Search

James M. Mitchell

Supervisory Patent Examiner (ID: 19356, Phone: (571)272-1931 , Office: P/4100 )

Most Active Art Unit
2813
Art Unit(s)
4100, 2827, 2822, 2813, 4127
Total Applications
769
Issued Applications
540
Pending Applications
13
Abandoned Applications
218

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 5730332 [patent_doc_number] => 20060255446 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-11-16 [patent_title] => 'Stacked modules and method' [patent_app_type] => utility [patent_app_number] => 11/403081 [patent_app_country] => US [patent_app_date] => 2006-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 49 [patent_figures_cnt] => 49 [patent_no_of_words] => 13226 [patent_no_of_claims] => 67 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0255/20060255446.pdf [firstpage_image] =>[orig_patent_app_number] => 11403081 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/403081
Stacked modules and method Apr 11, 2006 Abandoned
Array ( [id] => 5680944 [patent_doc_number] => 20060197211 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-07 [patent_title] => 'Semiconductor device and method of stacking semiconductor chips' [patent_app_type] => utility [patent_app_number] => 11/398636 [patent_app_country] => US [patent_app_date] => 2006-04-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 8793 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0197/20060197211.pdf [firstpage_image] =>[orig_patent_app_number] => 11398636 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/398636
Semiconductor device and method of stacking semiconductor chips Apr 5, 2006 Abandoned
Array ( [id] => 5757404 [patent_doc_number] => 20060208349 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-21 [patent_title] => 'Semiconductor device and manufacturing method for the same' [patent_app_type] => utility [patent_app_number] => 11/392853 [patent_app_country] => US [patent_app_date] => 2006-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 7041 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0208/20060208349.pdf [firstpage_image] =>[orig_patent_app_number] => 11392853 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/392853
Semiconductor device and manufacturing method for the same Mar 29, 2006 Abandoned
Array ( [id] => 5060449 [patent_doc_number] => 20070222086 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-09-27 [patent_title] => 'On-die bond wires system and method for enhancing routability of a redistribution layer' [patent_app_type] => utility [patent_app_number] => 11/391625 [patent_app_country] => US [patent_app_date] => 2006-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4850 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0222/20070222086.pdf [firstpage_image] =>[orig_patent_app_number] => 11391625 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/391625
On-die bond wires system and method for enhancing routability of a redistribution layer Mar 26, 2006 Issued
Array ( [id] => 5700175 [patent_doc_number] => 20060216860 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-09-28 [patent_title] => 'Flip chip interconnection having narrow interconnection sites on the substrate' [patent_app_type] => utility [patent_app_number] => 11/388755 [patent_app_country] => US [patent_app_date] => 2006-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 9313 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0216/20060216860.pdf [firstpage_image] =>[orig_patent_app_number] => 11388755 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/388755
Flip chip interconnection having narrow interconnection sites on the substrate Mar 23, 2006 Abandoned
Array ( [id] => 4462361 [patent_doc_number] => 07880256 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-02-01 [patent_title] => 'Semiconductor device with passivation layer covering wiring layer' [patent_app_type] => utility [patent_app_number] => 11/386106 [patent_app_country] => US [patent_app_date] => 2006-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 42 [patent_no_of_words] => 7656 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/880/07880256.pdf [firstpage_image] =>[orig_patent_app_number] => 11386106 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/386106
Semiconductor device with passivation layer covering wiring layer Mar 21, 2006 Issued
Array ( [id] => 5593922 [patent_doc_number] => 20060157838 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-07-20 [patent_title] => 'Multimedia card and transfer molding method' [patent_app_type] => utility [patent_app_number] => 11/386154 [patent_app_country] => US [patent_app_date] => 2006-03-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5634 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0157/20060157838.pdf [firstpage_image] =>[orig_patent_app_number] => 11386154 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/386154
Multimedia card and transfer molding method Mar 20, 2006 Abandoned
Array ( [id] => 72765 [patent_doc_number] => 07755194 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2010-07-13 [patent_title] => 'Composite barrier layers with controlled copper interface surface roughness' [patent_app_type] => utility [patent_app_number] => 11/376190 [patent_app_country] => US [patent_app_date] => 2006-03-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5454 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/755/07755194.pdf [firstpage_image] =>[orig_patent_app_number] => 11376190 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/376190
Composite barrier layers with controlled copper interface surface roughness Mar 15, 2006 Issued
Array ( [id] => 5628811 [patent_doc_number] => 20060145279 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-07-06 [patent_title] => 'Electro-optic integrated circuits with connectors and methods for the production thereof' [patent_app_type] => utility [patent_app_number] => 11/365328 [patent_app_country] => US [patent_app_date] => 2006-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 72 [patent_figures_cnt] => 72 [patent_no_of_words] => 21203 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20060145279.pdf [firstpage_image] =>[orig_patent_app_number] => 11365328 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/365328
Electro-optic integrated circuits with connectors and methods for the production thereof Feb 27, 2006 Abandoned
Array ( [id] => 178336 [patent_doc_number] => 07656045 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-02-02 [patent_title] => 'Cap layer for an aluminum copper bond pad' [patent_app_type] => utility [patent_app_number] => 11/360336 [patent_app_country] => US [patent_app_date] => 2006-02-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 3020 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/656/07656045.pdf [firstpage_image] =>[orig_patent_app_number] => 11360336 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/360336
