Jasmine Jhihan B Clark

Array ( [id] => 3621614 [patent_doc_number] => 05566054 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-10-15 [patent_title] => 'Outside-insulated electronic element of cubic chip type storable in a disk package' [patent_app_type] => 1 [patent_app_number] => 8/498599 [patent_app_country] => US [patent_app_date] => 1995-07-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 1414 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/566/05566054.pdf [firstpage_image] =>[orig_patent_app_number] => 498599 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3857414 [patent_doc_number] => 05719748 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-02-17 [patent_title] => 'Semiconductor package with a bridge for chip area connection' [patent_app_type] => 1 [patent_app_number] => 8/495138 [patent_app_country] => US [patent_app_date] => 1995-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1030 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/719/05719748.pdf [firstpage_image] =>[orig_patent_app_number] => 495138 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 4039145 [patent_doc_number] => RE036077 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1999-02-02 [patent_title] => 'Method of manufacturing inversion type IC\'s and IC module using same' [patent_app_type] => 2 [patent_app_number] => 8/494065 [patent_app_country] => US [patent_app_date] => 1995-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 19 [patent_no_of_words] => 4208 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 15 [patent_words_short_claim] => 356 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/RE/036/RE036077.pdf [firstpage_image] =>[orig_patent_app_number] => 494065 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3632003 [patent_doc_number] => 05612855 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-03-18 [patent_title] => 'Adapter for mounting on a circuit board' [patent_app_type] => 1 [patent_app_number] => 8/489336 [patent_app_country] => US [patent_app_date] => 1995-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 2761 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 256 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/612/05612855.pdf [firstpage_image] =>[orig_patent_app_number] => 489336 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3911622 [patent_doc_number] => 05751553 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-05-12 [patent_title] => 'Thin multichip module including a connector frame socket having first and second apertures' [patent_app_type] => 1 [patent_app_number] => 8/472532 [patent_app_country] => US [patent_app_date] => 1995-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 36 [patent_figures_cnt] => 56 [patent_no_of_words] => 16777 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/751/05751553.pdf [firstpage_image] =>[orig_patent_app_number] => 472532 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3889242 [patent_doc_number] => 05729437 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1998-03-17 [patent_title] => 'Electronic part including a thin body of molding resin' [patent_app_type] => 1 [patent_app_number] => 8/466020 [patent_app_country] => US [patent_app_date] => 1995-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 30 [patent_no_of_words] => 14921 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/729/05729437.pdf [firstpage_image] =>[orig_patent_app_number] => 466020 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3595665 [patent_doc_number] => 05552966 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-09-03 [patent_title] => 'Semiconductor device having an interconnecting circuit board and method for manufacturing same' [patent_app_type] => 1 [patent_app_number] => 8/460559 [patent_app_country] => US [patent_app_date] => 1995-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 38 [patent_no_of_words] => 6132 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/552/05552966.pdf [firstpage_image] =>[orig_patent_app_number] => 460559 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3711686 [patent_doc_number] => 05646830 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-07-08 [patent_title] => 'Semiconductor device having an interconnecting circuit board' [patent_app_type] => 1 [patent_app_number] => 8/460792 [patent_app_country] => US [patent_app_date] => 1995-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 38 [patent_no_of_words] => 6133 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/646/05646830.pdf [firstpage_image] =>[orig_patent_app_number] => 460792 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3597236 [patent_doc_number] => 05497291 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-03-05 [patent_title] => 'Power semiconductor device including terminal plates located between two substrates that functions as electrical connectors and mechanical supports' [patent_app_type] => 1 [patent_app_number] => 8/456925 [patent_app_country] => US [patent_app_date] => 1995-06-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 1744 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 140 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/497/05497291.pdf [firstpage_image] =>[orig_patent_app_number] => 456925 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3711671 [patent_doc_number] => 05646829 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-07-08 [patent_title] => 'Resin sealing type semiconductor device having fixed inner leads' [patent_app_type] => 1 [patent_app_number] => 8/455626 [patent_app_country] => US [patent_app_date] => 1995-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 15 [patent_no_of_words] => 3704 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/646/05646829.pdf [firstpage_image] =>[orig_patent_app_number] => 455626 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3635500 [patent_doc_number] => 05621619 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1997-04-15 [patent_title] => 'All ceramic surface mount sip and dip networks having spacers and solder barriers' [patent_app_type] => 1 [patent_app_number] => 8/445237 [patent_app_country] => US [patent_app_date] => 1995-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 3385 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/621/05621619.pdf [firstpage_image] =>[orig_patent_app_number] => 445237 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 3562305 [patent_doc_number] => 05574630 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 1996-11-12 [patent_title] => 'Laminated electronic package including a power/ground assembly' [patent_app_type] => 1 [patent_app_number] => 8/438952 [patent_app_country] => US [patent_app_date] => 1995-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 5873 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 373 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/05/574/05574630.pdf [firstpage_image] =>[orig_patent_app_number] => 438952 [rel_patent_id] =>[rel_patent_doc_number] =>)