => 4719025
[patent_doc_number] => 20080241547
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-10-02
[patent_title] => 'METHODS OF LASER SURFACE MODIFICATION OF CERAMIC PACKAGES FOR UNDERFILL SPREAD CONTROL AND STRUCTURES FORMED THEREBY'
[patent_app_type] => utility
[patent_app_number] => 11/691390
[patent_app_country] => US
[patent_app_date] => 2007-03-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 1466
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0241/20080241547.pdf
[firstpage_image] =>[orig_patent_app_number] => 11691390
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/691390 | METHODS OF LASER SURFACE MODIFICATION OF CERAMIC PACKAGES FOR UNDERFILL SPREAD CONTROL AND STRUCTURES FORMED THEREBY | Mar 25, 2007 | Abandoned |
Array
(
[id] => 4737265
[patent_doc_number] => 20080230917
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-09-25
[patent_title] => ' METHOD OF FABRICATING TWO-STEP SELF-ALIGNED CONTACT'
[patent_app_type] => utility
[patent_app_number] => 11/686740
[patent_app_country] => US
[patent_app_date] => 2007-03-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 4751
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0230/20080230917.pdf
[firstpage_image] =>[orig_patent_app_number] => 11686740
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/686740 | Method of fabricating two-step self-aligned contact | Mar 14, 2007 | Issued |
Array
(
[id] => 4695591
[patent_doc_number] => 20080217775
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-09-11
[patent_title] => 'Method of forming contact plugs for eliminating tungsten seam issue'
[patent_app_type] => utility
[patent_app_number] => 11/714770
[patent_app_country] => US
[patent_app_date] => 2007-03-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2128
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0217/20080217775.pdf
[firstpage_image] =>[orig_patent_app_number] => 11714770
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/714770 | Method of forming contact plugs for eliminating tungsten seam issue | Mar 6, 2007 | Abandoned |
Array
(
[id] => 5196771
[patent_doc_number] => 20070296089
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-27
[patent_title] => 'Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby'
[patent_app_type] => utility
[patent_app_number] => 11/714010
[patent_app_country] => US
[patent_app_date] => 2007-03-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2817
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0296/20070296089.pdf
[firstpage_image] =>[orig_patent_app_number] => 11714010
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/714010 | Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby | Mar 4, 2007 | Abandoned |
Array
(
[id] => 8435982
[patent_doc_number] => 08283753
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-10-09
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/712910
[patent_app_country] => US
[patent_app_date] => 2007-03-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
[patent_figures_cnt] => 24
[patent_no_of_words] => 10102
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 189
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11712910
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/712910 | Semiconductor device | Mar 1, 2007 | Issued |
Array
(
[id] => 5008180
[patent_doc_number] => 20070278657
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-06
[patent_title] => 'Chip stack, method of fabrication thereof, and semiconductor package having the same'
[patent_app_type] => utility
[patent_app_number] => 11/710490
[patent_app_country] => US
[patent_app_date] => 2007-02-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
[patent_figures_cnt] => 23
[patent_no_of_words] => 7690
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0278/20070278657.pdf
[firstpage_image] =>[orig_patent_app_number] => 11710490
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/710490 | Chip stack, method of fabrication thereof, and semiconductor package having the same | Feb 25, 2007 | Abandoned |
Array
(
[id] => 5256818
[patent_doc_number] => 20070210450
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-13
[patent_title] => 'Method of forming a bump and a connector structure having the bump'
[patent_app_type] => utility
[patent_app_number] => 11/708496
[patent_app_country] => US
[patent_app_date] => 2007-02-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 6070
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0210/20070210450.pdf
[firstpage_image] =>[orig_patent_app_number] => 11708496
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/708496 | Method of forming a bump and a connector structure having the bump | Feb 20, 2007 | Abandoned |
Array
(
[id] => 152773
[patent_doc_number] => 07679167
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-03-16
[patent_title] => 'Electronic assembly for image sensor device and fabrication method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/707110
[patent_app_country] => US
[patent_app_date] => 2007-02-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2489
[patent_no_of_claims] => 28
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 89
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/679/07679167.pdf
[firstpage_image] =>[orig_patent_app_number] => 11707110
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/707110 | Electronic assembly for image sensor device and fabrication method thereof | Feb 15, 2007 | Issued |