
James M. Mitchell
Supervisory Patent Examiner (ID: 15731, Phone: (571)272-1931 , Office: P/4100 )
| Most Active Art Unit | 2813 |
| Art Unit(s) | 2813, 4100, 2827, 2822, 4127 |
| Total Applications | 769 |
| Issued Applications | 540 |
| Pending Applications | 13 |
| Abandoned Applications | 218 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 6758883
[patent_doc_number] => 20030122244
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-07-03
[patent_title] => 'Integrated chip package structure using metal substrate and method of manufacturing the same'
[patent_app_type] => new
[patent_app_number] => 10/055560
[patent_app_country] => US
[patent_app_date] => 2002-01-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 17
[patent_figures_cnt] => 17
[patent_no_of_words] => 6553
[patent_no_of_claims] => 138
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 132
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0122/20030122244.pdf
[firstpage_image] =>[orig_patent_app_number] => 10055560
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/055560 | Integrated chip package structure using metal substrate and method of manufacturing the same | Jan 21, 2002 | Issued |
Array
(
[id] => 7627857
[patent_doc_number] => 06806581
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-10-19
[patent_title] => 'Bonded anisotropic conductive film'
[patent_app_type] => B2
[patent_app_number] => 10/047681
[patent_app_country] => US
[patent_app_date] => 2002-01-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 2381
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 7
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/806/06806581.pdf
[firstpage_image] =>[orig_patent_app_number] => 10047681
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/047681 | Bonded anisotropic conductive film | Jan 13, 2002 | Issued |
Array
(
[id] => 1414077
[patent_doc_number] => 06521479
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-02-18
[patent_title] => 'Repackaging semiconductor IC devices for failure analysis'
[patent_app_type] => B1
[patent_app_number] => 10/044024
[patent_app_country] => US
[patent_app_date] => 2002-01-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 13
[patent_no_of_words] => 3572
[patent_no_of_claims] => 37
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 220
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/521/06521479.pdf
[firstpage_image] =>[orig_patent_app_number] => 10044024
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/044024 | Repackaging semiconductor IC devices for failure analysis | Jan 10, 2002 | Issued |
Array
(
[id] => 5919707
[patent_doc_number] => 20020114143
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-08-22
[patent_title] => 'Chip-scale packages stacked on folded interconnector for vertical assembly on substrates'
[patent_app_type] => new
[patent_app_number] => 10/034827
[patent_app_country] => US
[patent_app_date] => 2002-01-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 4870
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 7
[patent_words_short_claim] => 42
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0114/20020114143.pdf
[firstpage_image] =>[orig_patent_app_number] => 10034827
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/034827 | Chip-scale packages stacked on folded interconnector for vertical assembly on substrates | Jan 2, 2002 | Abandoned |
Array
(
[id] => 6680996
[patent_doc_number] => 20030116860
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-06-26
[patent_title] => 'Semiconductor package with low resistance package-to-die interconnect scheme for reduced die stresses'
[patent_app_type] => new
[patent_app_number] => 10/023723
[patent_app_country] => US
[patent_app_date] => 2001-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2238
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 60
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0116/20030116860.pdf
[firstpage_image] =>[orig_patent_app_number] => 10023723
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/023723 | Semiconductor package with low resistance package-to-die interconnect scheme for reduced die stresses | Dec 20, 2001 | Abandoned |
Array
(
[id] => 6680482
[patent_doc_number] => 20030116346
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-06-26
[patent_title] => 'Low cost area array probe for circuits having solder-ball contacts are manufactured using a wire bonding machine'
[patent_app_type] => new
[patent_app_number] => 10/026052
[patent_app_country] => US
[patent_app_date] => 2001-12-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3511
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 123
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0116/20030116346.pdf
[firstpage_image] =>[orig_patent_app_number] => 10026052
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/026052 | Low cost area array probe for circuits having solder-ball contacts are manufactured using a wire bonding machine | Dec 20, 2001 | Abandoned |
Array
(
[id] => 6242429
[patent_doc_number] => 20020045292
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-04-18
[patent_title] => 'Semiconductor device, method for manufacturing same and portable device'
[patent_app_type] => new
[patent_app_number] => 10/022542
[patent_app_country] => US
[patent_app_date] => 2001-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 3371
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 112
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0045/20020045292.pdf
[firstpage_image] =>[orig_patent_app_number] => 10022542
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/022542 | Semiconductor device, method for manufacturing same and portable device | Dec 19, 2001 | Abandoned |
Array
(
[id] => 1109051
[patent_doc_number] => 06809411
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-10-26
[patent_title] => 'Low-inductance semiconductor components'
[patent_app_type] => B2
[patent_app_number] => 10/023189
[patent_app_country] => US
[patent_app_date] => 2001-12-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 2806
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 367
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/809/06809411.pdf
[firstpage_image] =>[orig_patent_app_number] => 10023189
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/023189 | Low-inductance semiconductor components | Dec 16, 2001 | Issued |
Array
(
[id] => 1083535
[patent_doc_number] => 06833629
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-12-21
[patent_title] => 'Dual cure B-stageable underfill for wafer level'
[patent_app_type] => B2
[patent_app_number] => 10/020638
[patent_app_country] => US
[patent_app_date] => 2001-12-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 3945
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 216
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/833/06833629.pdf
[firstpage_image] =>[orig_patent_app_number] => 10020638
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/020638 | Dual cure B-stageable underfill for wafer level | Dec 13, 2001 | Issued |
Array
(
[id] => 6205430
[patent_doc_number] => 20020070446
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-06-13
[patent_title] => 'Semiconductor device and method for the production thereof'
[patent_app_type] => new
[patent_app_number] => 10/012778
[patent_app_country] => US
[patent_app_date] => 2001-12-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 10591
