Search

James R. Bidwell

Examiner (ID: 2020, Phone: (571)272-6910 , Office: P/3651 )

Most Active Art Unit
3651
Art Unit(s)
3651, 3615, 2899, 3107, 3101
Total Applications
4817
Issued Applications
4303
Pending Applications
229
Abandoned Applications
341

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 9418891 [patent_doc_number] => 20140103541 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-04-17 [patent_title] => 'SEMICONDUCTOR DEVICE, CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE' [patent_app_type] => utility [patent_app_number] => 14/132625 [patent_app_country] => US [patent_app_date] => 2013-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5874 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14132625 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/132625
Semiconductor device, circuit substrate, and electronic device Dec 17, 2013 Issued
Array ( [id] => 9418886 [patent_doc_number] => 20140103536 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-04-17 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 14/132074 [patent_app_country] => US [patent_app_date] => 2013-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5192 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14132074 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/132074
Semiconductor device Dec 17, 2013 Issued
Array ( [id] => 9432930 [patent_doc_number] => 20140110837 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-04-24 [patent_title] => 'ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE' [patent_app_type] => utility [patent_app_number] => 14/132739 [patent_app_country] => US [patent_app_date] => 2013-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5790 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14132739 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/132739
Routing layer for mitigating stress in a semiconductor die Dec 17, 2013 Issued
Array ( [id] => 9938074 [patent_doc_number] => 08987887 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-03-24 [patent_title] => 'Interconnection device for electronic circuits, notably microwave electronic circuits' [patent_app_type] => utility [patent_app_number] => 14/133308 [patent_app_country] => US [patent_app_date] => 2013-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 14 [patent_no_of_words] => 5202 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14133308 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/133308
Interconnection device for electronic circuits, notably microwave electronic circuits Dec 17, 2013 Issued
Array ( [id] => 10597312 [patent_doc_number] => 09318407 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-04-19 [patent_title] => 'Pop package structure' [patent_app_type] => utility [patent_app_number] => 14/107808 [patent_app_country] => US [patent_app_date] => 2013-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 23 [patent_no_of_words] => 4319 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14107808 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/107808
Pop package structure Dec 15, 2013 Issued
Array ( [id] => 9697104 [patent_doc_number] => 20140246788 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-09-04 [patent_title] => 'STACK-TYPE SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 14/099860 [patent_app_country] => US [patent_app_date] => 2013-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 10256 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14099860 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/099860
Stack-type semiconductor package Dec 5, 2013 Issued
Array ( [id] => 9536036 [patent_doc_number] => 20140160682 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-06-12 [patent_title] => 'ELECTRONIC COMPONENT AND FABRICATION PROCESS OF THIS ELECTRONIC COMPONENT' [patent_app_type] => utility [patent_app_number] => 14/098712 [patent_app_country] => US [patent_app_date] => 2013-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 5062 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14098712 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/098712
Electronic component and fabrication process of this electronic component Dec 5, 2013 Issued
Array ( [id] => 9613600 [patent_doc_number] => 20140203457 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-07-24 [patent_title] => 'STACKED DIE PACKAGE, SYSTEM INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/094952 [patent_app_country] => US [patent_app_date] => 2013-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 23 [patent_no_of_words] => 7420 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14094952 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/094952
Stacked die package, system including the same, and method of manufacturing the same Dec 2, 2013 Issued
Array ( [id] => 9394074 [patent_doc_number] => 20140091480 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-04-03 [patent_title] => 'DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM' [patent_app_type] => utility [patent_app_number] => 14/095164 [patent_app_country] => US [patent_app_date] => 2013-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 17644 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14095164 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/095164
Dicing tape-integrated wafer back surface protective film Dec 2, 2013 Issued
Array ( [id] => 9381009 [patent_doc_number] => 20140084490 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-03-27 [patent_title] => 'DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM' [patent_app_type] => utility [patent_app_number] => 14/095230 [patent_app_country] => US [patent_app_date] => 2013-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 17642 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14095230 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/095230
