James M. Mitchell

Array ( [id] => 8177055 [patent_doc_number] => 08178435 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-05-15 [patent_title] => 'High performance system-on-chip inductor using post passivation process' [patent_app_type] => utility [patent_app_number] => 10/445558 [patent_app_country] => US [patent_app_date] => 2003-05-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 40 [patent_no_of_words] => 8822 [patent_no_of_claims] => 37 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 292 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/178/08178435.pdf [firstpage_image] =>[orig_patent_app_number] => 10445558 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7273111 [patent_doc_number] => 20040232562 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-11-25 [patent_title] => 'System and method for increasing bump pad height' [patent_app_type] => new [patent_app_number] => 10/445164 [patent_app_country] => US [patent_app_date] => 2003-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2471 [patent_no_of_claims] => 40 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0232/20040232562.pdf [firstpage_image] =>[orig_patent_app_number] => 10445164 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1017942 [patent_doc_number] => 06890836 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-05-10 [patent_title] => 'Scribe street width reduction by deep trench and shallow saw cut' [patent_app_type] => utility [patent_app_number] => 10/445163 [patent_app_country] => US [patent_app_date] => 2003-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 3781 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/890/06890836.pdf [firstpage_image] =>[orig_patent_app_number] => 10445163 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7421223 [patent_doc_number] => 20040000707 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-01 [patent_title] => 'Modularized die stacking system and method' [patent_app_type] => new [patent_app_number] => 10/435192 [patent_app_country] => US [patent_app_date] => 2003-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 6017 [patent_no_of_claims] => 40 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 27 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0000/20040000707.pdf [firstpage_image] =>[orig_patent_app_number] => 10435192 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 728232 [patent_doc_number] => 07041513 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-05-09 [patent_title] => 'Methods for forming semiconductor devices so as to stabilize the same when positioned face-down over test substrates' [patent_app_type] => utility [patent_app_number] => 10/430753 [patent_app_country] => US [patent_app_date] => 2003-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 21 [patent_no_of_words] => 10126 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/041/07041513.pdf [firstpage_image] =>[orig_patent_app_number] => 10430753 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7296428 [patent_doc_number] => 20040214377 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-10-28 [patent_title] => 'Low thermal expansion adhesives and encapsulants for cryogenic and high power density electronic and photonic device assembly and packaging' [patent_app_type] => new [patent_app_number] => 10/425894 [patent_app_country] => US [patent_app_date] => 2003-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5319 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0214/20040214377.pdf [firstpage_image] =>[orig_patent_app_number] => 10425894 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6863688 [patent_doc_number] => 20030189214 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-10-09 [patent_title] => 'Techniques for joining an opto-electronic module to a semiconductor package' [patent_app_type] => new [patent_app_number] => 10/412564 [patent_app_country] => US [patent_app_date] => 2003-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5331 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0189/20030189214.pdf [firstpage_image] =>[orig_patent_app_number] => 10412564 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 746412 [patent_doc_number] => 07026654 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-04-11 [patent_title] => 'Package for optical semiconductor' [patent_app_type] => utility [patent_app_number] => 10/406943 [patent_app_country] => US [patent_app_date] => 2003-04-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 17 [patent_no_of_words] => 3684 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/026/07026654.pdf [firstpage_image] =>[orig_patent_app_number] => 10406943 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7069666 [patent_doc_number] => 20050245051 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-11-03 [patent_title] => 'Parting method for fragile material substrate and parting device using the method' [patent_app_type] => utility [patent_app_number] => 10/509895 [patent_app_country] => US [patent_app_date] => 2003-04-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 31 [patent_no_of_words] => 28666 [patent_no_of_claims] => 54 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0245/20050245051.pdf [firstpage_image] =>[orig_patent_app_number] => 10509895 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 869685 [patent_doc_number] => 07365442 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-04-29 [patent_title] => 'Encapsulation of thin-film electronic devices' [patent_app_type] => utility [patent_app_number] => 10/403565 [patent_app_country] => US [patent_app_date] => 2003-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 4048 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/365/07365442.pdf [firstpage_image] =>[orig_patent_app_number] => 10403565 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6785809 [patent_doc_number] => 20030137048 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-24 [patent_title] => 'Stacking system and method' [patent_app_type] => new [patent_app_number] => 10/400309 [patent_app_country] => US [patent_app_date] => 2003-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 7274 [patent_no_of_claims] => 40 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 28 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0137/20030137048.pdf [firstpage_image] =>[orig_patent_app_number] => 10400309 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7285556 [patent_doc_number] => 20040108104 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-06-10 [patent_title] => 'Axial heat-dissipating device' [patent_app_type] => new [patent_app_number] => 10/395933 [patent_app_country] => US [patent_app_date] => 2003-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 2548 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0108/20040108104.pdf [firstpage_image] =>[orig_patent_app_number] => 10395933 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 743012 [patent_doc_number] => 07030502 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-04-18 [patent_title] => 'BGA package with same power ballout assignment for wire bonding packaging and flip chip packaging' [patent_app_type] => utility [patent_app_number] => 10/249179 [patent_app_country] => US [patent_app_date] => 2003-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 6098 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 285 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/030/07030502.pdf [firstpage_image] =>[orig_patent_app_number] => 10249179 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6834776 [patent_doc_number] => 20030162322 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-08-28 [patent_title] => 'Semiconductor wafer having a thin die and tethers and methods of making the same' [patent_app_type] => new [patent_app_number] => 10/387754 [patent_app_country] => US [patent_app_date] => 2003-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 8351 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0162/20030162322.pdf [firstpage_image] =>[orig_patent_app_number] => 10387754 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1034422 [patent_doc_number] => 06875631 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-04-05 [patent_title] => 'Semiconductor device and a method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/360712 [patent_app_country] => US [patent_app_date] => 2003-02-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 23 [patent_no_of_words] => 3407 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 384 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/875/06875631.pdf [firstpage_image] =>[orig_patent_app_number] => 10360712 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 447737 [patent_doc_number] => 07253510 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-08-07 [patent_title] => 'Ball grid array package construction with raised solder ball pads' [patent_app_type] => utility [patent_app_number] => 10/346277 [patent_app_country] => US [patent_app_date] => 2003-01-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 4368 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 285 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/253/07253510.pdf [firstpage_image] =>[orig_patent_app_number] => 10346277 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6696887 [patent_doc_number] => 20030109081 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-12 [patent_title] => 'Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate' [patent_app_type] => new [patent_app_number] => 10/341610 [patent_app_country] => US [patent_app_date] => 2003-01-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5302 [patent_no_of_claims] => 87 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0109/20030109081.pdf [firstpage_image] =>[orig_patent_app_number] => 10341610 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6628118 [patent_doc_number] => 20030102566 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-05 [patent_title] => 'Stereolithographic method for applying materials to electronic component substrates and resulting structures' [patent_app_type] => new [patent_app_number] => 10/338602 [patent_app_country] => US [patent_app_date] => 2003-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 6230 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0102/20030102566.pdf [firstpage_image] =>[orig_patent_app_number] => 10338602 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6851616 [patent_doc_number] => 20030143819 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-31 [patent_title] => 'Method of producing semiconductor chips with a chip edge guard, in particular for wafer level packaging chips' [patent_app_type] => new [patent_app_number] => 10/336373 [patent_app_country] => US [patent_app_date] => 2003-01-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2911 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 14 [patent_words_short_claim] => 26 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0143/20030143819.pdf [firstpage_image] =>[orig_patent_app_number] => 10336373 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6623288 [patent_doc_number] => 20030102151 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-05 [patent_title] => 'Multilayer build-up wiring board' [patent_app_type] => new [patent_app_number] => 10/334062 [patent_app_country] => US [patent_app_date] => 2002-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 44 [patent_figures_cnt] => 44 [patent_no_of_words] => 23570 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0102/20030102151.pdf [firstpage_image] =>[orig_patent_app_number] => 10334062 [rel_patent_id] =>[rel_patent_doc_number] =>)