James M. Mitchell

Array ( [id] => 5901122 [patent_doc_number] => 20020140083 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-03 [patent_title] => 'Semiconductor device haivng resin-sealed area on circuit board thereof' [patent_app_type] => new [patent_app_number] => 10/106495 [patent_app_country] => US [patent_app_date] => 2002-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 8598 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0140/20020140083.pdf [firstpage_image] =>[orig_patent_app_number] => 10106495 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6730345 [patent_doc_number] => 20030186535 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-10-02 [patent_title] => 'Method of making semiconductor device using a novel interconnect cladding layer' [patent_app_type] => new [patent_app_number] => 10/105431 [patent_app_country] => US [patent_app_date] => 2002-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3165 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 39 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0186/20030186535.pdf [firstpage_image] =>[orig_patent_app_number] => 10105431 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5901124 [patent_doc_number] => 20020140085 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-03 [patent_title] => 'Semiconductor package including passive elements and method of manufacture' [patent_app_type] => new [patent_app_number] => 10/107656 [patent_app_country] => US [patent_app_date] => 2002-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3808 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0140/20020140085.pdf [firstpage_image] =>[orig_patent_app_number] => 10107656 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6827662 [patent_doc_number] => 20030178720 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-09-25 [patent_title] => 'Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly' [patent_app_type] => new [patent_app_number] => 10/103801 [patent_app_country] => US [patent_app_date] => 2002-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2895 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0178/20030178720.pdf [firstpage_image] =>[orig_patent_app_number] => 10103801 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 613130 [patent_doc_number] => 07148529 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-12-12 [patent_title] => 'Semiconductor package' [patent_app_type] => utility [patent_app_number] => 10/101108 [patent_app_country] => US [patent_app_date] => 2002-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 13 [patent_no_of_words] => 2835 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 190 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/148/07148529.pdf [firstpage_image] =>[orig_patent_app_number] => 10101108 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6827657 [patent_doc_number] => 20030178715 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-09-25 [patent_title] => 'Method for stacking chips within a multichip module package' [patent_app_type] => new [patent_app_number] => 10/102324 [patent_app_country] => US [patent_app_date] => 2002-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 1553 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0178/20030178715.pdf [firstpage_image] =>[orig_patent_app_number] => 10102324 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1172727 [patent_doc_number] => 06750132 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-06-15 [patent_title] => 'Flip chip package, circuit board thereof and packaging method thereof' [patent_app_type] => B2 [patent_app_number] => 10/088479 [patent_app_country] => US [patent_app_date] => 2002-03-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3303 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 172 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/750/06750132.pdf [firstpage_image] =>[orig_patent_app_number] => 10088479 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5840371 [patent_doc_number] => 20020130404 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-19 [patent_title] => 'Semiconductor module in which plural semiconductor chips are enclosed in one package' [patent_app_type] => new [patent_app_number] => 10/102599 [patent_app_country] => US [patent_app_date] => 2002-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4231 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 209 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0130/20020130404.pdf [firstpage_image] =>[orig_patent_app_number] => 10102599 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1216521 [patent_doc_number] => 06706624 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-03-16 [patent_title] => 'Method for making multichip module substrates by encapsulating electrical conductors' [patent_app_type] => B1 [patent_app_number] => 10/100658 [patent_app_country] => US [patent_app_date] => 2002-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 10 [patent_no_of_words] => 2909 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 187 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/706/06706624.pdf [firstpage_image] =>[orig_patent_app_number] => 10100658 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1322521 [patent_doc_number] => 06608757 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-08-19 [patent_title] => 'Method for making a printed wiring board' [patent_app_type] => B1 [patent_app_number] => 10/101277 [patent_app_country] => US [patent_app_date] => 2002-03-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 9 [patent_no_of_words] => 3588 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 214 