Search

James M. Mitchell

Supervisory Patent Examiner (ID: 15731, Phone: (571)272-1931 , Office: P/4100 )

Most Active Art Unit
2813
Art Unit(s)
2813, 4100, 2827, 2822, 4127
Total Applications
769
Issued Applications
540
Pending Applications
13
Abandoned Applications
218

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 954120 [patent_doc_number] => 06958535 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-10-25 [patent_title] => 'Thermal conductive substrate and semiconductor module using the same' [patent_app_type] => utility [patent_app_number] => 09/956208 [patent_app_country] => US [patent_app_date] => 2001-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 24 [patent_no_of_words] => 8144 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 208 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/958/06958535.pdf [firstpage_image] =>[orig_patent_app_number] => 09956208 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/956208
Thermal conductive substrate and semiconductor module using the same Sep 17, 2001 Issued
Array ( [id] => 934019 [patent_doc_number] => 06977214 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-12-20 [patent_title] => 'Die paddle clamping method for wire bond enhancement' [patent_app_type] => utility [patent_app_number] => 09/943763 [patent_app_country] => US [patent_app_date] => 2001-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 3111 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/977/06977214.pdf [firstpage_image] =>[orig_patent_app_number] => 09943763 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/943763
Die paddle clamping method for wire bond enhancement Aug 29, 2001 Issued
Array ( [id] => 682997 [patent_doc_number] => 07081646 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-07-25 [patent_title] => 'Semiconductor device and method of fabricating same' [patent_app_type] => utility [patent_app_number] => 09/939767 [patent_app_country] => US [patent_app_date] => 2001-08-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 29 [patent_no_of_words] => 4290 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/081/07081646.pdf [firstpage_image] =>[orig_patent_app_number] => 09939767 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/939767
Semiconductor device and method of fabricating same Aug 27, 2001 Issued
Array ( [id] => 6838902 [patent_doc_number] => 20030036242 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-02-20 [patent_title] => 'Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions' [patent_app_type] => new [patent_app_number] => 09/932236 [patent_app_country] => US [patent_app_date] => 2001-08-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2211 [patent_no_of_claims] => 41 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20030036242.pdf [firstpage_image] =>[orig_patent_app_number] => 09932236 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/932236
Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions Aug 15, 2001 Abandoned
Array ( [id] => 7012644 [patent_doc_number] => 20010050440 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-12-13 [patent_title] => 'Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof' [patent_app_type] => new [patent_app_number] => 09/903760 [patent_app_country] => US [patent_app_date] => 2001-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 7972 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0050/20010050440.pdf [firstpage_image] =>[orig_patent_app_number] => 09903760 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/903760
Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof Jul 12, 2001 Issued
Array ( [id] => 1025578 [patent_doc_number] => 06885096 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-04-26 [patent_title] => 'Semiconductor device having at least three power terminals superposed on each other' [patent_app_type] => utility [patent_app_number] => 09/900946 [patent_app_country] => US [patent_app_date] => 2001-07-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 16 [patent_no_of_words] => 3900 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/885/06885096.pdf [firstpage_image] =>[orig_patent_app_number] => 09900946 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/900946
Semiconductor device having at least three power terminals superposed on each other Jul 9, 2001 Issued
Array ( [id] => 482491 [patent_doc_number] => 07220615 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-05-22 [patent_title] => 'Alternative method used to package multimedia card by transfer molding' [patent_app_type] => utility [patent_app_number] => 09/878302 [patent_app_country] => US [patent_app_date] => 2001-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 27 [patent_no_of_words] => 5613 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/220/07220615.pdf [firstpage_image] =>[orig_patent_app_number] => 09878302 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/878302
Alternative method used to package multimedia card by transfer molding Jun 10, 2001 Issued
Array ( [id] => 6882683 [patent_doc_number] => 20010049155 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-12-06 [patent_title] => 'Semiconductor device using substrate having cubic structure and method of manufacturing the same' [patent_app_type] => new [patent_app_number] => 09/871671 [patent_app_country] => US [patent_app_date] => 2001-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4564 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 33 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0049/20010049155.pdf [firstpage_image] =>[orig_patent_app_number] => 09871671 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/871671
Semiconductor device using substrate having cubic structure and method of manufacturing the same Jun 3, 2001 Issued
Array ( [id] => 6385421 [patent_doc_number] => 20020180013 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-05 [patent_title] => 'Method of manufacture of silicon based package and device manufactured thereby' [patent_app_type] => new [patent_app_number] => 09/870531 [patent_app_country] => US [patent_app_date] => 2001-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 6574 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0180/20020180013.pdf [firstpage_image] =>[orig_patent_app_number] => 09870531 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/870531
Method of manufacture of silicon based package May 30, 2001 Issued
Array ( [id] => 7629388 [patent_doc_number] => 06818968 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-11-16 [patent_title] => 'Integrated circuit package and process for forming the same' [patent_app_type] => B1 [patent_app_number] => 09/863651 [patent_app_country] => US [patent_app_date] => 2001-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 1905 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 6 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/818/06818968.pdf [firstpage_image] =>[orig_patent_app_number] => 09863651 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/863651