Dicing tape-integrated wafer back surface protective film Dec 2, 2013 Issued
Array ( [id] => 9394074 [patent_doc_number] => 20140091480 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-04-03 [patent_title] => 'DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM' [patent_app_type] => utility [patent_app_number] => 14/095164 [patent_app_country] => US [patent_app_date] => 2013-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 17644 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14095164 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/095164
Dicing tape-integrated wafer back surface protective film Dec 2, 2013 Issued
Array ( [id] => 9394074 [patent_doc_number] => 20140091480 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-04-03 [patent_title] => 'DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM' [patent_app_type] => utility [patent_app_number] => 14/095164 [patent_app_country] => US [patent_app_date] => 2013-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 17644 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14095164 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/095164
Dicing tape-integrated wafer back surface protective film Dec 2, 2013 Issued
Array ( [id] => 9394074 [patent_doc_number] => 20140091480 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-04-03 [patent_title] => 'DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM' [patent_app_type] => utility [patent_app_number] => 14/095164 [patent_app_country] => US [patent_app_date] => 2013-12-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 17644 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14095164 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/095164
Dicing tape-integrated wafer back surface protective film Dec 2, 2013 Issued
Array ( [id] => 11279717 [patent_doc_number] => 09496199 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-11-15 [patent_title] => 'Heat spreader with flexible tolerance mechanism' [patent_app_type] => utility [patent_app_number] => 14/093768 [patent_app_country] => US [patent_app_date] => 2013-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 13 [patent_no_of_words] => 3990 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14093768 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/093768
Heat spreader with flexible tolerance mechanism Dec 1, 2013 Issued
Array ( [id] => 9534578 [patent_doc_number] => 20140159224 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-06-12 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 14/093337 [patent_app_country] => US [patent_app_date] => 2013-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5240 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14093337 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/093337
Semiconductor device Nov 28, 2013 Issued
Array ( [id] => 10898808 [patent_doc_number] => 08922030 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-12-30 [patent_title] => 'Moisture-tight semiconductor module and method for producing a moisture-tight semiconductor module' [patent_app_type] => utility [patent_app_number] => 14/091807 [patent_app_country] => US [patent_app_date] => 2013-11-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 8437 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 213 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14091807 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/091807
Moisture-tight semiconductor module and method for producing a moisture-tight semiconductor module Nov 26, 2013 Issued
Array ( [id] => 10472292 [patent_doc_number] => 20150357308 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-10 [patent_title] => 'CHIP-ON-FILM (COF) TAPE AND CORRESPONDING COF BONDING METHOD' [patent_app_type] => utility [patent_app_number] => 14/235808 [patent_app_country] => US [patent_app_date] => 2013-11-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4723 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14235808 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/235808
Chip-on-film (COF) tape and corresponding COF bonding method Nov 26, 2013 Issued
Array ( [id] => 9370393 [patent_doc_number] => 20140080266 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-03-20 [patent_title] => 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/081697 [patent_app_country] => US [patent_app_date] => 2013-11-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 7306 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14081697 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/081697
Semiconductor package and method of manufacturing the same Nov 14, 2013 Issued
Array ( [id] => 10086204 [patent_doc_number] => 09123555 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-09-01 [patent_title] => 'Co-support for XFD packaging' [patent_app_type] => utility [patent_app_number] => 14/063119 [patent_app_country] => US [patent_app_date] => 2013-10-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 19 [patent_no_of_words] => 17006 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 208 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14063119 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/063119
Co-support for XFD packaging Oct 24, 2013 Issued
Array ( [id] => 9316585 [patent_doc_number] => 20140048923 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-02-20 [patent_title] => 'Semiconductor Package for High Power Devices' [patent_app_type] => utility [patent_app_number] => 14/062670 [patent_app_country] => US [patent_app_date] => 2013-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 5811 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14062670 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/062670
Semiconductor package for high power devices Oct 23, 2013 Issued
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