
James M. Mitchell
Supervisory Patent Examiner (ID: 15731, Phone: (571)272-1931 , Office: P/4100 )
| Most Active Art Unit | 2813 |
| Art Unit(s) | 2813, 4100, 2827, 2822, 4127 |
| Total Applications | 769 |
| Issued Applications | 540 |
| Pending Applications | 13 |
| Abandoned Applications | 218 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 954120
[patent_doc_number] => 06958535
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-10-25
[patent_title] => 'Thermal conductive substrate and semiconductor module using the same'
[patent_app_type] => utility
[patent_app_number] => 09/956208
[patent_app_country] => US
[patent_app_date] => 2001-09-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 24
[patent_no_of_words] => 8144
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 208
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/958/06958535.pdf
[firstpage_image] =>[orig_patent_app_number] => 09956208
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/956208 | Thermal conductive substrate and semiconductor module using the same | Sep 17, 2001 | Issued |
Array
(
[id] => 934019
[patent_doc_number] => 06977214
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-12-20
[patent_title] => 'Die paddle clamping method for wire bond enhancement'
[patent_app_type] => utility
[patent_app_number] => 09/943763
[patent_app_country] => US
[patent_app_date] => 2001-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 3111
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[pdf_file] => patents/06/977/06977214.pdf
[firstpage_image] =>[orig_patent_app_number] => 09943763
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/943763 | Die paddle clamping method for wire bond enhancement | Aug 29, 2001 | Issued |
Array
(
[id] => 682997
[patent_doc_number] => 07081646
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-07-25
[patent_title] => 'Semiconductor device and method of fabricating same'
[patent_app_type] => utility
[patent_app_number] => 09/939767
[patent_app_country] => US
[patent_app_date] => 2001-08-28
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/081/07081646.pdf
[firstpage_image] =>[orig_patent_app_number] => 09939767
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/939767 | Semiconductor device and method of fabricating same | Aug 27, 2001 | Issued |
Array
(
[id] => 6838902
[patent_doc_number] => 20030036242
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-02-20
[patent_title] => 'Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions'
[patent_app_type] => new
[patent_app_number] => 09/932236
[patent_app_country] => US
[patent_app_date] => 2001-08-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 2211
[patent_no_of_claims] => 41
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[pdf_file] => publications/A1/0036/20030036242.pdf
[firstpage_image] =>[orig_patent_app_number] => 09932236
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/932236 | Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions | Aug 15, 2001 | Abandoned |
Array
(
[id] => 7012644
[patent_doc_number] => 20010050440
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-12-13
[patent_title] => 'Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof'
[patent_app_type] => new
[patent_app_number] => 09/903760
[patent_app_country] => US
[patent_app_date] => 2001-07-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[pdf_file] => publications/A1/0050/20010050440.pdf
[firstpage_image] =>[orig_patent_app_number] => 09903760
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/903760 | Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof | Jul 12, 2001 | Issued |
Array
(
[id] => 1025578
[patent_doc_number] => 06885096
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-04-26
[patent_title] => 'Semiconductor device having at least three power terminals superposed on each other'
[patent_app_type] => utility
[patent_app_number] => 09/900946
[patent_app_country] => US
[patent_app_date] => 2001-07-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 3900
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[pdf_file] => patents/06/885/06885096.pdf
[firstpage_image] =>[orig_patent_app_number] => 09900946
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/900946 | Semiconductor device having at least three power terminals superposed on each other | Jul 9, 2001 | Issued |
Array
(
[id] => 482491
[patent_doc_number] => 07220615
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-05-22
[patent_title] => 'Alternative method used to package multimedia card by transfer molding'
[patent_app_type] => utility
[patent_app_number] => 09/878302
[patent_app_country] => US
[patent_app_date] => 2001-06-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 27
[patent_no_of_words] => 5613
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 191
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/220/07220615.pdf
[firstpage_image] =>[orig_patent_app_number] => 09878302
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/878302 | Alternative method used to package multimedia card by transfer molding | Jun 10, 2001 | Issued |
Array
(
[id] => 6882683
[patent_doc_number] => 20010049155
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2001-12-06
[patent_title] => 'Semiconductor device using substrate having cubic structure and method of manufacturing the same'
[patent_app_type] => new
[patent_app_number] => 09/871671
[patent_app_country] => US
[patent_app_date] => 2001-06-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 4564
[patent_no_of_claims] => 26
[patent_no_of_ind_claims] => 4
