Search

Jasmine Jhihan B. Clark

Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )

Most Active Art Unit
2815
Art Unit(s)
2815, 2899, 3621, 2816, 2503
Total Applications
3065
Issued Applications
2831
Pending Applications
98
Abandoned Applications
163

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 931401 [patent_doc_number] => 06979905 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-12-27 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/762242 [patent_app_country] => US [patent_app_date] => 2004-01-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 10332 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/979/06979905.pdf [firstpage_image] =>[orig_patent_app_number] => 10762242 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/762242
Semiconductor device Jan 22, 2004 Issued
Array ( [id] => 5849718 [patent_doc_number] => 20060232909 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2006-10-19 [patent_title] => 'Embedded capacitor associated with an sram cell' [patent_app_type] => utility [patent_app_number] => 10/542041 [patent_app_country] => US [patent_app_date] => 2004-01-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3984 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0232/20060232909.pdf [firstpage_image] =>[orig_patent_app_number] => 10542041 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/542041
Embedded capacitor Jan 11, 2004 Issued
Array ( [id] => 7375567 [patent_doc_number] => 20040178486 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-09-16 [patent_title] => 'Electronic component device and manufacturing method therefor' [patent_app_type] => new [patent_app_number] => 10/752521 [patent_app_country] => US [patent_app_date] => 2004-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5166 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0178/20040178486.pdf [firstpage_image] =>[orig_patent_app_number] => 10752521 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/752521
Electronic component device and manufacturing method therefor Jan 7, 2004 Issued
Array ( [id] => 1063750 [patent_doc_number] => 06849941 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-02-01 [patent_title] => 'Heat sink and heat spreader assembly' [patent_app_type] => utility [patent_app_number] => 10/752612 [patent_app_country] => US [patent_app_date] => 2004-01-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 2479 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/849/06849941.pdf [firstpage_image] =>[orig_patent_app_number] => 10752612 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/752612
Heat sink and heat spreader assembly Jan 6, 2004 Issued
Array ( [id] => 7260287 [patent_doc_number] => 20040150078 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-08-05 [patent_title] => 'Resin molded type semiconductor device and a method of manufacturing the same' [patent_app_type] => new [patent_app_number] => 10/747982 [patent_app_country] => US [patent_app_date] => 2003-12-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5850 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 9 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0150/20040150078.pdf [firstpage_image] =>[orig_patent_app_number] => 10747982 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/747982
Resin molded type semiconductor device and a method of manufacturing the same Dec 30, 2003 Issued
Array ( [id] => 7421309 [patent_doc_number] => 20040183190 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-09-23 [patent_title] => 'Multi-chips stacked package' [patent_app_type] => new [patent_app_number] => 10/747131 [patent_app_country] => US [patent_app_date] => 2003-12-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 1894 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0183/20040183190.pdf [firstpage_image] =>[orig_patent_app_number] => 10747131 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/747131
Multi-chips stacked package Dec 29, 2003 Abandoned
Array ( [id] => 6981176 [patent_doc_number] => 20050151244 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-07-14 [patent_title] => 'Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon' [patent_app_type] => utility [patent_app_number] => 10/749901 [patent_app_country] => US [patent_app_date] => 2003-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 4195 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0151/20050151244.pdf [firstpage_image] =>[orig_patent_app_number] => 10749901 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/749901
Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon Dec 28, 2003 Issued
Array ( [id] => 889190 [patent_doc_number] => 07348680 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2008-03-25 [patent_title] => 'Electronic device and use thereof' [patent_app_type] => utility [patent_app_number] => 10/540182 [patent_app_country] => US [patent_app_date] => 2003-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 6 [patent_no_of_words] => 3028 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 230 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/348/07348680.pdf [firstpage_image] =>[orig_patent_app_number] => 10540182 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/540182
Electronic device and use thereof Dec 21, 2003 Issued
Array ( [id] => 790863 [patent_doc_number] => 06984887 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-01-10 [patent_title] => 'Heatsink arrangement for semiconductor device' [patent_app_type] => utility [patent_app_number] => 10/741472 [patent_app_country] => US [patent_app_date] => 2003-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 4033 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/984/06984887.pdf [firstpage_image] =>[orig_patent_app_number] => 10741472 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/741472
Heatsink arrangement for semiconductor device Dec 17, 2003 Issued
Array ( [id] => 6994130 [patent_doc_number] => 20050133906 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-23 [patent_title] => 'Thermally enhanced semiconductor package' [patent_app_type] => utility [patent_app_number] => 10/740322 [patent_app_country] => US [patent_app_date] => 2003-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3413 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0133/20050133906.pdf [firstpage_image] =>[orig_patent_app_number] => 10740322 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/740322
Thermally enhanced semiconductor package Dec 17, 2003 Issued