Cap layer for an aluminum copper bond pad Feb 22, 2006 Issued
Array ( [id] => 8676084 [patent_doc_number] => 08384200 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2013-02-26 [patent_title] => 'Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies' [patent_app_type] => utility [patent_app_number] => 11/359985 [patent_app_country] => US [patent_app_date] => 2006-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 12 [patent_no_of_words] => 9480 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 318 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 11359985 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/359985
Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies Feb 21, 2006 Issued
Array ( [id] => 370192 [patent_doc_number] => 07476967 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-01-13 [patent_title] => 'Composite carbon nanotube thermal interface device' [patent_app_type] => utility [patent_app_number] => 11/360096 [patent_app_country] => US [patent_app_date] => 2006-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 20 [patent_no_of_words] => 5557 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/476/07476967.pdf [firstpage_image] =>[orig_patent_app_number] => 11360096 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/360096
Composite carbon nanotube thermal interface device Feb 21, 2006 Issued
Array ( [id] => 5652896 [patent_doc_number] => 20060138631 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-29 [patent_title] => 'Multi-chip package structure' [patent_app_type] => utility [patent_app_number] => 11/353903 [patent_app_country] => US [patent_app_date] => 2006-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 6011 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0138/20060138631.pdf [firstpage_image] =>[orig_patent_app_number] => 11353903 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/353903
Multi-chip package structure Feb 13, 2006 Abandoned
Array ( [id] => 5912997 [patent_doc_number] => 20060128059 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-15 [patent_title] => 'Compact system module with built-in thermoelectric cooling' [patent_app_type] => utility [patent_app_number] => 11/345253 [patent_app_country] => US [patent_app_date] => 2006-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 8309 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0128/20060128059.pdf [firstpage_image] =>[orig_patent_app_number] => 11345253 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/345253
Compact system module with built-in thermoelectric cooling Jan 31, 2006 Abandoned
Array ( [id] => 5183134 [patent_doc_number] => 20070054488 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-03-08 [patent_title] => 'Low resistance and reliable copper interconnects by variable doping' [patent_app_type] => utility [patent_app_number] => 11/341827 [patent_app_country] => US [patent_app_date] => 2006-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2231 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0054/20070054488.pdf [firstpage_image] =>[orig_patent_app_number] => 11341827 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/341827
Low resistance and reliable copper interconnects by variable doping Jan 26, 2006 Issued
Array ( [id] => 5838166 [patent_doc_number] => 20060118824 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-06-08 [patent_title] => 'Semiconductor device with reduced leakage current, and method of fabrication' [patent_app_type] => utility [patent_app_number] => 11/341276 [patent_app_country] => US [patent_app_date] => 2006-01-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 8677 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0118/20060118824.pdf [firstpage_image] =>[orig_patent_app_number] => 11341276 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/341276
Nitride-based semiconductor device with reduced leakage current Jan 26, 2006 Issued
Array ( [id] => 4866917 [patent_doc_number] => 20080145976 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-06-19 [patent_title] => 'Packaging of Micro Devices' [patent_app_type] => utility [patent_app_number] => 11/795865 [patent_app_country] => US [patent_app_date] => 2006-01-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3517 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20080145976.pdf [firstpage_image] =>[orig_patent_app_number] => 11795865 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/795865
Packaging of Micro Devices Jan 23, 2006 Abandoned
Array ( [id] => 191286 [patent_doc_number] => 07642599 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-01-05 [patent_title] => 'Semiconductor device and junction termination structure' [patent_app_type] => utility [patent_app_number] => 11/331160 [patent_app_country] => US [patent_app_date] => 2006-01-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 22 [patent_no_of_words] => 6222 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/642/07642599.pdf [firstpage_image] =>[orig_patent_app_number] => 11331160 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/331160
Semiconductor device and junction termination structure Jan 12, 2006 Issued
Array ( [id] => 4597143 [patent_doc_number] => 07982290 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-07-19 [patent_title] => 'Contact spring application to semiconductor devices' [patent_app_type] => utility [patent_app_number] => 11/331656 [patent_app_country] => US [patent_app_date] => 2006-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 1998 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/982/07982290.pdf [firstpage_image] =>[orig_patent_app_number] => 11331656 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/331656
Contact spring application to semiconductor devices Jan 11, 2006 Issued
Array ( [id] => 4988846 [patent_doc_number] => 20070155185 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-07-05 [patent_title] => 'Electrical sensor for real-time feedback control of plasma nitridation' [patent_app_type] => utility [patent_app_number] => 11/324425 [patent_app_country] => US [patent_app_date] => 2006-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4388 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0155/20070155185.pdf [firstpage_image] =>[orig_patent_app_number] => 11324425 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/324425
Electrical sensor for real-time feedback control of plasma nitridation Jan 2, 2006 Issued
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