James M. Mitchell

Array ( [id] => 6838917 [patent_doc_number] => 20030036257 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-02-20 [patent_title] => 'Semiconductor device manufacturing method' [patent_app_type] => new [patent_app_number] => 10/215803 [patent_app_country] => US [patent_app_date] => 2002-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3282 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20030036257.pdf [firstpage_image] =>[orig_patent_app_number] => 10215803 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1071870 [patent_doc_number] => 06841454 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-01-11 [patent_title] => 'Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof' [patent_app_type] => utility [patent_app_number] => 10/216508 [patent_app_country] => US [patent_app_date] => 2002-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 32 [patent_no_of_words] => 8015 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/841/06841454.pdf [firstpage_image] =>[orig_patent_app_number] => 10216508 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6713388 [patent_doc_number] => 20030024735 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-02-06 [patent_title] => 'Protective device for subassemblies and method for producing a protective device' [patent_app_type] => new [patent_app_number] => 10/210218 [patent_app_country] => US [patent_app_date] => 2002-08-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 4300 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0024/20030024735.pdf [firstpage_image] =>[orig_patent_app_number] => 10210218 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6260522 [patent_doc_number] => 20020187590 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-12 [patent_title] => 'Ball grid array packages with thermally conductive containers' [patent_app_type] => new [patent_app_number] => 10/209753 [patent_app_country] => US [patent_app_date] => 2002-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 2890 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 26 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0187/20020187590.pdf [firstpage_image] =>[orig_patent_app_number] => 10209753 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1056400 [patent_doc_number] => 06855623 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-02-15 [patent_title] => 'Recessed tape and method for forming a BGA assembly' [patent_app_type] => utility [patent_app_number] => 10/206518 [patent_app_country] => US [patent_app_date] => 2002-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 5094 [patent_no_of_claims] => 64 [patent_no_of_ind_claims] => 16 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/855/06855623.pdf [firstpage_image] =>[orig_patent_app_number] => 10206518 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6745235 [patent_doc_number] => 20030022418 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-30 [patent_title] => 'Sealing apparatus for semiconductor wafer and method of manufacturing semiconductor device by using the sealing apparatus' [patent_app_type] => new [patent_app_number] => 10/202024 [patent_app_country] => US [patent_app_date] => 2002-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3609 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 49 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0022/20030022418.pdf [firstpage_image] =>[orig_patent_app_number] => 10202024 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 616841 [patent_doc_number] => 07145254 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-12-05 [patent_title] => 'Transfer-molded power device and method for manufacturing transfer-molded power device' [patent_app_type] => utility [patent_app_number] => 10/201556 [patent_app_country] => US [patent_app_date] => 2002-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 42 [patent_no_of_words] => 10070 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/145/07145254.pdf [firstpage_image] =>[orig_patent_app_number] => 10201556 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6385386 [patent_doc_number] => 20020180008 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-05 [patent_title] => 'Leads under chip in conventional IC package' [patent_app_type] => new [patent_app_number] => 10/200847 [patent_app_country] => US [patent_app_date] => 2002-07-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4541 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 264 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0180/20020180008.pdf [firstpage_image] =>[orig_patent_app_number] => 10200847 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6748098 [patent_doc_number] => 20030042618 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-06 [patent_title] => 'Semiconductor device and a method of manufacturing the same' [patent_app_type] => new [patent_app_number] => 10/195493 [patent_app_country] => US [patent_app_date] => 2002-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 8234 [patent_no_of_claims] => 44 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 49 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0042/20030042618.pdf [firstpage_image] =>[orig_patent_app_number] => 10195493 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7427744 [patent_doc_number] => 20040007779 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-15 [patent_title] => 'Wafer-level method for fine-pitch, high aspect ratio chip interconnect' [patent_app_type] => new [patent_app_number] => 10/195273 [patent_app_country] => US [patent_app_date] => 2002-07-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5109 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0007/20040007779.pdf [firstpage_image] =>[orig_patent_app_number] => 10195273 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7357257 [patent_doc_number] => 20040004294 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-08 [patent_title] => 'Underfilled, encapsulated semiconductor die assemblies and methods of fabrication' [patent_app_type] => new [patent_app_number] => 10/191655 [patent_app_country] => US [patent_app_date] => 2002-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5204 [patent_no_of_claims] => 63 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0004/20040004294.pdf [firstpage_image] =>[orig_patent_app_number] => 10191655 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 732388 [patent_doc_number] => 07037733 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-05-02 [patent_title] => 'Method for measuring temperature, annealing method and method for fabricating semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/343762 [patent_app_country] => US [patent_app_date] => 2002-07-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 11 [patent_no_of_words] => 9481 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 92 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/037/07037733.pdf [firstpage_image] =>[orig_patent_app_number] => 10343762 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7421188 [patent_doc_number] => 20040000698 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-01 [patent_title] => 'CMOS MODULE FOR USED IN AN OPTICAL MOUSE' [patent_app_type] => new [patent_app_number] => 10/184885 [patent_app_country] => US [patent_app_date] => 2002-07-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1424 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0000/20040000698.pdf [firstpage_image] =>[orig_patent_app_number] => 10184885 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6854210 [patent_doc_number] => 20030127711 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-10 [patent_title] => 'Lead frame, method for manufacturing the same, resin-encapsulated semiconductor device and method for manufacturing the same' [patent_app_type] => new [patent_app_number] => 10/173900 [patent_app_country] => US [patent_app_date] => 2002-06-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 48 [patent_figures_cnt] => 48 [patent_no_of_words] => 17787 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20030127711.pdf [firstpage_image] =>[orig_patent_app_number] => 10173900 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 612730 [patent_doc_number] => 07148127 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-12-12 [patent_title] => 'Device mounting substrate and method of repairing defective device' [patent_app_type] => utility [patent_app_number] => 10/165387 [patent_app_country] => US [patent_app_date] => 2002-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 43 [patent_no_of_words] => 10200 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 205 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/148/07148127.pdf [firstpage_image] =>[orig_patent_app_number] => 10165387 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6385524 [patent_doc_number] => 20020180025 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-05 [patent_title] => 'Semiconductor device and method of stacking semiconductor chips' [patent_app_type] => new [patent_app_number] => 10/156821 [patent_app_country] => US [patent_app_date] => 2002-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 8938 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0180/20020180025.pdf [firstpage_image] =>[orig_patent_app_number] => 10156821 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6701661 [patent_doc_number] => 20030224541 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-12-04 [patent_title] => 'Method of monitoring high tilt angle of medium current implant' [patent_app_type] => new [patent_app_number] => 10/157558 [patent_app_country] => US [patent_app_date] => 2002-05-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 4210 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0224/20030224541.pdf [firstpage_image] =>[orig_patent_app_number] => 10157558 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6753505 [patent_doc_number] => 20030001281 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-02 [patent_title] => 'Stacked chip package having upper chip provided with trenches and method of manufacturing the same' [patent_app_type] => new [patent_app_number] => 10/157272 [patent_app_country] => US [patent_app_date] => 2002-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3273 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0001/20030001281.pdf [firstpage_image] =>[orig_patent_app_number] => 10157272 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 634591 [patent_doc_number] => 07129578 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-10-31 [patent_title] => 'Substrate for semiconductor device, manufacturing method thereof, semiconductor device, and frame main body' [patent_app_type] => utility [patent_app_number] => 10/152855 [patent_app_country] => US [patent_app_date] => 2002-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 6705 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 264 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/129/07129578.pdf [firstpage_image] =>[orig_patent_app_number] => 10152855 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1025595 [patent_doc_number] => 06885104 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-04-26 [patent_title] => 'Semiconductor copper bond pad surface protection' [patent_app_type] => utility [patent_app_number] => 10/153451 [patent_app_country] => US [patent_app_date] => 2002-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 2755 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/885/06885104.pdf [firstpage_image] =>[orig_patent_app_number] => 10153451 [rel_patent_id] =>[rel_patent_doc_number] =>)