
Jasmine Jhihan B. Clark
Examiner (ID: 17130, Phone: (571)272-1726 , Office: P/2816 )
| Most Active Art Unit | 2815 |
| Art Unit(s) | 2815, 2899, 3621, 2816, 2503 |
| Total Applications | 3065 |
| Issued Applications | 2831 |
| Pending Applications | 98 |
| Abandoned Applications | 163 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 931401
[patent_doc_number] => 06979905
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-12-27
[patent_title] => 'Semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 10/762242
[patent_app_country] => US
[patent_app_date] => 2004-01-23
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[pdf_file] => patents/06/979/06979905.pdf
[firstpage_image] =>[orig_patent_app_number] => 10762242
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/762242 | Semiconductor device | Jan 22, 2004 | Issued |
Array
(
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[patent_doc_number] => 20060232909
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[patent_kind] => A1
[patent_issue_date] => 2006-10-19
[patent_title] => 'Embedded capacitor associated with an sram cell'
[patent_app_type] => utility
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[patent_app_date] => 2004-01-12
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/542041 | Embedded capacitor | Jan 11, 2004 | Issued |
Array
(
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[patent_doc_number] => 20040178486
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[patent_issue_date] => 2004-09-16
[patent_title] => 'Electronic component device and manufacturing method therefor'
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[patent_app_date] => 2004-01-08
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/752521 | Electronic component device and manufacturing method therefor | Jan 7, 2004 | Issued |
Array
(
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[patent_issue_date] => 2005-02-01
[patent_title] => 'Heat sink and heat spreader assembly'
[patent_app_type] => utility
[patent_app_number] => 10/752612
[patent_app_country] => US
[patent_app_date] => 2004-01-07
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/752612 | Heat sink and heat spreader assembly | Jan 6, 2004 | Issued |
Array
(
[id] => 7260287
[patent_doc_number] => 20040150078
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[patent_issue_date] => 2004-08-05
[patent_title] => 'Resin molded type semiconductor device and a method of manufacturing the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/747982 | Resin molded type semiconductor device and a method of manufacturing the same | Dec 30, 2003 | Issued |
Array
(
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[patent_title] => 'Multi-chips stacked package'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/747131 | Multi-chips stacked package | Dec 29, 2003 | Abandoned |
Array
(
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[patent_title] => 'Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon'
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Array
(
[id] => 889190
[patent_doc_number] => 07348680
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[patent_issue_date] => 2008-03-25
[patent_title] => 'Electronic device and use thereof'
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[patent_app_number] => 10/540182
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/540182 | Electronic device and use thereof | Dec 21, 2003 | Issued |
Array
(
[id] => 790863
[patent_doc_number] => 06984887
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[patent_kind] => B2
[patent_issue_date] => 2006-01-10
[patent_title] => 'Heatsink arrangement for semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 10/741472
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/741472 | Heatsink arrangement for semiconductor device | Dec 17, 2003 | Issued |
Array
(
[id] => 6994130
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[patent_title] => 'Thermally enhanced semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 10/740322
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[firstpage_image] =>[orig_patent_app_number] => 10740322
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/740322 | Thermally enhanced semiconductor package | Dec 17, 2003 | Issued |
Array
(
[id] => 7415329
[patent_doc_number] => 20040159954
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[patent_title] => 'Electronic device having a stack of semiconductor chips and method for the production thereof'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/738071 | Electronic device having a stack of semiconductor chips and method for the production thereof | Dec 16, 2003 | Issued |
Array
(
[id] => 4644949
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[patent_title] => 'Electrical component having a reduced substrate area'
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Array
(
[id] => 738996
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[patent_title] => 'Semiconductor assembly with conductive rim and method of producing the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/737231 | Semiconductor assembly with conductive rim and method of producing the same | Dec 14, 2003 | Issued |
Array
(
[id] => 7094885
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[patent_title] => 'HYDROGEN DIFFUSION HYBRID PORT AND METHOD OF FORMING'
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[firstpage_image] =>[orig_patent_app_number] => 10735221
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/735221 | Hydrogen diffusion hybrid port and method of forming | Dec 11, 2003 | Issued |
Array
(
[id] => 7173195
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/719726 | Semiconductor package with heat sink | Nov 20, 2003 | Issued |
Array
(
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Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/713852 | Multi-substrate package and method for assembling same | Nov 13, 2003 | Issued |