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/608/06608757.pdf [firstpage_image] =>[orig_patent_app_number] => 10101277 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1074086 [patent_doc_number] => 06838751 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-01-04 [patent_title] => 'Multi-row leadframe' [patent_app_type] => utility [patent_app_number] => 10/092683 [patent_app_country] => US [patent_app_date] => 2002-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 3083 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/838/06838751.pdf [firstpage_image] =>[orig_patent_app_number] => 10092683 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6317234 [patent_doc_number] => 20020195721 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-26 [patent_title] => 'Cavity down ball grid array packaging structure' [patent_app_type] => new [patent_app_number] => 10/091945 [patent_app_country] => US [patent_app_date] => 2002-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2803 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0195/20020195721.pdf [firstpage_image] =>[orig_patent_app_number] => 10091945 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6415572 [patent_doc_number] => 20020125580 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-12 [patent_title] => 'Stacked semiconductor chip package' [patent_app_type] => new [patent_app_number] => 10/087432 [patent_app_country] => US [patent_app_date] => 2002-03-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1547 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0125/20020125580.pdf [firstpage_image] =>[orig_patent_app_number] => 10087432 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6365697 [patent_doc_number] => 20020117679 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-29 [patent_title] => 'Active optical device' [patent_app_type] => new [patent_app_number] => 10/081424 [patent_app_country] => US [patent_app_date] => 2002-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2707 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 26 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0117/20020117679.pdf [firstpage_image] =>[orig_patent_app_number] => 10081424 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6523259 [patent_doc_number] => 20020109239 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-08-15 [patent_title] => 'Semiconductor device capable of preventing solder balls from being removed in reinforcing pad' [patent_app_type] => new [patent_app_number] => 10/073196 [patent_app_country] => US [patent_app_date] => 2002-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3296 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 116 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0109/20020109239.pdf [firstpage_image] =>[orig_patent_app_number] => 10073196 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6718468 [patent_doc_number] => 20030052155 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-20 [patent_title] => 'Universal ball attach manufacturing process' [patent_app_type] => new [patent_app_number] => 10/062515 [patent_app_country] => US [patent_app_date] => 2002-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 3413 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 47 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0052/20030052155.pdf [firstpage_image] =>[orig_patent_app_number] => 10062515 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6849368 [patent_doc_number] => 20030141570 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-31 [patent_title] => 'SEMICONDUCTOR WAFER HAVING A THIN DIE AND TETHERS AND METHODS OF MAKING THE SAME' [patent_app_type] => new [patent_app_number] => 10/058557 [patent_app_country] => US [patent_app_date] => 2002-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 8350 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0141/20030141570.pdf [firstpage_image] =>[orig_patent_app_number] => 10058557 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1106109 [patent_doc_number] => 06812501 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-11-02 [patent_title] => 'Semiconductor laser package and fabrication method thereof' [patent_app_type] => B2 [patent_app_number] => 10/058664 [patent_app_country] => US [patent_app_date] => 2002-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 8 [patent_no_of_words] => 3314 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/812/06812501.pdf [firstpage_image] =>[orig_patent_app_number] => 10058664 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1141078 [patent_doc_number] => 06781227 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-08-24 [patent_title] => 'Compression assembled electronic package having a plastic molded insulation ring' [patent_app_type] => B2 [patent_app_number] => 10/057399 [patent_app_country] => US [patent_app_date] => 2002-01-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2487 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/781/06781227.pdf [firstpage_image] =>[orig_patent_app_number] => 10057399 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6854233 [patent_doc_number] => 20030127734 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-07-10 [patent_title] => 'Cylindrical bonding structure and method of manufacture' [patent_app_type] => new [patent_app_number] => 10/055580 [patent_app_country] => US [patent_app_date] => 2002-01-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5855 [patent_no_of_claims] => 69 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20030127734.pdf [firstpage_image] =>[orig_patent_app_number] => 10055580 [rel_patent_id] =>[rel_patent_doc_number] =>)