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[pdf_file] => publications/A1/0049/20010049155.pdf
[firstpage_image] =>[orig_patent_app_number] => 09871671
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/871671 | Semiconductor device using substrate having cubic structure and method of manufacturing the same | Jun 3, 2001 | Issued |
Array
(
[id] => 6385421
[patent_doc_number] => 20020180013
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-12-05
[patent_title] => 'Method of manufacture of silicon based package and device manufactured thereby'
[patent_app_type] => new
[patent_app_number] => 09/870531
[patent_app_country] => US
[patent_app_date] => 2001-05-31
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[patent_drawing_sheets_cnt] => 16
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/870531 | Method of manufacture of silicon based package | May 30, 2001 | Issued |
Array
(
[id] => 7629388
[patent_doc_number] => 06818968
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2004-11-16
[patent_title] => 'Integrated circuit package and process for forming the same'
[patent_app_type] => B1
[patent_app_number] => 09/863651
[patent_app_country] => US
[patent_app_date] => 2001-05-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] => patents/06/818/06818968.pdf
[firstpage_image] =>[orig_patent_app_number] => 09863651
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/863651 | Integrated circuit package and process for forming the same | May 21, 2001 | Issued |
Array
(
[id] => 6111237
[patent_doc_number] => 20020173072
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-11-21
[patent_title] => 'Data capture plate for substrate components'
[patent_app_type] => new
[patent_app_number] => 09/860901
[patent_app_country] => US
[patent_app_date] => 2001-05-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[firstpage_image] =>[orig_patent_app_number] => 09860901
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/860901 | Data capture plate for substrate components | May 17, 2001 | Abandoned |
Array
(
[id] => 6111239
[patent_doc_number] => 20020173074
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-11-21
[patent_title] => 'Method for underfilling bonding gap between flip-chip and circuit substrate'
[patent_app_type] => new
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/855551 | Method for underfilling bonding gap between flip-chip and circuit substrate | May 15, 2001 | Abandoned |
Array
(
[id] => 5798601
[patent_doc_number] => 20020008307
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[patent_issue_date] => 2002-01-24
[patent_title] => 'Substrate film structure'
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[patent_app_number] => 09/858118
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[firstpage_image] =>[orig_patent_app_number] => 09858118
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/858118 | Substrate film structure | May 14, 2001 | Abandoned |
Array
(
[id] => 6342705
[patent_doc_number] => 20020034838
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[patent_kind] => A1
[patent_issue_date] => 2002-03-21
[patent_title] => 'Structure of disturbing plate having bent-down part'
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[pdf_file] => publications/A1/0034/20020034838.pdf
[firstpage_image] =>[orig_patent_app_number] => 09852188
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/852188 | Mass-production packaging means and mass-production packaging method | May 7, 2001 | Issued |
Array
(
[id] => 5813045
[patent_doc_number] => 20020038908
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[patent_kind] => A1
[patent_issue_date] => 2002-04-04
[patent_title] => 'Thermal enhanced ball grid array package'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/849137 | Thermal enhanced ball grid array package | May 3, 2001 | Issued |
Array
(
[id] => 7078474
[patent_doc_number] => 20010041381
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[patent_issue_date] => 2001-11-15
[patent_title] => 'Method for manufacturing digital micro-mirror device (DMD) packages'
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[patent_app_number] => 09/847620
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[pdf_file] => publications/A1/0041/20010041381.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/847620 | Method for manufacturing digital micro-mirror device (DMD) packages | May 1, 2001 | Issued |
Array
(
[id] => 6094217
[patent_doc_number] => 20020051353
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-05-02
[patent_title] => 'High-frequency ceramic package'
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[firstpage_image] =>[orig_patent_app_number] => 09845327
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/845327 | High-frequency ceramic package | Apr 30, 2001 | Abandoned |
Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/843630 | Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof | Apr 26, 2001 | Abandoned |
Array
(
[id] => 7090985
[patent_doc_number] => 20010033032
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[patent_app_type] => new
[patent_app_number] => 09/842487
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[pdf_file] => publications/A1/0033/20010033032.pdf
[firstpage_image] =>[orig_patent_app_number] => 09842487
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/842487 | Manufacturing method for semiconductor device, mounting method of semiconductor device, semiconductor device, and inspecting method of semiconductor device | Apr 24, 2001 | Abandoned |