Jack I Berman

Array ( [id] => 5157533 [patent_doc_number] => 20070170577 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-26 [patent_title] => 'Semiconductor Device with Surface-Mountable External Contacts and Method for Manufacturing the Same' [patent_app_type] => utility [patent_app_number] => 11/627670 [patent_app_country] => US [patent_app_date] => 2007-01-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5612 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0170/20070170577.pdf [firstpage_image] =>[orig_patent_app_number] => 11627670 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4846026 [patent_doc_number] => 20080182434 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-31 [patent_title] => 'Low Cost Stacked Package' [patent_app_type] => utility [patent_app_number] => 11/627050 [patent_app_country] => US [patent_app_date] => 2007-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1677 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0182/20080182434.pdf [firstpage_image] =>[orig_patent_app_number] => 11627050 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4800566 [patent_doc_number] => 20080012153 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-17 [patent_title] => 'Direct drive technology chip package' [patent_app_type] => utility [patent_app_number] => 11/656990 [patent_app_country] => US [patent_app_date] => 2007-01-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 788 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20080012153.pdf [firstpage_image] =>[orig_patent_app_number] => 11656990 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5026282 [patent_doc_number] => 20070267728 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-11-22 [patent_title] => 'FLIP CHIP MLP WITH FOLDED HEAT SINK' [patent_app_type] => utility [patent_app_number] => 11/625100 [patent_app_country] => US [patent_app_date] => 2007-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2709 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0267/20070267728.pdf [firstpage_image] =>[orig_patent_app_number] => 11625100 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5067952 [patent_doc_number] => 20070189053 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-08-16 [patent_title] => 'ELECTRICAL FUSE DEVICE BASED ON A PHASE-CHANGE MEMORY ELEMENT AND CORRESPONDING PROGRAMMING METHOD' [patent_app_type] => utility [patent_app_number] => 11/625178 [patent_app_country] => US [patent_app_date] => 2007-01-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4917 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0189/20070189053.pdf [firstpage_image] =>[orig_patent_app_number] => 11625178 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5186150 [patent_doc_number] => 20070164457 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-19 [patent_title] => 'Semiconductor package, substrate with conductive post, stacked type semiconductor device, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/654670 [patent_app_country] => US [patent_app_date] => 2007-01-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 5478 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0164/20070164457.pdf [firstpage_image] =>[orig_patent_app_number] => 11654670 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5082963 [patent_doc_number] => 20070273014 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-11-29 [patent_title] => 'SYSTEM IN PACKAGE MODULE' [patent_app_type] => utility [patent_app_number] => 11/624490 [patent_app_country] => US [patent_app_date] => 2007-01-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2776 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0273/20070273014.pdf [firstpage_image] =>[orig_patent_app_number] => 11624490 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4783949 [patent_doc_number] => 20080137278 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-12 [patent_title] => 'Memory chip and insert card having the same thereon' [patent_app_type] => utility [patent_app_number] => 11/653640 [patent_app_country] => US [patent_app_date] => 2007-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1265 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0137/20080137278.pdf [firstpage_image] =>[orig_patent_app_number] => 11653640 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4807856 [patent_doc_number] => 20080171434 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-17 [patent_title] => 'METHOD OF FABRICATING DUAL DAMASCENE STRUCTURE' [patent_app_type] => utility [patent_app_number] => 11/623570 [patent_app_country] => US [patent_app_date] => 2007-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 4323 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0171/20080171434.pdf [firstpage_image] =>[orig_patent_app_number] => 11623570 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4806801 [patent_doc_number] => 20080170379 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-17 [patent_title] => 'Optical Receiver Having Improved Shielding' [patent_app_type] => utility [patent_app_number] => 11/622870 [patent_app_country] => US [patent_app_date] => 2007-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3404 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0170/20080170379.pdf [firstpage_image] =>[orig_patent_app_number] => 11622870 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4805902 [patent_doc_number] => 20080169480 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-17 [patent_title] => 'Optoelectronic device package and packaging method thereof' [patent_app_type] => utility [patent_app_number] => 11/652060 [patent_app_country] => US [patent_app_date] => 2007-01-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 1841 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0169/20080169480.pdf [firstpage_image] =>[orig_patent_app_number] => 11652060 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4667218 [patent_doc_number] => 20080042278 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-21 [patent_title] => 'Substrate structure having N-SMD ball pads' [patent_app_type] => utility [patent_app_number] => 11/651540 [patent_app_country] => US [patent_app_date] => 2007-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1818 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0042/20080042278.pdf [firstpage_image] =>[orig_patent_app_number] => 11651540 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4749253 [patent_doc_number] => 20080157324 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'Stacked die package with die interconnects' [patent_app_type] => utility [patent_app_number] => 11/648420 [patent_app_country] => US [patent_app_date] => 2006-12-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4341 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0157/20080157324.pdf [firstpage_image] =>[orig_patent_app_number] => 11648420 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5088764 [patent_doc_number] => 20070228403 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-04 [patent_title] => 'Micro-element package module and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 11/585260 [patent_app_country] => US [patent_app_date] => 2006-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4773 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0228/20070228403.pdf [firstpage_image] =>[orig_patent_app_number] => 11585260 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 54124 [patent_doc_number] => 07772682 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2010-08-10 [patent_title] => 'Moisture protection metal enclosure' [patent_app_type] => utility [patent_app_number] => 11/548061 [patent_app_country] => US [patent_app_date] => 2006-10-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 3502 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/772/07772682.pdf [firstpage_image] =>[orig_patent_app_number] => 11548061 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4980668 [patent_doc_number] => 20070085224 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-04-19 [patent_title] => 'Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor' [patent_app_type] => utility [patent_app_number] => 11/524455 [patent_app_country] => US [patent_app_date] => 2006-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 4201 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0085/20070085224.pdf [firstpage_image] =>[orig_patent_app_number] => 11524455 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 103112 [patent_doc_number] => 07728413 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-06-01 [patent_title] => 'Resin mold type semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/515040 [patent_app_country] => US [patent_app_date] => 2006-09-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 17 [patent_no_of_words] => 4604 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 255 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/728/07728413.pdf [firstpage_image] =>[orig_patent_app_number] => 11515040 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8165780 [patent_doc_number] => 08174096 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-05-08 [patent_title] => 'Stamped leadframe and method of manufacture thereof' [patent_app_type] => utility [patent_app_number] => 11/509860 [patent_app_country] => US [patent_app_date] => 2006-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3333 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/174/08174096.pdf [firstpage_image] =>[orig_patent_app_number] => 11509860 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5180191 [patent_doc_number] => 20070051533 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-08 [patent_title] => 'Optical electronics integrated semiconductor package' [patent_app_type] => utility [patent_app_number] => 11/508510 [patent_app_country] => US [patent_app_date] => 2006-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2902 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0051/20070051533.pdf [firstpage_image] =>[orig_patent_app_number] => 11508510 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5077039 [patent_doc_number] => 20070120263 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-05-31 [patent_title] => 'Conductor track arrangement and associated production method' [patent_app_type] => utility [patent_app_number] => 11/506570 [patent_app_country] => US [patent_app_date] => 2006-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3810 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0120/20070120263.pdf [firstpage_image] =>[orig_patent_app_number] => 11506570 [rel_patent_id] =>[rel_patent_doc_number] =>)