Integrated circuit package and process for forming the same May 21, 2001 Issued
Array ( [id] => 6111237 [patent_doc_number] => 20020173072 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-11-21 [patent_title] => 'Data capture plate for substrate components' [patent_app_type] => new [patent_app_number] => 09/860901 [patent_app_country] => US [patent_app_date] => 2001-05-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2945 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0173/20020173072.pdf [firstpage_image] =>[orig_patent_app_number] => 09860901 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/860901
Data capture plate for substrate components May 17, 2001 Abandoned
Array ( [id] => 6111239 [patent_doc_number] => 20020173074 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-11-21 [patent_title] => 'Method for underfilling bonding gap between flip-chip and circuit substrate' [patent_app_type] => new [patent_app_number] => 09/855551 [patent_app_country] => US [patent_app_date] => 2001-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2945 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0173/20020173074.pdf [firstpage_image] =>[orig_patent_app_number] => 09855551 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/855551
Method for underfilling bonding gap between flip-chip and circuit substrate May 15, 2001 Abandoned
Array ( [id] => 5798601 [patent_doc_number] => 20020008307 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-24 [patent_title] => 'Substrate film structure' [patent_app_type] => new [patent_app_number] => 09/858118 [patent_app_country] => US [patent_app_date] => 2001-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 6285 [patent_no_of_claims] => 58 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 22 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0008/20020008307.pdf [firstpage_image] =>[orig_patent_app_number] => 09858118 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/858118
Substrate film structure May 14, 2001 Abandoned
Array ( [id] => 6342705 [patent_doc_number] => 20020034838 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-03-21 [patent_title] => 'Structure of disturbing plate having bent-down part' [patent_app_type] => new [patent_app_number] => 09/852188 [patent_app_country] => US [patent_app_date] => 2001-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5226 [patent_no_of_claims] => 47 [patent_no_of_ind_claims] => 7 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0034/20020034838.pdf [firstpage_image] =>[orig_patent_app_number] => 09852188 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/852188
Mass-production packaging means and mass-production packaging method May 7, 2001 Issued
Array ( [id] => 5813045 [patent_doc_number] => 20020038908 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-04-04 [patent_title] => 'Thermal enhanced ball grid array package' [patent_app_type] => new [patent_app_number] => 09/849137 [patent_app_country] => US [patent_app_date] => 2001-05-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3083 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 206 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0038/20020038908.pdf [firstpage_image] =>[orig_patent_app_number] => 09849137 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/849137
Thermal enhanced ball grid array package May 3, 2001 Issued
Array ( [id] => 7078474 [patent_doc_number] => 20010041381 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-11-15 [patent_title] => 'Method for manufacturing digital micro-mirror device (DMD) packages' [patent_app_type] => new [patent_app_number] => 09/847620 [patent_app_country] => US [patent_app_date] => 2001-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 4115 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0041/20010041381.pdf [firstpage_image] =>[orig_patent_app_number] => 09847620 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/847620
Method for manufacturing digital micro-mirror device (DMD) packages May 1, 2001 Issued
Array ( [id] => 6094217 [patent_doc_number] => 20020051353 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-05-02 [patent_title] => 'High-frequency ceramic package' [patent_app_type] => new [patent_app_number] => 09/845327 [patent_app_country] => US [patent_app_date] => 2001-05-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3817 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 166 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0051/20020051353.pdf [firstpage_image] =>[orig_patent_app_number] => 09845327 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/845327
High-frequency ceramic package Apr 30, 2001 Abandoned
Array ( [id] => 6536266 [patent_doc_number] => 20020163072 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-11-07 [patent_title] => 'Method for bonding wafers to produce stacked integrated circuits' [patent_app_type] => new [patent_app_number] => 09/847667 [patent_app_country] => US [patent_app_date] => 2001-05-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 3679 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0163/20020163072.pdf [firstpage_image] =>[orig_patent_app_number] => 09847667 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/847667
Method for bonding wafers to produce stacked integrated circuits Apr 30, 2001 Abandoned
Array ( [id] => 6224679 [patent_doc_number] => 20020004288 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-01-10 [patent_title] => 'Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof' [patent_app_type] => new [patent_app_number] => 09/843630 [patent_app_country] => US [patent_app_date] => 2001-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 8115 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0004/20020004288.pdf [firstpage_image] =>[orig_patent_app_number] => 09843630 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/843630
Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof Apr 26, 2001 Abandoned
Array ( [id] => 7090985 [patent_doc_number] => 20010033032 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-10-25 [patent_title] => 'Manufacturing method for semiconductor device, mounting method of semiconductor device, semiconductor device, and inspecting method of semiconductor device' [patent_app_type] => new [patent_app_number] => 09/842487 [patent_app_country] => US [patent_app_date] => 2001-04-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 8042 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0033/20010033032.pdf [firstpage_image] =>[orig_patent_app_number] => 09842487 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/842487
Manufacturing method for semiconductor device, mounting method of semiconductor device, semiconductor device, and inspecting method of semiconductor device Apr 24, 2001 Abandoned
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