
Jae Kyun Woo
Examiner (ID: 2020, Phone: (571)272-0837 , Office: P/3779 )
| Most Active Art Unit | 3795 |
| Art Unit(s) | 3779, 3795 |
| Total Applications | 586 |
| Issued Applications | 326 |
| Pending Applications | 65 |
| Abandoned Applications | 208 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
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[patent_doc_number] => 20160329305
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[patent_title] => 'STACKED PACKAGE DEVICE AND METHOD FOR FABRICATING THE SAME'
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[patent_issue_date] => 2019-12-24
[patent_title] => Wafer-level package having multiple dies arranged in side-by-side fashion and associated yield improvement method
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Array
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[patent_title] => 'WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE'
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Array
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[patent_title] => 'SEMICONDUCTOR CHIP AND A SEMICONDUCTOR PACKAGE HAVING A PACKAGE ON PACKAGE (POP) STRUCTURE INCLUDING THE SEMICONDUCTOR CHIP'
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Array
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[patent_title] => 'Interconnect structure and method of forming same'
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Array
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Array
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Array
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