Jamaal R. Henson

Array ( [id] => 9692508 [patent_doc_number] => 08823112 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-09-02 [patent_title] => 'Semiconductor device having mixedly mounted components with common film layers and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 13/495794 [patent_app_country] => US [patent_app_date] => 2012-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 46 [patent_figures_cnt] => 69 [patent_no_of_words] => 21717 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13495794 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9188810 [patent_doc_number] => 20130328125 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-12-12 [patent_title] => 'PROTECTION COMPONENT AND ELECTROSTATIC DISCHARGE PROTECTION DEVICE WITH THE SAME' [patent_app_type] => utility [patent_app_number] => 13/494736 [patent_app_country] => US [patent_app_date] => 2012-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 7754 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13494736 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9389252 [patent_doc_number] => 08685850 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-04-01 [patent_title] => 'System and method of plating conductive gate contacts on metal gates for self-aligned contact interconnections' [patent_app_type] => utility [patent_app_number] => 13/494973 [patent_app_country] => US [patent_app_date] => 2012-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 7823 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 205 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13494973 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8753580 [patent_doc_number] => 20130087884 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-04-11 [patent_title] => 'SILICON INTERPOSER INCLUDING BACKSIDE INDUCTOR' [patent_app_type] => utility [patent_app_number] => 13/493458 [patent_app_country] => US [patent_app_date] => 2012-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2325 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13493458 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9350745 [patent_doc_number] => 08669639 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-03-11 [patent_title] => 'Semiconductor element, manufacturing method thereof and operating method thereof' [patent_app_type] => utility [patent_app_number] => 13/493311 [patent_app_country] => US [patent_app_date] => 2012-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 15 [patent_no_of_words] => 3769 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 188 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13493311 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10864575 [patent_doc_number] => 08890281 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-11-18 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/493848 [patent_app_country] => US [patent_app_date] => 2012-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 5379 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13493848 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9503428 [patent_doc_number] => 08741742 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-06-03 [patent_title] => 'Method of fabricating an integrated circuit without ground contact pad' [patent_app_type] => utility [patent_app_number] => 13/492504 [patent_app_country] => US [patent_app_date] => 2012-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 2672 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 147 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13492504 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10831219 [patent_doc_number] => 08859386 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-10-14 [patent_title] => 'Semiconductor devices, methods of manufacture thereof, and methods of forming resistors' [patent_app_type] => utility [patent_app_number] => 13/492571 [patent_app_country] => US [patent_app_date] => 2012-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 4935 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 193 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13492571 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8414437 [patent_doc_number] => 20120241937 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-09-27 [patent_title] => 'PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT' [patent_app_type] => utility [patent_app_number] => 13/492220 [patent_app_country] => US [patent_app_date] => 2012-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3801 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13492220 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9589943 [patent_doc_number] => 08779486 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-07-15 [patent_title] => 'Ferroelectric capacitor' [patent_app_type] => utility [patent_app_number] => 13/491834 [patent_app_country] => US [patent_app_date] => 2012-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 24 [patent_no_of_words] => 11138 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13491834 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9427461 [patent_doc_number] => 08703535 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-04-22 [patent_title] => 'Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof' [patent_app_type] => utility [patent_app_number] => 13/490908 [patent_app_country] => US [patent_app_date] => 2012-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 12 [patent_no_of_words] => 8261 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13490908 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9648520 [patent_doc_number] => 08802530 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-08-12 [patent_title] => 'MOSFET with improved performance through induced net charge region in thick bottom insulator' [patent_app_type] => utility [patent_app_number] => 13/490138 [patent_app_country] => US [patent_app_date] => 2012-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2775 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 237 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13490138 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9402333 [patent_doc_number] => 08692387 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-04-08 [patent_title] => 'Stacked die semiconductor package' [patent_app_type] => utility [patent_app_number] => 13/490451 [patent_app_country] => US [patent_app_date] => 2012-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 25 [patent_no_of_words] => 5426 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13490451 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8344855 [patent_doc_number] => 20120205781 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-08-16 [patent_title] => 'SEMICONDUCTOR STRUCTURE HAVING VARACTOR WITH PARALLEL DC PATH ADJACENT THERETO' [patent_app_type] => utility [patent_app_number] => 13/451087 [patent_app_country] => US [patent_app_date] => 2012-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4465 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13451087 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8324009 [patent_doc_number] => 20120196415 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-08-02 [patent_title] => 'SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR' [patent_app_type] => utility [patent_app_number] => 13/447721 [patent_app_country] => US [patent_app_date] => 2012-04-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 119 [patent_figures_cnt] => 119 [patent_no_of_words] => 30964 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13447721 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9100237 [patent_doc_number] => 08564117 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-10-22 [patent_title] => 'Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing' [patent_app_type] => utility [patent_app_number] => 13/442546 [patent_app_country] => US [patent_app_date] => 2012-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 4425 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13442546 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9079158 [patent_doc_number] => 20130264688 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-10-10 [patent_title] => 'METHOD AND APPARATUS PROVIDING INTEGRATED CIRCUIT SYSTEM WITH INTERCONNECTED STACKED DEVICE WAFERS' [patent_app_type] => utility [patent_app_number] => 13/441627 [patent_app_country] => US [patent_app_date] => 2012-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3220 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13441627 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8439637 [patent_doc_number] => 20120256254 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-10-11 [patent_title] => 'STRUCTURE AND FABRICATION PROCESS OF SUPER JUNCTION MOSFET' [patent_app_type] => utility [patent_app_number] => 13/441101 [patent_app_country] => US [patent_app_date] => 2012-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4313 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13441101 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9530060 [patent_doc_number] => 08753931 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-06-17 [patent_title] => 'Cost-effective gate replacement process' [patent_app_type] => utility [patent_app_number] => 13/440848 [patent_app_country] => US [patent_app_date] => 2012-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 5479 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13440848 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9312418 [patent_doc_number] => 08653640 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-02-18 [patent_title] => 'Semiconductor package apparatus' [patent_app_type] => utility [patent_app_number] => 13/440817 [patent_app_country] => US [patent_app_date] => 2012-04-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 20 [patent_no_of_words] => 7800 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13440817 [rel_patent_id] =>[rel_patent_doc_number] =>)