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 37
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0070/20020070446.pdf
[firstpage_image] =>[orig_patent_app_number] => 10012778
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/012778 | Semiconductor device and method for the production thereof | Dec 9, 2001 | Abandoned |
Array
(
[id] => 1415298
[patent_doc_number] => 06518090
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2003-02-11
[patent_title] => 'Semiconductor device and manufacturing method thereof'
[patent_app_type] => B2
[patent_app_number] => 10/000482
[patent_app_country] => US
[patent_app_date] => 2001-12-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 22
[patent_no_of_words] => 8804
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 101
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/518/06518090.pdf
[firstpage_image] =>[orig_patent_app_number] => 10000482
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/000482 | Semiconductor device and manufacturing method thereof | Dec 3, 2001 | Issued |
Array
(
[id] => 6123575
[patent_doc_number] => 20020074654
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-06-20
[patent_title] => 'Wiring substrate, wiring board, and wiring substrate mounting structure'
[patent_app_type] => new
[patent_app_number] => 09/996349
[patent_app_country] => US
[patent_app_date] => 2001-11-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 4340
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 56
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0074/20020074654.pdf
[firstpage_image] =>[orig_patent_app_number] => 09996349
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/996349 | Wiring substrate, wiring board, and wiring substrate mounting structure | Nov 26, 2001 | Abandoned |
Array
(
[id] => 1545064
[patent_doc_number] => 06444498
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-03
[patent_title] => 'Method of making semiconductor package with heat spreader'
[patent_app_type] => B1
[patent_app_number] => 09/990752
[patent_app_country] => US
[patent_app_date] => 2001-11-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 15
[patent_no_of_words] => 5081
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 23
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/444/06444498.pdf
[firstpage_image] =>[orig_patent_app_number] => 09990752
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/990752 | Method of making semiconductor package with heat spreader | Nov 14, 2001 | Issued |
Array
(
[id] => 5933510
[patent_doc_number] => 20020060372
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-05-23
[patent_title] => 'IC chip'
[patent_app_type] => new
[patent_app_number] => 10/010164
[patent_app_country] => US
[patent_app_date] => 2001-11-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 5040
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 131
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0060/20020060372.pdf
[firstpage_image] =>[orig_patent_app_number] => 10010164
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/010164 | IC chip | Nov 12, 2001 | Abandoned |
Array
(
[id] => 1104764
[patent_doc_number] => 06812064
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-11-02
[patent_title] => 'Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate'
[patent_app_type] => B2
[patent_app_number] => 10/008136
[patent_app_country] => US
[patent_app_date] => 2001-11-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 14
[patent_no_of_words] => 5269
[patent_no_of_claims] => 72
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/812/06812064.pdf
[firstpage_image] =>[orig_patent_app_number] => 10008136
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/008136 | Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate | Nov 6, 2001 | Issued |
Array
(
[id] => 6790111
[patent_doc_number] => 20030085455
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-05-08
[patent_title] => 'Thermal ring used in 3-D stacking'
[patent_app_type] => new
[patent_app_number] => 09/994002
[patent_app_country] => US
[patent_app_date] => 2001-11-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 3497
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 127
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0085/20030085455.pdf
[firstpage_image] =>[orig_patent_app_number] => 09994002
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/994002 | Thermal ring used in 3-D stacking | Nov 5, 2001 | Abandoned |
Array
(
[id] => 1141529
[patent_doc_number] => 06777312
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-08-17
[patent_title] => 'Wafer-level transfer of membranes in semiconductor processing'
[patent_app_type] => B2
[patent_app_number] => 10/005765
[patent_app_country] => US
[patent_app_date] => 2001-11-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 32
[patent_no_of_words] => 3108
[patent_no_of_claims] => 32
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 146
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/777/06777312.pdf
[firstpage_image] =>[orig_patent_app_number] => 10005765
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/005765 | Wafer-level transfer of membranes in semiconductor processing | Nov 1, 2001 | Issued |
Array
(
[id] => 6867748
[patent_doc_number] => 20030080437
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-05-01
[patent_title] => 'Electronic assembly with filled no-flow underfill and methods of manufacture'
[patent_app_type] => new
[patent_app_number] => 10/003238
[patent_app_country] => US
[patent_app_date] => 2001-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 5378
[patent_no_of_claims] => 32
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 74
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0080/20030080437.pdf
[firstpage_image] =>[orig_patent_app_number] => 10003238
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/003238 | Electronic assemblies with filled no-flow underfill | Oct 25, 2001 | Issued |
Array
(
[id] => 5933507
[patent_doc_number] => 20020060370
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-05-23
[patent_title] => 'Die attach curing method for semiconductor device'
[patent_app_type] => new
[patent_app_number] => 09/960945
[patent_app_country] => US
[patent_app_date] => 2001-09-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 2181
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 37
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0060/20020060370.pdf
[firstpage_image] =>[orig_patent_app_number] => 09960945
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/960945 | Die attach curing method for semiconductor device | Sep 24, 2001 | Issued |
Array
(
[id] => 1083349
[patent_doc_number] => 06833563
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2004-12-21
[patent_title] => 'Multi-stack surface mount light emitting diodes'
[patent_app_type] => B2
[patent_app_number] => 09/965234
[patent_app_country] => US
[patent_app_date] => 2001-09-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 10
[patent_no_of_words] => 2550
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 119
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/833/06833563.pdf
[firstpage_image] =>[orig_patent_app_number] => 09965234
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/965234 | Multi-stack surface mount light emitting diodes | Sep 24, 2001 | Issued |