Jane T. Fan

Array ( [id] => 18439929 [patent_doc_number] => 20230187224 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-15 [patent_title] => SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/106225 [patent_app_country] => US [patent_app_date] => 2023-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4975 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18106225 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18419176 [patent_doc_number] => 20230173636 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-08 [patent_title] => METHOD FOR POLISHING SUBSTRATE INCLUDING FUNCTIONAL CHIP [patent_app_type] => utility [patent_app_number] => 18/161707 [patent_app_country] => US [patent_app_date] => 2023-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10622 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -4 [patent_words_short_claim] => 21 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18161707 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19206253 [patent_doc_number] => 20240178152 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-30 [patent_title] => METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK [patent_app_type] => utility [patent_app_number] => 18/099715 [patent_app_country] => US [patent_app_date] => 2023-01-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4726 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18099715 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19858254 [patent_doc_number] => 12261105 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-03-25 [patent_title] => Semiconductor package [patent_app_type] => utility [patent_app_number] => 18/098158 [patent_app_country] => US [patent_app_date] => 2023-01-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 26 [patent_no_of_words] => 9189 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18098158 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19176135 [patent_doc_number] => 20240162109 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-16 [patent_title] => Package with Improved Heat Dissipation Efficiency and Method for Forming the Same [patent_app_type] => utility [patent_app_number] => 18/152615 [patent_app_country] => US [patent_app_date] => 2023-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9778 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18152615 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18408984 [patent_doc_number] => 20230170337 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-01 [patent_title] => TRANSIENT-SUBSTRATE ASSEMBLY AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/152496 [patent_app_country] => US [patent_app_date] => 2023-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8871 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18152496 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19305820 [patent_doc_number] => 20240234400 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-11 [patent_title] => INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/152453 [patent_app_country] => US [patent_app_date] => 2023-01-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15190 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18152453 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19305630 [patent_doc_number] => 20240234210 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-07-11 [patent_title] => INTEGRATED CIRCUIT PACKAGES AND METHODS [patent_app_type] => utility [patent_app_number] => 18/151643 [patent_app_country] => US [patent_app_date] => 2023-01-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8618 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18151643 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20405662 [patent_doc_number] => 12495653 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-09 [patent_title] => Display device, method of manufacturing the same, and tiled display device including the same [patent_app_type] => utility [patent_app_number] => 18/093499 [patent_app_country] => US [patent_app_date] => 2023-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 9976 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18093499 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19038278 [patent_doc_number] => 20240088093 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => Integrated Circuit Packages and Methods of Forming the Same [patent_app_type] => utility [patent_app_number] => 18/149793 [patent_app_country] => US [patent_app_date] => 2023-01-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12310 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18149793 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19054879 [patent_doc_number] => 20240096848 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-21 [patent_title] => INTEGRATED CIRCUIT PACKAGE AND METHOD [patent_app_type] => utility [patent_app_number] => 18/149806 [patent_app_country] => US [patent_app_date] => 2023-01-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8346 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18149806 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20675530 [patent_doc_number] => 12616065 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-04-28 [patent_title] => Semiconductor package with interposer including recess [patent_app_type] => utility [patent_app_number] => 18/091072 [patent_app_country] => US [patent_app_date] => 2022-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 17 [patent_no_of_words] => 3298 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 121 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18091072 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18488851 [patent_doc_number] => 20230216201 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-06 [patent_title] => SEMICONDUCTOR PACKAGE INCLUDING ANTENNA AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/145047 [patent_app_country] => US [patent_app_date] => 2022-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 19025 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18145047 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19720379 [patent_doc_number] => 12205923 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-21 [patent_title] => Semiconductor device, circuit board structure and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 18/086545 [patent_app_country] => US [patent_app_date] => 2022-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 19 [patent_no_of_words] => 5343 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18086545 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18337632 [patent_doc_number] => 20230129581 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => PLASMONIC OLEDs AND VERTICAL DIPOLE EMITTERS [patent_app_type] => utility [patent_app_number] => 18/083809 [patent_app_country] => US [patent_app_date] => 2022-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 31490 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18083809 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18473211 [patent_doc_number] => 20230207499 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE HAVING ANTENNA ARRAY [patent_app_type] => utility [patent_app_number] => 18/067221 [patent_app_country] => US [patent_app_date] => 2022-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6085 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18067221 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20360155 [patent_doc_number] => 12476160 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-11-18 [patent_title] => Semiconductor package and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 18/067060 [patent_app_country] => US [patent_app_date] => 2022-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 14 [patent_no_of_words] => 2297 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 197 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18067060 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18323000 [patent_doc_number] => 20230121128 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-20 [patent_title] => PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME [patent_app_type] => utility [patent_app_number] => 18/081900 [patent_app_country] => US [patent_app_date] => 2022-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8534 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18081900 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20675499 [patent_doc_number] => 12616034 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-04-28 [patent_title] => Carrier structure [patent_app_type] => utility [patent_app_number] => 18/063426 [patent_app_country] => US [patent_app_date] => 2022-12-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 0 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18063426 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18424006 [patent_doc_number] => 20230178470 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-08 [patent_title] => SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/074007 [patent_app_country] => US [patent_app_date] => 2022-12-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10712 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18074007 [rel_patent_id] =>[rel_patent_doc_number] =>)