Array ( [id] => 7415329 [patent_doc_number] => 20040159954 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-08-19 [patent_title] => 'Electronic device having a stack of semiconductor chips and method for the production thereof' [patent_app_type] => new [patent_app_number] => 10/738071 [patent_app_country] => US [patent_app_date] => 2003-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5792 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 226 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0159/20040159954.pdf [firstpage_image] =>[orig_patent_app_number] => 10738071 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/738071
Electronic device having a stack of semiconductor chips and method for the production thereof Dec 16, 2003 Issued
Array ( [id] => 4644949 [patent_doc_number] => 08022556 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-09-20 [patent_title] => 'Electrical component having a reduced substrate area' [patent_app_type] => utility [patent_app_number] => 10/542841 [patent_app_country] => US [patent_app_date] => 2003-12-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 24 [patent_no_of_words] => 9035 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/022/08022556.pdf [firstpage_image] =>[orig_patent_app_number] => 10542841 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/542841
Electrical component having a reduced substrate area Dec 15, 2003 Issued
Array ( [id] => 738996 [patent_doc_number] => 07034393 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2006-04-25 [patent_title] => 'Semiconductor assembly with conductive rim and method of producing the same' [patent_app_type] => utility [patent_app_number] => 10/737231 [patent_app_country] => US [patent_app_date] => 2003-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3165 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/034/07034393.pdf [firstpage_image] =>[orig_patent_app_number] => 10737231 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/737231
Semiconductor assembly with conductive rim and method of producing the same Dec 14, 2003 Issued
Array ( [id] => 7094885 [patent_doc_number] => 20050127488 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2005-06-16 [patent_title] => 'HYDROGEN DIFFUSION HYBRID PORT AND METHOD OF FORMING' [patent_app_type] => utility [patent_app_number] => 10/735221 [patent_app_country] => US [patent_app_date] => 2003-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5745 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20050127488.pdf [firstpage_image] =>[orig_patent_app_number] => 10735221 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/735221
Hydrogen diffusion hybrid port and method of forming Dec 11, 2003 Issued
Array ( [id] => 7173195 [patent_doc_number] => 20040200879 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-10-14 [patent_title] => 'Thermal interface material and solder preforms' [patent_app_type] => new [patent_app_number] => 10/722288 [patent_app_country] => US [patent_app_date] => 2003-11-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 6227 [patent_no_of_claims] => 43 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0200/20040200879.pdf [firstpage_image] =>[orig_patent_app_number] => 10722288 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/722288
Thermal interface material and solder preforms Nov 24, 2003 Issued
Array ( [id] => 1056962 [patent_doc_number] => 06856015 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-02-15 [patent_title] => 'Semiconductor package with heat sink' [patent_app_type] => utility [patent_app_number] => 10/719726 [patent_app_country] => US [patent_app_date] => 2003-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 23 [patent_no_of_words] => 4707 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/856/06856015.pdf [firstpage_image] =>[orig_patent_app_number] => 10719726 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/719726
Semiconductor package with heat sink Nov 20, 2003 Issued
Array ( [id] => 1002719 [patent_doc_number] => 06909176 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-06-21 [patent_title] => 'Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate' [patent_app_type] => utility [patent_app_number] => 10/719451 [patent_app_country] => US [patent_app_date] => 2003-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 5979 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/909/06909176.pdf [firstpage_image] =>[orig_patent_app_number] => 10719451 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/719451
Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate Nov 19, 2003 Issued
Array ( [id] => 7451868 [patent_doc_number] => 20040099950 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-05-27 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 10/714962 [patent_app_country] => US [patent_app_date] => 2003-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 6533 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0099/20040099950.pdf [firstpage_image] =>[orig_patent_app_number] => 10714962 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/714962
Semiconductor device Nov 17, 2003 Issued
Array ( [id] => 1015041 [patent_doc_number] => 06894385 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2005-05-17 [patent_title] => 'Integrated circuit package having bypass capacitors coupled to bottom of package substrate and supporting surface mounting technology' [patent_app_type] => utility [patent_app_number] => 10/717342 [patent_app_country] => US [patent_app_date] => 2003-11-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 2968 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 85 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/894/06894385.pdf [firstpage_image] =>[orig_patent_app_number] => 10717342 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/717342
Integrated circuit package having bypass capacitors coupled to bottom of package substrate and supporting surface mounting technology Nov 17, 2003 Issued
Array ( [id] => 954116 [patent_doc_number] => 06958531 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-10-25 [patent_title] => 'Multi-substrate package and method for assembling same' [patent_app_type] => utility [patent_app_number] => 10/713852 [patent_app_country] => US [patent_app_date] => 2003-11-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 21 [patent_no_of_words] => 5566 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/958/06958531.pdf [firstpage_image] =>[orig_patent_app_number] => 10713852 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/713852
Multi-substrate package and method for assembling same Nov 13, 2003 Issued
Menu