Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 664119 [patent_doc_number] => 07102211 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-09-05 [patent_title] => 'Semiconductor device and hybrid integrated circuit device' [patent_app_type] => utility [patent_app_number] => 10/881561 [patent_app_country] => US [patent_app_date] => 2004-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 3873 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/102/07102211.pdf [firstpage_image] =>[orig_patent_app_number] => 10881561 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/881561
Semiconductor device and hybrid integrated circuit device Jun 29, 2004 Issued
Array ( [id] => 7061303 [patent_doc_number] => 20050003664 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-06 [patent_title] => 'Method and apparatus for low temperature copper to copper bonding' [patent_app_type] => utility [patent_app_number] => 10/861030 [patent_app_country] => US [patent_app_date] => 2004-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 4724 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0003/20050003664.pdf [firstpage_image] =>[orig_patent_app_number] => 10861030 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/861030
Method and apparatus for low temperature copper to copper bonding Jun 3, 2004 Issued
Array ( [id] => 443747 [patent_doc_number] => 07256491 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-08-14 [patent_title] => 'Thermal interconnect systems methods of production and uses thereof' [patent_app_type] => utility [patent_app_number] => 10/538821 [patent_app_country] => US [patent_app_date] => 2004-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4683 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 22 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/256/07256491.pdf [firstpage_image] =>[orig_patent_app_number] => 10538821 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/538821
Thermal interconnect systems methods of production and uses thereof Jun 3, 2004 Issued
Array ( [id] => 979374 [patent_doc_number] => 06930380 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-08-16 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/860072 [patent_app_country] => US [patent_app_date] => 2004-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 43 [patent_figures_cnt] => 63 [patent_no_of_words] => 12951 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/930/06930380.pdf [firstpage_image] =>[orig_patent_app_number] => 10860072 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/860072
Semiconductor device Jun 3, 2004 Issued
Array ( [id] => 7363385 [patent_doc_number] => 20040217469 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-11-04 [patent_title] => 'Package structure with increased capacitance and method' [patent_app_type] => new [patent_app_number] => 10/857391 [patent_app_country] => US [patent_app_date] => 2004-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3668 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 3 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0217/20040217469.pdf [firstpage_image] =>[orig_patent_app_number] => 10857391 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/857391
Package structure with increased capacitance and method May 27, 2004 Issued
Array ( [id] => 7120340 [patent_doc_number] => 20050012169 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-01-20 [patent_title] => 'Semiconductor device and manufacturing method of the same' [patent_app_type] => utility [patent_app_number] => 10/855972 [patent_app_country] => US [patent_app_date] => 2004-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3642 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20050012169.pdf [firstpage_image] =>[orig_patent_app_number] => 10855972 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/855972
Semiconductor device and manufacturing method of the same May 27, 2004 Issued
Array ( [id] => 813994 [patent_doc_number] => 07414269 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-08-19 [patent_title] => 'Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component' [patent_app_type] => utility [patent_app_number] => 10/558461 [patent_app_country] => US [patent_app_date] => 2004-05-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 2163 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/414/07414269.pdf [firstpage_image] =>[orig_patent_app_number] => 10558461 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/558461
Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component May 27, 2004 Issued
Array ( [id] => 767297 [patent_doc_number] => 07009306 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-03-07 [patent_title] => 'Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument' [patent_app_type] => utility [patent_app_number] => 10/853252 [patent_app_country] => US [patent_app_date] => 2004-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 5106 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/009/07009306.pdf [firstpage_image] =>[orig_patent_app_number] => 10853252 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/853252
Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument May 25, 2004 Issued
Array ( [id] => 746653 [patent_doc_number] => 07026699 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-04-11 [patent_title] => 'Semiconductor device and method for fabricating the same' [patent_app_type] => utility [patent_app_number] => 10/853662 [patent_app_country] => US [patent_app_date] => 2004-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 26 [patent_no_of_words] => 14340 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/026/07026699.pdf [firstpage_image] =>[orig_patent_app_number] => 10853662 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/853662
Semiconductor device and method for fabricating the same May 25, 2004 Issued
Array ( [id] => 7291852 [patent_doc_number] => 20040212089 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-10-28 [patent_title] => 'Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped' [patent_app_type] => new [patent_app_number] => 10/852142 [patent_app_country] => US [patent_app_date] => 2004-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 3243 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 3 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0212/20040212089.pdf [firstpage_image] =>[orig_patent_app_number] => 10852142 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/852142
Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped May 24, 2004 Issued
Array ( [id] => 7206373 [patent_doc_number] => 20050258521 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-11-24 [patent_title] => 'LEADLESS LEADFRAME WITH AN IMPROVED DIE PAD FOR MOLD LOCKING' [patent_app_type] => utility [patent_app_number] => 10/851112 [patent_app_country] => US [patent_app_date] => 2004-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2352 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0258/20050258521.pdf [firstpage_image] =>[orig_patent_app_number] => 10851112 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/851112
Leadless leadframe with an improved die pad for mold locking May 23, 2004 Issued
Array ( [id] => 696382 [patent_doc_number] => 07071576 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-07-04 [patent_title] => 'Semiconductor device and method of manufacturing the same' [patent_app_type] => utility [patent_app_number] => 10/846672 [patent_app_country] => US [patent_app_date] => 2004-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 6157 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/071/07071576.pdf [firstpage_image] =>[orig_patent_app_number] => 10846672 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/846672
Semiconductor device and method of manufacturing the same May 16, 2004 Issued
Array ( [id] => 436251 [patent_doc_number] => 07262509 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2007-08-28 [patent_title] => 'Microelectronic assembly having a perimeter around a MEMS device' [patent_app_type] => utility [patent_app_number] => 10/843885 [patent_app_country] => US [patent_app_date] => 2004-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 3322 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/262/07262509.pdf [firstpage_image] =>[orig_patent_app_number] => 10843885 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/843885
Microelectronic assembly having a perimeter around a MEMS device May 10, 2004 Issued
Array ( [id] => 7411837 [patent_doc_number] => 20040207061 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-10-21 [patent_title] => 'Multi-chip electronic package and cooling system' [patent_app_type] => new [patent_app_number] => 10/841882 [patent_app_country] => US [patent_app_date] => 2004-05-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5652 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0207/20040207061.pdf [firstpage_image] =>[orig_patent_app_number] => 10841882 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/841882
Multi-chip electronic package and cooling system May 6, 2004 Issued
Array ( [id] => 968885 [patent_doc_number] => 06940162 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-09-06 [patent_title] => 'Semiconductor module and mounting method for same' [patent_app_type] => utility [patent_app_number] => 10/840605 [patent_app_country] => US [patent_app_date] => 2004-05-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 52 [patent_no_of_words] => 9289 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/940/06940162.pdf [firstpage_image] =>[orig_patent_app_number] => 10840605 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/840605
Semiconductor module and mounting method for same May 6, 2004 Issued
Array ( [id] => 7314328 [patent_doc_number] => 20040222503 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-11-11 [patent_title] => 'Multi-chip package with electrical interconnection' [patent_app_type] => new [patent_app_number] => 10/838351 [patent_app_country] => US [patent_app_date] => 2004-05-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2738 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 115 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0222/20040222503.pdf [firstpage_image] =>[orig_patent_app_number] => 10838351 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/838351
Multi-chip package with electrical interconnection May 4, 2004 Issued
Array ( [id] => 673054 [patent_doc_number] => 07091601 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-08-15 [patent_title] => 'Method of fabricating an apparatus including a sealed cavity' [patent_app_type] => utility [patent_app_number] => 10/837261 [patent_app_country] => US [patent_app_date] => 2004-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 4910 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/091/07091601.pdf [firstpage_image] =>[orig_patent_app_number] => 10837261 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/837261
Method of fabricating an apparatus including a sealed cavity Apr 29, 2004 Issued
Array ( [id] => 7323476 [patent_doc_number] => 20040251529 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-12-16 [patent_title] => 'Multi-chip ball grid array package' [patent_app_type] => new [patent_app_number] => 10/828792 [patent_app_country] => US [patent_app_date] => 2004-04-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 21 [patent_no_of_words] => 13523 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0251/20040251529.pdf [firstpage_image] =>[orig_patent_app_number] => 10828792 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/828792
Multi-chip ball grid array package Apr 19, 2004 Issued
Array ( [id] => 972696 [patent_doc_number] => 06936918 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-08-30 [patent_title] => 'MEMS device with conductive path through substrate' [patent_app_type] => utility [patent_app_number] => 10/827680 [patent_app_country] => US [patent_app_date] => 2004-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 4003 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/936/06936918.pdf [firstpage_image] =>[orig_patent_app_number] => 10827680 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/827680
MEMS device with conductive path through substrate Apr 18, 2004 Issued
Array ( [id] => 833848 [patent_doc_number] => 07397139 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-07-08 [patent_title] => 'Epoxy resin molding material for sealing use and semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/552441 [patent_app_country] => US [patent_app_date] => 2004-04-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 30246 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 51 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/397/07397139.pdf [firstpage_image] =>[orig_patent_app_number] => 10552441 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/552441
Epoxy resin molding material for sealing use and semiconductor device Apr 6, 2004 Issued
Menu