
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 664119
[patent_doc_number] => 07102211
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-09-05
[patent_title] => 'Semiconductor device and hybrid integrated circuit device'
[patent_app_type] => utility
[patent_app_number] => 10/881561
[patent_app_country] => US
[patent_app_date] => 2004-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 12
[patent_no_of_words] => 3873
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 70
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/102/07102211.pdf
[firstpage_image] =>[orig_patent_app_number] => 10881561
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/881561 | Semiconductor device and hybrid integrated circuit device | Jun 29, 2004 | Issued |
Array
(
[id] => 7061303
[patent_doc_number] => 20050003664
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-01-06
[patent_title] => 'Method and apparatus for low temperature copper to copper bonding'
[patent_app_type] => utility
[patent_app_number] => 10/861030
[patent_app_country] => US
[patent_app_date] => 2004-06-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 4724
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0003/20050003664.pdf
[firstpage_image] =>[orig_patent_app_number] => 10861030
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/861030 | Method and apparatus for low temperature copper to copper bonding | Jun 3, 2004 | Issued |
Array
(
[id] => 443747
[patent_doc_number] => 07256491
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-08-14
[patent_title] => 'Thermal interconnect systems methods of production and uses thereof'
[patent_app_type] => utility
[patent_app_number] => 10/538821
[patent_app_country] => US
[patent_app_date] => 2004-06-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4683
[patent_no_of_claims] => 34
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 22
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/256/07256491.pdf
[firstpage_image] =>[orig_patent_app_number] => 10538821
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/538821 | Thermal interconnect systems methods of production and uses thereof | Jun 3, 2004 | Issued |
Array
(
[id] => 979374
[patent_doc_number] => 06930380
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-08-16
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 10/860072
[patent_app_country] => US
[patent_app_date] => 2004-06-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 43
[patent_figures_cnt] => 63
[patent_no_of_words] => 12951
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 90
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/930/06930380.pdf
[firstpage_image] =>[orig_patent_app_number] => 10860072
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/860072 | Semiconductor device | Jun 3, 2004 | Issued |
Array
(
[id] => 7363385
[patent_doc_number] => 20040217469
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-11-04
[patent_title] => 'Package structure with increased capacitance and method'
[patent_app_type] => new
[patent_app_number] => 10/857391
[patent_app_country] => US
[patent_app_date] => 2004-05-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 3668
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 3
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0217/20040217469.pdf
[firstpage_image] =>[orig_patent_app_number] => 10857391
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/857391 | Package structure with increased capacitance and method | May 27, 2004 | Issued |
Array
(
[id] => 7120340
[patent_doc_number] => 20050012169
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-01-20
[patent_title] => 'Semiconductor device and manufacturing method of the same'
[patent_app_type] => utility
[patent_app_number] => 10/855972
[patent_app_country] => US
[patent_app_date] => 2004-05-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3642
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0012/20050012169.pdf
[firstpage_image] =>[orig_patent_app_number] => 10855972
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/855972 | Semiconductor device and manufacturing method of the same | May 27, 2004 | Issued |
Array
(
[id] => 813994
[patent_doc_number] => 07414269
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-08-19
[patent_title] => 'Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component'
[patent_app_type] => utility
[patent_app_number] => 10/558461
[patent_app_country] => US
[patent_app_date] => 2004-05-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 5
[patent_no_of_words] => 2163
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 87
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/414/07414269.pdf
[firstpage_image] =>[orig_patent_app_number] => 10558461
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/558461 | Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component | May 27, 2004 | Issued |
Array
(
[id] => 767297
[patent_doc_number] => 07009306
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-03-07
[patent_title] => 'Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument'
[patent_app_type] => utility
[patent_app_number] => 10/853252
[patent_app_country] => US
[patent_app_date] => 2004-05-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 10
[patent_no_of_words] => 5106
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 126
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/009/07009306.pdf
[firstpage_image] =>[orig_patent_app_number] => 10853252
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/853252 | Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument | May 25, 2004 | Issued |
Array
(
[id] => 746653
[patent_doc_number] => 07026699
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-04-11
[patent_title] => 'Semiconductor device and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 10/853662
[patent_app_country] => US
[patent_app_date] => 2004-05-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 26
[patent_figures_cnt] => 26
[patent_no_of_words] => 14340
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 6
[patent_words_short_claim] => 68
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/026/07026699.pdf
[firstpage_image] =>[orig_patent_app_number] => 10853662
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/853662 | Semiconductor device and method for fabricating the same | May 25, 2004 | Issued |
Array
(
[id] => 7291852
[patent_doc_number] => 20040212089
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-10-28
[patent_title] => 'Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped'
[patent_app_type] => new
[patent_app_number] => 10/852142
[patent_app_country] => US
[patent_app_date] => 2004-05-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 3243
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 3
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0212/20040212089.pdf
[firstpage_image] =>[orig_patent_app_number] => 10852142
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/852142 | Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped | May 24, 2004 | Issued |
Array
(
[id] => 7206373
[patent_doc_number] => 20050258521
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-11-24
[patent_title] => 'LEADLESS LEADFRAME WITH AN IMPROVED DIE PAD FOR MOLD LOCKING'
[patent_app_type] => utility
[patent_app_number] => 10/851112
[patent_app_country] => US
[patent_app_date] => 2004-05-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 2352
[patent_no_of_claims] => 28
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0258/20050258521.pdf
[firstpage_image] =>[orig_patent_app_number] => 10851112
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/851112 | Leadless leadframe with an improved die pad for mold locking | May 23, 2004 | Issued |
Array
(
[id] => 696382
[patent_doc_number] => 07071576
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-07-04
[patent_title] => 'Semiconductor device and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 10/846672
[patent_app_country] => US
[patent_app_date] => 2004-05-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 12
[patent_no_of_words] => 6157
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 51
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/071/07071576.pdf
[firstpage_image] =>[orig_patent_app_number] => 10846672
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/846672 | Semiconductor device and method of manufacturing the same | May 16, 2004 | Issued |
Array
(
[id] => 436251
[patent_doc_number] => 07262509
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-08-28
[patent_title] => 'Microelectronic assembly having a perimeter around a MEMS device'
[patent_app_type] => utility
[patent_app_number] => 10/843885
[patent_app_country] => US
[patent_app_date] => 2004-05-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 14
[patent_no_of_words] => 3322
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 85
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/262/07262509.pdf
[firstpage_image] =>[orig_patent_app_number] => 10843885
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/843885 | Microelectronic assembly having a perimeter around a MEMS device | May 10, 2004 | Issued |
Array
(
[id] => 7411837
[patent_doc_number] => 20040207061
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-10-21
[patent_title] => 'Multi-chip electronic package and cooling system'
[patent_app_type] => new
[patent_app_number] => 10/841882
[patent_app_country] => US
[patent_app_date] => 2004-05-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 5652
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 55
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0207/20040207061.pdf
[firstpage_image] =>[orig_patent_app_number] => 10841882
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/841882 | Multi-chip electronic package and cooling system | May 6, 2004 | Issued |
Array
(
[id] => 968885
[patent_doc_number] => 06940162
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-09-06
[patent_title] => 'Semiconductor module and mounting method for same'
[patent_app_type] => utility
[patent_app_number] => 10/840605
[patent_app_country] => US
[patent_app_date] => 2004-05-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 52
[patent_no_of_words] => 9289
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 82
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/940/06940162.pdf
[firstpage_image] =>[orig_patent_app_number] => 10840605
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/840605 | Semiconductor module and mounting method for same | May 6, 2004 | Issued |
Array
(
[id] => 7314328
[patent_doc_number] => 20040222503
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-11-11
[patent_title] => 'Multi-chip package with electrical interconnection'
[patent_app_type] => new
[patent_app_number] => 10/838351
[patent_app_country] => US
[patent_app_date] => 2004-05-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2738
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 115
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0222/20040222503.pdf
[firstpage_image] =>[orig_patent_app_number] => 10838351
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/838351 | Multi-chip package with electrical interconnection | May 4, 2004 | Issued |
Array
(
[id] => 673054
[patent_doc_number] => 07091601
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2006-08-15
[patent_title] => 'Method of fabricating an apparatus including a sealed cavity'
[patent_app_type] => utility
[patent_app_number] => 10/837261
[patent_app_country] => US
[patent_app_date] => 2004-04-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 10
[patent_no_of_words] => 4910
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 66
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/091/07091601.pdf
[firstpage_image] =>[orig_patent_app_number] => 10837261
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/837261 | Method of fabricating an apparatus including a sealed cavity | Apr 29, 2004 | Issued |
Array
(
[id] => 7323476
[patent_doc_number] => 20040251529
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2004-12-16
[patent_title] => 'Multi-chip ball grid array package'
[patent_app_type] => new
[patent_app_number] => 10/828792
[patent_app_country] => US
[patent_app_date] => 2004-04-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 21
[patent_no_of_words] => 13523
[patent_no_of_claims] => 36
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 52
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0251/20040251529.pdf
[firstpage_image] =>[orig_patent_app_number] => 10828792
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/828792 | Multi-chip ball grid array package | Apr 19, 2004 | Issued |
Array
(
[id] => 972696
[patent_doc_number] => 06936918
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-08-30
[patent_title] => 'MEMS device with conductive path through substrate'
[patent_app_type] => utility
[patent_app_number] => 10/827680
[patent_app_country] => US
[patent_app_date] => 2004-04-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 7
[patent_no_of_words] => 4003
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 62
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/936/06936918.pdf
[firstpage_image] =>[orig_patent_app_number] => 10827680
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/827680 | MEMS device with conductive path through substrate | Apr 18, 2004 | Issued |
Array
(
[id] => 833848
[patent_doc_number] => 07397139
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-07-08
[patent_title] => 'Epoxy resin molding material for sealing use and semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 10/552441
[patent_app_country] => US
[patent_app_date] => 2004-04-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 4
[patent_no_of_words] => 30246
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 51
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/397/07397139.pdf
[firstpage_image] =>[orig_patent_app_number] => 10552441
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/552441 | Epoxy resin molding material for sealing use and semiconductor device | Apr 6, 2004 | Issued |